JP2024094186A5 - - Google Patents

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Publication number
JP2024094186A5
JP2024094186A5 JP2022210985A JP2022210985A JP2024094186A5 JP 2024094186 A5 JP2024094186 A5 JP 2024094186A5 JP 2022210985 A JP2022210985 A JP 2022210985A JP 2022210985 A JP2022210985 A JP 2022210985A JP 2024094186 A5 JP2024094186 A5 JP 2024094186A5
Authority
JP
Japan
Prior art keywords
measurement
polishing
thickness
substrate
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022210985A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024094186A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2022210985A priority Critical patent/JP2024094186A/ja
Priority claimed from JP2022210985A external-priority patent/JP2024094186A/ja
Priority to US18/544,073 priority patent/US20240278378A1/en
Priority to KR1020230187221A priority patent/KR20240104006A/ko
Priority to CN202311793004.5A priority patent/CN118254094A/zh
Priority to TW112150714A priority patent/TW202426176A/zh
Publication of JP2024094186A publication Critical patent/JP2024094186A/ja
Publication of JP2024094186A5 publication Critical patent/JP2024094186A5/ja
Pending legal-status Critical Current

Links

JP2022210985A 2022-12-27 2022-12-27 研磨装置 Pending JP2024094186A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022210985A JP2024094186A (ja) 2022-12-27 2022-12-27 研磨装置
US18/544,073 US20240278378A1 (en) 2022-12-27 2023-12-18 Polishing apparatus
KR1020230187221A KR20240104006A (ko) 2022-12-27 2023-12-20 연마 장치
CN202311793004.5A CN118254094A (zh) 2022-12-27 2023-12-25 研磨装置
TW112150714A TW202426176A (zh) 2022-12-27 2023-12-26 研磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022210985A JP2024094186A (ja) 2022-12-27 2022-12-27 研磨装置

Publications (2)

Publication Number Publication Date
JP2024094186A JP2024094186A (ja) 2024-07-09
JP2024094186A5 true JP2024094186A5 (cg-RX-API-DMAC7.html) 2025-11-18

Family

ID=91603294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022210985A Pending JP2024094186A (ja) 2022-12-27 2022-12-27 研磨装置

Country Status (5)

Country Link
US (1) US20240278378A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024094186A (cg-RX-API-DMAC7.html)
KR (1) KR20240104006A (cg-RX-API-DMAC7.html)
CN (1) CN118254094A (cg-RX-API-DMAC7.html)
TW (1) TW202426176A (cg-RX-API-DMAC7.html)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635309Y2 (cg-RX-API-DMAC7.html) 1974-11-21 1981-08-20
US6383058B1 (en) * 2000-01-28 2002-05-07 Applied Materials, Inc. Adaptive endpoint detection for chemical mechanical polishing
JP2002261059A (ja) * 2001-03-01 2002-09-13 Omron Corp 研磨状態検出装置
DE102008021569A1 (de) * 2008-04-30 2009-11-05 Advanced Micro Devices, Inc., Sunnyvale System und Verfahren zur optischen Endpunkterkennung während des CMP unter Anwendung eines substratüberspannenenden Signals
JP5167010B2 (ja) * 2008-07-23 2013-03-21 株式会社荏原製作所 研磨終点検知方法および研磨装置
TW201819107A (zh) * 2016-08-26 2018-06-01 美商應用材料股份有限公司 用於化學機械研磨的研磨墊厚度監測
JP6861116B2 (ja) * 2017-07-14 2021-04-21 株式会社荏原製作所 膜厚測定装置、研磨装置、および研磨方法
JP6847811B2 (ja) * 2017-10-24 2021-03-24 株式会社荏原製作所 研磨方法および研磨装置
JP7068831B2 (ja) * 2018-01-18 2022-05-17 株式会社荏原製作所 研磨装置
JP7751399B2 (ja) * 2021-04-02 2025-10-08 株式会社荏原製作所 研磨パッド、研磨装置、研磨方法

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