KR20240104006A - 연마 장치 - Google Patents

연마 장치 Download PDF

Info

Publication number
KR20240104006A
KR20240104006A KR1020230187221A KR20230187221A KR20240104006A KR 20240104006 A KR20240104006 A KR 20240104006A KR 1020230187221 A KR1020230187221 A KR 1020230187221A KR 20230187221 A KR20230187221 A KR 20230187221A KR 20240104006 A KR20240104006 A KR 20240104006A
Authority
KR
South Korea
Prior art keywords
polishing
measurement
light
thickness
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020230187221A
Other languages
English (en)
Korean (ko)
Inventor
요이치 시오카와
마사키 기노시타
유키 와타나베
도시후미 김바
게이타 다노우에
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20240104006A publication Critical patent/KR20240104006A/ko
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020230187221A 2022-12-27 2023-12-20 연마 장치 Pending KR20240104006A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2022-210985 2022-12-27
JP2022210985A JP2024094186A (ja) 2022-12-27 2022-12-27 研磨装置

Publications (1)

Publication Number Publication Date
KR20240104006A true KR20240104006A (ko) 2024-07-04

Family

ID=91603294

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230187221A Pending KR20240104006A (ko) 2022-12-27 2023-12-20 연마 장치

Country Status (5)

Country Link
US (1) US20240278378A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024094186A (cg-RX-API-DMAC7.html)
KR (1) KR20240104006A (cg-RX-API-DMAC7.html)
CN (1) CN118254094A (cg-RX-API-DMAC7.html)
TW (1) TW202426176A (cg-RX-API-DMAC7.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5167010U (cg-RX-API-DMAC7.html) 1974-11-21 1976-05-27

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6383058B1 (en) * 2000-01-28 2002-05-07 Applied Materials, Inc. Adaptive endpoint detection for chemical mechanical polishing
JP2002261059A (ja) * 2001-03-01 2002-09-13 Omron Corp 研磨状態検出装置
DE102008021569A1 (de) * 2008-04-30 2009-11-05 Advanced Micro Devices, Inc., Sunnyvale System und Verfahren zur optischen Endpunkterkennung während des CMP unter Anwendung eines substratüberspannenenden Signals
JP5167010B2 (ja) * 2008-07-23 2013-03-21 株式会社荏原製作所 研磨終点検知方法および研磨装置
TW201819107A (zh) * 2016-08-26 2018-06-01 美商應用材料股份有限公司 用於化學機械研磨的研磨墊厚度監測
JP6861116B2 (ja) * 2017-07-14 2021-04-21 株式会社荏原製作所 膜厚測定装置、研磨装置、および研磨方法
JP6847811B2 (ja) * 2017-10-24 2021-03-24 株式会社荏原製作所 研磨方法および研磨装置
JP7068831B2 (ja) * 2018-01-18 2022-05-17 株式会社荏原製作所 研磨装置
JP7751399B2 (ja) * 2021-04-02 2025-10-08 株式会社荏原製作所 研磨パッド、研磨装置、研磨方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5167010U (cg-RX-API-DMAC7.html) 1974-11-21 1976-05-27

Also Published As

Publication number Publication date
JP2024094186A (ja) 2024-07-09
TW202426176A (zh) 2024-07-01
US20240278378A1 (en) 2024-08-22
CN118254094A (zh) 2024-06-28

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20231220

PG1501 Laying open of application