JP2024094186A - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP2024094186A
JP2024094186A JP2022210985A JP2022210985A JP2024094186A JP 2024094186 A JP2024094186 A JP 2024094186A JP 2022210985 A JP2022210985 A JP 2022210985A JP 2022210985 A JP2022210985 A JP 2022210985A JP 2024094186 A JP2024094186 A JP 2024094186A
Authority
JP
Japan
Prior art keywords
polishing
measurement
polishing pad
light
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022210985A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024094186A5 (cg-RX-API-DMAC7.html
Inventor
陽一 塩川
Yoichi Shiokawa
将毅 木下
Masataka Kinoshita
夕貴 渡邉
Yuki Watanabe
利文 金馬
Toshifumi Kaneuma
景太 田上
Keita Tagami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2022210985A priority Critical patent/JP2024094186A/ja
Priority to US18/544,073 priority patent/US20240278378A1/en
Priority to KR1020230187221A priority patent/KR20240104006A/ko
Priority to CN202311793004.5A priority patent/CN118254094A/zh
Priority to TW112150714A priority patent/TW202426176A/zh
Publication of JP2024094186A publication Critical patent/JP2024094186A/ja
Publication of JP2024094186A5 publication Critical patent/JP2024094186A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2022210985A 2022-12-27 2022-12-27 研磨装置 Pending JP2024094186A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022210985A JP2024094186A (ja) 2022-12-27 2022-12-27 研磨装置
US18/544,073 US20240278378A1 (en) 2022-12-27 2023-12-18 Polishing apparatus
KR1020230187221A KR20240104006A (ko) 2022-12-27 2023-12-20 연마 장치
CN202311793004.5A CN118254094A (zh) 2022-12-27 2023-12-25 研磨装置
TW112150714A TW202426176A (zh) 2022-12-27 2023-12-26 研磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022210985A JP2024094186A (ja) 2022-12-27 2022-12-27 研磨装置

Publications (2)

Publication Number Publication Date
JP2024094186A true JP2024094186A (ja) 2024-07-09
JP2024094186A5 JP2024094186A5 (cg-RX-API-DMAC7.html) 2025-11-18

Family

ID=91603294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022210985A Pending JP2024094186A (ja) 2022-12-27 2022-12-27 研磨装置

Country Status (5)

Country Link
US (1) US20240278378A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024094186A (cg-RX-API-DMAC7.html)
KR (1) KR20240104006A (cg-RX-API-DMAC7.html)
CN (1) CN118254094A (cg-RX-API-DMAC7.html)
TW (1) TW202426176A (cg-RX-API-DMAC7.html)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261059A (ja) * 2001-03-01 2002-09-13 Omron Corp 研磨状態検出装置
US20090275264A1 (en) * 2008-04-30 2009-11-05 Mike Schlicker System and method for optical endpoint detection during cmp by using an across-substrate signal
JP2010023210A (ja) * 2008-07-23 2010-02-04 Ebara Corp 研磨終点検知方法および研磨装置
JP2011258985A (ja) * 2000-01-28 2011-12-22 Applied Materials Inc 化学機械研磨用の適応終点検出
JP2019079923A (ja) * 2017-10-24 2019-05-23 株式会社荏原製作所 研磨方法および研磨装置
JP2019528186A (ja) * 2016-08-26 2019-10-10 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 化学機械研磨のための研磨パッド厚さのモニタリング
JP2022158419A (ja) * 2021-04-02 2022-10-17 株式会社荏原製作所 研磨パッド、研磨装置、研磨方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635309Y2 (cg-RX-API-DMAC7.html) 1974-11-21 1981-08-20
JP6861116B2 (ja) * 2017-07-14 2021-04-21 株式会社荏原製作所 膜厚測定装置、研磨装置、および研磨方法
JP7068831B2 (ja) * 2018-01-18 2022-05-17 株式会社荏原製作所 研磨装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011258985A (ja) * 2000-01-28 2011-12-22 Applied Materials Inc 化学機械研磨用の適応終点検出
JP2002261059A (ja) * 2001-03-01 2002-09-13 Omron Corp 研磨状態検出装置
US20090275264A1 (en) * 2008-04-30 2009-11-05 Mike Schlicker System and method for optical endpoint detection during cmp by using an across-substrate signal
JP2010023210A (ja) * 2008-07-23 2010-02-04 Ebara Corp 研磨終点検知方法および研磨装置
JP2019528186A (ja) * 2016-08-26 2019-10-10 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 化学機械研磨のための研磨パッド厚さのモニタリング
JP2019079923A (ja) * 2017-10-24 2019-05-23 株式会社荏原製作所 研磨方法および研磨装置
JP2022158419A (ja) * 2021-04-02 2022-10-17 株式会社荏原製作所 研磨パッド、研磨装置、研磨方法

Also Published As

Publication number Publication date
TW202426176A (zh) 2024-07-01
US20240278378A1 (en) 2024-08-22
KR20240104006A (ko) 2024-07-04
CN118254094A (zh) 2024-06-28

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