KR20230169949A - 3차원 (3d) 수직 나선형 인덕터 및 변압기 - Google Patents

3차원 (3d) 수직 나선형 인덕터 및 변압기 Download PDF

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Publication number
KR20230169949A
KR20230169949A KR1020237032760A KR20237032760A KR20230169949A KR 20230169949 A KR20230169949 A KR 20230169949A KR 1020237032760 A KR1020237032760 A KR 1020237032760A KR 20237032760 A KR20237032760 A KR 20237032760A KR 20230169949 A KR20230169949 A KR 20230169949A
Authority
KR
South Korea
Prior art keywords
helical coil
helical
inductor
coil
conductive layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237032760A
Other languages
English (en)
Korean (ko)
Inventor
샤 리
빈 양
하이닝 양
Original Assignee
퀄컴 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 퀄컴 인코포레이티드 filed Critical 퀄컴 인코포레이티드
Publication of KR20230169949A publication Critical patent/KR20230169949A/ko
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01L28/10—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020237032760A 2021-04-09 2022-02-08 3차원 (3d) 수직 나선형 인덕터 및 변압기 Pending KR20230169949A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/226,744 2021-04-09
US17/226,744 US12051534B2 (en) 2021-04-09 2021-04-09 Three dimensional (3D) vertical spiral inductor and transformer
PCT/US2022/070566 WO2022217169A1 (en) 2021-04-09 2022-02-08 Three dimensional (3d) vertical spiral inductor and transformer

Publications (1)

Publication Number Publication Date
KR20230169949A true KR20230169949A (ko) 2023-12-18

Family

ID=80461320

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237032760A Pending KR20230169949A (ko) 2021-04-09 2022-02-08 3차원 (3d) 수직 나선형 인덕터 및 변압기

Country Status (8)

Country Link
US (1) US12051534B2 (enExample)
EP (1) EP4320634A1 (enExample)
JP (1) JP2024516540A (enExample)
KR (1) KR20230169949A (enExample)
CN (1) CN117063250A (enExample)
BR (1) BR112023019892A2 (enExample)
TW (1) TW202240614A (enExample)
WO (1) WO2022217169A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
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US12224253B2 (en) * 2021-09-20 2025-02-11 Intel Corporation Magnetic inductor device and method
US12249618B2 (en) * 2022-02-28 2025-03-11 Analog Devices International Unlimited Company Shaped metal edge for galvanic or capacitive isolator
CN118919219A (zh) * 2024-08-13 2024-11-08 成都兴仁科技有限公司 一种三维立体pcb电感的结构

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US6949442B2 (en) * 2003-05-05 2005-09-27 Infineon Technologies Ag Methods of forming MIM capacitors
TWI226647B (en) * 2003-06-11 2005-01-11 Via Tech Inc Inductor formed between two layout layers
US7253497B2 (en) 2003-07-02 2007-08-07 Lsi Corporation Integrated circuit with inductor having horizontal magnetic flux lines
US6903644B2 (en) * 2003-07-28 2005-06-07 Taiwan Semiconductor Manufacturing Company, Ltd. Inductor device having improved quality factor
JP4150689B2 (ja) * 2004-03-29 2008-09-17 富士通株式会社 半導体集積回路装置内に形成された多層配線構造
US7436281B2 (en) * 2004-07-30 2008-10-14 Texas Instruments Incorporated Method to improve inductance with a high-permeability slotted plate core in an integrated circuit
KR100650907B1 (ko) * 2005-12-29 2006-11-28 동부일렉트로닉스 주식회사 구리 금속으로 된 집적회로 인덕터 및 그 제조 방법
US20080204183A1 (en) * 2007-02-23 2008-08-28 Infineon Technologies Ag 3d-coil for saving area used by inductances
US7812424B2 (en) * 2007-12-21 2010-10-12 Infineon Technologies Ag Moisture barrier capacitors in semiconductor components
US8101495B2 (en) * 2008-03-13 2012-01-24 Infineon Technologies Ag MIM capacitors in semiconductor components
US8143987B2 (en) * 2010-04-07 2012-03-27 Xilinx, Inc. Stacked dual inductor structure
JP2012222252A (ja) * 2011-04-12 2012-11-12 Renesas Electronics Corp 半導体装置
US9559053B2 (en) * 2011-04-21 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Compact vertical inductors extending in vertical planes
JP2013038138A (ja) * 2011-08-04 2013-02-21 Renesas Electronics Corp 半導体装置
US20140203404A1 (en) * 2013-01-21 2014-07-24 Qualcomm Incorporated Spiral metal-on-metal (smom) capacitors, and related systems and methods
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TW201545184A (zh) * 2014-05-23 2015-12-01 力晶科技股份有限公司 電容器結構及其製造方法
US9831171B2 (en) * 2014-11-12 2017-11-28 Infineon Technologies Ag Capacitors with barrier dielectric layers, and methods of formation thereof
US10032711B2 (en) * 2016-07-25 2018-07-24 International Business Machines Corporation Integrating metal-insulator-metal capacitors with air gap process flow
US10643782B2 (en) * 2016-10-28 2020-05-05 Delta Electronics (Shanghai) Co., Ltd. Magnetic component and power module
US10559530B2 (en) * 2017-12-27 2020-02-11 International Business Machines Corporation Forming dual metallization interconnect structures in single metallization level
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Also Published As

Publication number Publication date
US20220328237A1 (en) 2022-10-13
TW202240614A (zh) 2022-10-16
JP2024516540A (ja) 2024-04-16
CN117063250A (zh) 2023-11-14
EP4320634A1 (en) 2024-02-14
WO2022217169A1 (en) 2022-10-13
US12051534B2 (en) 2024-07-30
BR112023019892A2 (pt) 2023-11-14

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PA0105 International application

Patent event date: 20230922

Patent event code: PA01051R01D

Comment text: International Patent Application

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A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20250123

Comment text: Request for Examination of Application