JP2024507524A5 - - Google Patents

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Publication number
JP2024507524A5
JP2024507524A5 JP2023550199A JP2023550199A JP2024507524A5 JP 2024507524 A5 JP2024507524 A5 JP 2024507524A5 JP 2023550199 A JP2023550199 A JP 2023550199A JP 2023550199 A JP2023550199 A JP 2023550199A JP 2024507524 A5 JP2024507524 A5 JP 2024507524A5
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JP
Japan
Prior art keywords
photomask
euv
gas
processing chamber
reducing agent
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JP2023550199A
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English (en)
Japanese (ja)
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JP7583953B2 (ja
JP2024507524A (ja
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Priority claimed from PCT/US2022/015554 external-priority patent/WO2022182510A1/en
Publication of JP2024507524A publication Critical patent/JP2024507524A/ja
Publication of JP2024507524A5 publication Critical patent/JP2024507524A5/ja
Application granted granted Critical
Publication of JP7583953B2 publication Critical patent/JP7583953B2/ja
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JP2023550199A 2021-02-25 2022-02-08 極紫外線フォトマスク上でのルテニウム酸化物還元のための方法及び装置 Active JP7583953B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163153753P 2021-02-25 2021-02-25
US63/153,753 2021-02-25
PCT/US2022/015554 WO2022182510A1 (en) 2021-02-25 2022-02-08 Methods and apparatus for ruthenium oxide reduction on extreme ultraviolet photomasks

Publications (3)

Publication Number Publication Date
JP2024507524A JP2024507524A (ja) 2024-02-20
JP2024507524A5 true JP2024507524A5 (cg-RX-API-DMAC7.html) 2024-10-21
JP7583953B2 JP7583953B2 (ja) 2024-11-14

Family

ID=83048389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023550199A Active JP7583953B2 (ja) 2021-02-25 2022-02-08 極紫外線フォトマスク上でのルテニウム酸化物還元のための方法及び装置

Country Status (7)

Country Link
US (1) US20240118603A1 (cg-RX-API-DMAC7.html)
EP (1) EP4298479A4 (cg-RX-API-DMAC7.html)
JP (1) JP7583953B2 (cg-RX-API-DMAC7.html)
KR (1) KR102959585B1 (cg-RX-API-DMAC7.html)
CN (1) CN117043674A (cg-RX-API-DMAC7.html)
TW (1) TW202238249A (cg-RX-API-DMAC7.html)
WO (1) WO2022182510A1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024129260A1 (en) * 2022-12-12 2024-06-20 Lam Research Corporation Controlling gas flows in processing tool
US20260099087A1 (en) * 2024-10-07 2026-04-09 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of manufacturing semiconductor device and extreme ultraviolet photolithography systems
EP4790166A1 (en) 2025-02-10 2026-08-12 ASML Netherlands B.V. Method for coating a component of a lithographic apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004074932A2 (en) 2003-02-14 2004-09-02 Applied Materials, Inc. Method and apparatus for cleaning of native oxides with hydroge-containing radicals
US7547505B2 (en) * 2005-01-20 2009-06-16 Infineon Technologies Ag Methods of forming capping layers on reflective materials
KR101163221B1 (ko) * 2010-09-10 2012-07-11 에스케이하이닉스 주식회사 극자외선 광학 소자의 반사율을 회복시키는 방법 및 이를 이용한 세정 방법
JP6637420B2 (ja) * 2013-08-09 2020-01-29 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated エピタキシャル成長に先立って基板表面を予洗浄するための方法及び装置
CN106164771B (zh) * 2014-03-11 2020-08-04 芝浦机械电子株式会社 反射型掩膜的清洗装置、及反射型掩膜的清洗方法
US20150376792A1 (en) * 2014-06-30 2015-12-31 Lam Research Corporation Atmospheric plasma apparatus for semiconductor processing
US9739913B2 (en) * 2014-07-11 2017-08-22 Applied Materials, Inc. Extreme ultraviolet capping layer and method of manufacturing and lithography thereof
US20170017146A1 (en) 2015-07-13 2017-01-19 Applied Materials, Inc. Process for removing contamination on ruthenium surface
US20200306802A1 (en) 2017-12-18 2020-10-01 Sekisui Chemical Co., Ltd. Surface treatment method and surface treatment apparatus

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