JP2024516540A5 - - Google Patents
Info
- Publication number
- JP2024516540A5 JP2024516540A5 JP2023561208A JP2023561208A JP2024516540A5 JP 2024516540 A5 JP2024516540 A5 JP 2024516540A5 JP 2023561208 A JP2023561208 A JP 2023561208A JP 2023561208 A JP2023561208 A JP 2023561208A JP 2024516540 A5 JP2024516540 A5 JP 2024516540A5
- Authority
- JP
- Japan
- Prior art keywords
- spiral coil
- conductive layers
- vias
- spiral
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/226,744 | 2021-04-09 | ||
| US17/226,744 US12051534B2 (en) | 2021-04-09 | 2021-04-09 | Three dimensional (3D) vertical spiral inductor and transformer |
| PCT/US2022/070566 WO2022217169A1 (en) | 2021-04-09 | 2022-02-08 | Three dimensional (3d) vertical spiral inductor and transformer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024516540A JP2024516540A (ja) | 2024-04-16 |
| JP2024516540A5 true JP2024516540A5 (enExample) | 2025-01-23 |
Family
ID=80461320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023561208A Pending JP2024516540A (ja) | 2021-04-09 | 2022-02-08 | 3次元(3d)垂直スパイラルインダクタおよび変圧器 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12051534B2 (enExample) |
| EP (1) | EP4320634A1 (enExample) |
| JP (1) | JP2024516540A (enExample) |
| KR (1) | KR20230169949A (enExample) |
| CN (1) | CN117063250A (enExample) |
| BR (1) | BR112023019892A2 (enExample) |
| TW (1) | TW202240614A (enExample) |
| WO (1) | WO2022217169A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12224253B2 (en) * | 2021-09-20 | 2025-02-11 | Intel Corporation | Magnetic inductor device and method |
| US12249618B2 (en) * | 2022-02-28 | 2025-03-11 | Analog Devices International Unlimited Company | Shaped metal edge for galvanic or capacitive isolator |
| CN118919219A (zh) * | 2024-08-13 | 2024-11-08 | 成都兴仁科技有限公司 | 一种三维立体pcb电感的结构 |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003051501A (ja) * | 2001-05-30 | 2003-02-21 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| US6667536B2 (en) * | 2001-06-28 | 2003-12-23 | Agere Systems Inc. | Thin film multi-layer high Q transformer formed in a semiconductor substrate |
| US6949442B2 (en) * | 2003-05-05 | 2005-09-27 | Infineon Technologies Ag | Methods of forming MIM capacitors |
| TWI226647B (en) * | 2003-06-11 | 2005-01-11 | Via Tech Inc | Inductor formed between two layout layers |
| US7253497B2 (en) | 2003-07-02 | 2007-08-07 | Lsi Corporation | Integrated circuit with inductor having horizontal magnetic flux lines |
| US6903644B2 (en) * | 2003-07-28 | 2005-06-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Inductor device having improved quality factor |
| JP4150689B2 (ja) * | 2004-03-29 | 2008-09-17 | 富士通株式会社 | 半導体集積回路装置内に形成された多層配線構造 |
| US7436281B2 (en) * | 2004-07-30 | 2008-10-14 | Texas Instruments Incorporated | Method to improve inductance with a high-permeability slotted plate core in an integrated circuit |
| KR100650907B1 (ko) * | 2005-12-29 | 2006-11-28 | 동부일렉트로닉스 주식회사 | 구리 금속으로 된 집적회로 인덕터 및 그 제조 방법 |
| US20080204183A1 (en) * | 2007-02-23 | 2008-08-28 | Infineon Technologies Ag | 3d-coil for saving area used by inductances |
| US7812424B2 (en) * | 2007-12-21 | 2010-10-12 | Infineon Technologies Ag | Moisture barrier capacitors in semiconductor components |
| US8101495B2 (en) * | 2008-03-13 | 2012-01-24 | Infineon Technologies Ag | MIM capacitors in semiconductor components |
| US8143987B2 (en) * | 2010-04-07 | 2012-03-27 | Xilinx, Inc. | Stacked dual inductor structure |
| JP2012222252A (ja) * | 2011-04-12 | 2012-11-12 | Renesas Electronics Corp | 半導体装置 |
| US9559053B2 (en) * | 2011-04-21 | 2017-01-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Compact vertical inductors extending in vertical planes |
| JP2013038138A (ja) * | 2011-08-04 | 2013-02-21 | Renesas Electronics Corp | 半導体装置 |
| US20140203404A1 (en) * | 2013-01-21 | 2014-07-24 | Qualcomm Incorporated | Spiral metal-on-metal (smom) capacitors, and related systems and methods |
| US8836079B2 (en) * | 2013-01-24 | 2014-09-16 | Qualcomm Incorporated | Metal-on-metal (MoM) capacitors having laterally displaced layers, and related systems and methods |
| US9373434B2 (en) * | 2013-06-20 | 2016-06-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Inductor assembly and method of using same |
| TW201532247A (zh) * | 2013-10-16 | 2015-08-16 | 康佛森智財管理公司 | 形成嵌入動態隨機存取記憶體電容器的成本效益佳的方法 |
| TW201545184A (zh) * | 2014-05-23 | 2015-12-01 | 力晶科技股份有限公司 | 電容器結構及其製造方法 |
| US9831171B2 (en) * | 2014-11-12 | 2017-11-28 | Infineon Technologies Ag | Capacitors with barrier dielectric layers, and methods of formation thereof |
| US10032711B2 (en) * | 2016-07-25 | 2018-07-24 | International Business Machines Corporation | Integrating metal-insulator-metal capacitors with air gap process flow |
| US10643782B2 (en) * | 2016-10-28 | 2020-05-05 | Delta Electronics (Shanghai) Co., Ltd. | Magnetic component and power module |
| US10559530B2 (en) * | 2017-12-27 | 2020-02-11 | International Business Machines Corporation | Forming dual metallization interconnect structures in single metallization level |
| US10686031B2 (en) * | 2018-03-27 | 2020-06-16 | Qualcomm Incorporated | Finger metal-oxide-metal (FMOM) capacitor |
| US10553339B1 (en) * | 2018-03-30 | 2020-02-04 | Universal Lighting Technologies, Inc. | Common-mode choke with integrated RF inductor winding |
| FR3082046A1 (fr) * | 2018-05-30 | 2019-12-06 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Circuit integre comportant une inductance |
| US10972001B2 (en) * | 2018-08-13 | 2021-04-06 | Intel Corporation | Multi-terminal inductors for voltage regulators |
| US11011303B2 (en) * | 2018-08-21 | 2021-05-18 | Globalfoundries U.S. Inc. | Dummy fill with eddy current self-canceling element for inductor component |
| JP7163962B2 (ja) * | 2018-08-30 | 2022-11-01 | 株式会社村田製作所 | 電力分配/結合回路および電力分配/結合部品 |
| US11004784B2 (en) * | 2018-10-12 | 2021-05-11 | Qualcomm Incorporated | Metal-on-metal capacitor |
| US12308309B2 (en) * | 2021-11-17 | 2025-05-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device with integrated metal-insulator-metal capacitors |
-
2021
- 2021-04-09 US US17/226,744 patent/US12051534B2/en active Active
-
2022
- 2022-02-07 TW TW111104405A patent/TW202240614A/zh unknown
- 2022-02-08 JP JP2023561208A patent/JP2024516540A/ja active Pending
- 2022-02-08 CN CN202280024156.6A patent/CN117063250A/zh active Pending
- 2022-02-08 KR KR1020237032760A patent/KR20230169949A/ko active Pending
- 2022-02-08 EP EP22706499.5A patent/EP4320634A1/en active Pending
- 2022-02-08 WO PCT/US2022/070566 patent/WO2022217169A1/en not_active Ceased
- 2022-02-08 BR BR112023019892A patent/BR112023019892A2/pt unknown
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