JP2024516540A - ３次元（３ｄ）垂直スパイラルインダクタおよび変圧器 - Google Patents

３次元（３ｄ）垂直スパイラルインダクタおよび変圧器 Download PDF

Info

Publication number
JP2024516540A
JP2024516540A JP2023561208A JP2023561208A JP2024516540A JP 2024516540 A JP2024516540 A JP 2024516540A JP 2023561208 A JP2023561208 A JP 2023561208A JP 2023561208 A JP2023561208 A JP 2023561208A JP 2024516540 A JP2024516540 A JP 2024516540A
Authority
JP
Japan
Prior art keywords
spiral coil
spiral
coil
layers
conductive layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023561208A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024516540A5 (enExample
Inventor
シア・リ
ビン・ヤン
ハイニン・ヤン
Original Assignee
クアルコム，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クアルコム，インコーポレイテッド filed Critical クアルコム，インコーポレイテッド
Publication of JP2024516540A publication Critical patent/JP2024516540A/ja
Publication of JP2024516540A5 publication Critical patent/JP2024516540A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2809—Printed windings on stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2023561208A 2021-04-09 2022-02-08 ３次元（３ｄ）垂直スパイラルインダクタおよび変圧器 Pending JP2024516540A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/226,744 2021-04-09
US17/226,744 US12051534B2 (en) 2021-04-09 2021-04-09 Three dimensional (3D) vertical spiral inductor and transformer
PCT/US2022/070566 WO2022217169A1 (en) 2021-04-09 2022-02-08 Three dimensional (3d) vertical spiral inductor and transformer

Publications (2)

Publication Number Publication Date
JP2024516540A true JP2024516540A (ja) 2024-04-16
JP2024516540A5 JP2024516540A5 (enExample) 2025-01-23

Family

ID=80461320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023561208A Pending JP2024516540A (ja) 2021-04-09 2022-02-08 ３次元（３ｄ）垂直スパイラルインダクタおよび変圧器

Country Status (8)

Country Link
US (1) US12051534B2 (enExample)
EP (1) EP4320634A1 (enExample)
JP (1) JP2024516540A (enExample)
KR (1) KR20230169949A (enExample)
CN (1) CN117063250A (enExample)
BR (1) BR112023019892A2 (enExample)
TW (1) TW202240614A (enExample)
WO (1) WO2022217169A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12224253B2 (en) * 2021-09-20 2025-02-11 Intel Corporation Magnetic inductor device and method
US12249618B2 (en) * 2022-02-28 2025-03-11 Analog Devices International Unlimited Company Shaped metal edge for galvanic or capacitive isolator
CN118919219A (zh) * 2024-08-13 2024-11-08 成都兴仁科技有限公司 一种三维立体pcb电感的结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005285970A (ja) * 2004-03-29 2005-10-13 Fujitsu Ltd 多層配線構造
US20070155152A1 (en) * 2005-12-29 2007-07-05 Kang Myung Ii Method of manufacturing a copper inductor
JP2012222252A (ja) * 2011-04-12 2012-11-12 Renesas Electronics Corp 半導体装置
JP2013038138A (ja) * 2011-08-04 2013-02-21 Renesas Electronics Corp 半導体装置

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051501A (ja) * 2001-05-30 2003-02-21 Mitsubishi Electric Corp 半導体装置及びその製造方法
US6667536B2 (en) * 2001-06-28 2003-12-23 Agere Systems Inc. Thin film multi-layer high Q transformer formed in a semiconductor substrate
US6949442B2 (en) * 2003-05-05 2005-09-27 Infineon Technologies Ag Methods of forming MIM capacitors
TWI226647B (en) * 2003-06-11 2005-01-11 Via Tech Inc Inductor formed between two layout layers
US7253497B2 (en) 2003-07-02 2007-08-07 Lsi Corporation Integrated circuit with inductor having horizontal magnetic flux lines
US6903644B2 (en) * 2003-07-28 2005-06-07 Taiwan Semiconductor Manufacturing Company, Ltd. Inductor device having improved quality factor
US7436281B2 (en) * 2004-07-30 2008-10-14 Texas Instruments Incorporated Method to improve inductance with a high-permeability slotted plate core in an integrated circuit
US20080204183A1 (en) * 2007-02-23 2008-08-28 Infineon Technologies Ag 3d-coil for saving area used by inductances
US7812424B2 (en) * 2007-12-21 2010-10-12 Infineon Technologies Ag Moisture barrier capacitors in semiconductor components
US8101495B2 (en) * 2008-03-13 2012-01-24 Infineon Technologies Ag MIM capacitors in semiconductor components
US8143987B2 (en) * 2010-04-07 2012-03-27 Xilinx, Inc. Stacked dual inductor structure
US9559053B2 (en) * 2011-04-21 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Compact vertical inductors extending in vertical planes
US20140203404A1 (en) * 2013-01-21 2014-07-24 Qualcomm Incorporated Spiral metal-on-metal (smom) capacitors, and related systems and methods
US8836079B2 (en) * 2013-01-24 2014-09-16 Qualcomm Incorporated Metal-on-metal (MoM) capacitors having laterally displaced layers, and related systems and methods
US9373434B2 (en) * 2013-06-20 2016-06-21 Taiwan Semiconductor Manufacturing Co., Ltd. Inductor assembly and method of using same
TW201532247A (zh) * 2013-10-16 2015-08-16 康佛森智財管理公司 形成嵌入動態隨機存取記憶體電容器的成本效益佳的方法
TW201545184A (zh) * 2014-05-23 2015-12-01 力晶科技股份有限公司 電容器結構及其製造方法
US9831171B2 (en) * 2014-11-12 2017-11-28 Infineon Technologies Ag Capacitors with barrier dielectric layers, and methods of formation thereof
US10032711B2 (en) * 2016-07-25 2018-07-24 International Business Machines Corporation Integrating metal-insulator-metal capacitors with air gap process flow
US10643782B2 (en) * 2016-10-28 2020-05-05 Delta Electronics (Shanghai) Co., Ltd. Magnetic component and power module
US10559530B2 (en) * 2017-12-27 2020-02-11 International Business Machines Corporation Forming dual metallization interconnect structures in single metallization level
US10686031B2 (en) * 2018-03-27 2020-06-16 Qualcomm Incorporated Finger metal-oxide-metal (FMOM) capacitor
US10553339B1 (en) * 2018-03-30 2020-02-04 Universal Lighting Technologies, Inc. Common-mode choke with integrated RF inductor winding
FR3082046A1 (fr) * 2018-05-30 2019-12-06 Commissariat A L'energie Atomique Et Aux Energies Alternatives Circuit integre comportant une inductance
US10972001B2 (en) * 2018-08-13 2021-04-06 Intel Corporation Multi-terminal inductors for voltage regulators
US11011303B2 (en) * 2018-08-21 2021-05-18 Globalfoundries U.S. Inc. Dummy fill with eddy current self-canceling element for inductor component
JP7163962B2 (ja) * 2018-08-30 2022-11-01 株式会社村田製作所 電力分配／結合回路および電力分配／結合部品
US11004784B2 (en) * 2018-10-12 2021-05-11 Qualcomm Incorporated Metal-on-metal capacitor
US12308309B2 (en) * 2021-11-17 2025-05-20 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device with integrated metal-insulator-metal capacitors

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005285970A (ja) * 2004-03-29 2005-10-13 Fujitsu Ltd 多層配線構造
US20070155152A1 (en) * 2005-12-29 2007-07-05 Kang Myung Ii Method of manufacturing a copper inductor
JP2012222252A (ja) * 2011-04-12 2012-11-12 Renesas Electronics Corp 半導体装置
JP2013038138A (ja) * 2011-08-04 2013-02-21 Renesas Electronics Corp 半導体装置

Also Published As

Publication number Publication date
US20220328237A1 (en) 2022-10-13
TW202240614A (zh) 2022-10-16
KR20230169949A (ko) 2023-12-18
CN117063250A (zh) 2023-11-14
EP4320634A1 (en) 2024-02-14
WO2022217169A1 (en) 2022-10-13
US12051534B2 (en) 2024-07-30
BR112023019892A2 (pt) 2023-11-14

Similar Documents

Publication Publication Date Title
KR101304387B1 (ko) 자기 필름 개선 인덕터
US9293245B2 (en) Integration of a coil and a discontinuous magnetic core
JP6076089B2 (ja) ３次元インダクタ及び変圧器
US10115661B2 (en) Substrate-less discrete coupled inductor structure
US8907448B2 (en) Small size and fully integrated power converter with magnetics on chip
US9673268B2 (en) Integrated inductor for integrated circuit devices
JP2024516540A (ja) ３次元（３ｄ）垂直スパイラルインダクタおよび変圧器
EP2956948B1 (en) In substrate coupled inductor structure
KR20180102561A (ko) 스큐잉된 코―스파이럴 인덕터 구조물
TWI881064B (zh) 混合三維電感器
US20140253279A1 (en) Coupled discrete inductor with flux concentration using high permeable material
CN117178356A (zh) 金属氧化物金属(mom)电容器中的线路后端(beol)高电阻(hi-r)导体层
CN119547165A (zh) 三维垂直共螺旋电感器
US10403707B2 (en) Array type inductor
TW202207389A (zh) 具有嵌入絕緣層內的局部高密度佈線區域的封裝
US12402332B2 (en) Integrated passive devices
US11862367B2 (en) ESL-less AC resistor for high frequency applications

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250115

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250115

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20251208

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20251216

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260316