TW202426176A - 研磨裝置 - Google Patents

研磨裝置 Download PDF

Info

Publication number
TW202426176A
TW202426176A TW112150714A TW112150714A TW202426176A TW 202426176 A TW202426176 A TW 202426176A TW 112150714 A TW112150714 A TW 112150714A TW 112150714 A TW112150714 A TW 112150714A TW 202426176 A TW202426176 A TW 202426176A
Authority
TW
Taiwan
Prior art keywords
polishing
light
thickness
polishing pad
pad
Prior art date
Application number
TW112150714A
Other languages
English (en)
Chinese (zh)
Inventor
塩川陽一
木下将毅
渡邉夕貴
金馬利文
田上景太
Original Assignee
日商荏原製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW202426176A publication Critical patent/TW202426176A/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW112150714A 2022-12-27 2023-12-26 研磨裝置 TW202426176A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-210985 2022-12-27
JP2022210985A JP2024094186A (ja) 2022-12-27 2022-12-27 研磨装置

Publications (1)

Publication Number Publication Date
TW202426176A true TW202426176A (zh) 2024-07-01

Family

ID=91603294

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112150714A TW202426176A (zh) 2022-12-27 2023-12-26 研磨裝置

Country Status (5)

Country Link
US (1) US20240278378A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024094186A (cg-RX-API-DMAC7.html)
KR (1) KR20240104006A (cg-RX-API-DMAC7.html)
CN (1) CN118254094A (cg-RX-API-DMAC7.html)
TW (1) TW202426176A (cg-RX-API-DMAC7.html)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635309Y2 (cg-RX-API-DMAC7.html) 1974-11-21 1981-08-20
US6383058B1 (en) * 2000-01-28 2002-05-07 Applied Materials, Inc. Adaptive endpoint detection for chemical mechanical polishing
JP2002261059A (ja) * 2001-03-01 2002-09-13 Omron Corp 研磨状態検出装置
DE102008021569A1 (de) * 2008-04-30 2009-11-05 Advanced Micro Devices, Inc., Sunnyvale System und Verfahren zur optischen Endpunkterkennung während des CMP unter Anwendung eines substratüberspannenenden Signals
JP5167010B2 (ja) * 2008-07-23 2013-03-21 株式会社荏原製作所 研磨終点検知方法および研磨装置
TW201819107A (zh) * 2016-08-26 2018-06-01 美商應用材料股份有限公司 用於化學機械研磨的研磨墊厚度監測
JP6861116B2 (ja) * 2017-07-14 2021-04-21 株式会社荏原製作所 膜厚測定装置、研磨装置、および研磨方法
JP6847811B2 (ja) * 2017-10-24 2021-03-24 株式会社荏原製作所 研磨方法および研磨装置
JP7068831B2 (ja) * 2018-01-18 2022-05-17 株式会社荏原製作所 研磨装置
JP7751399B2 (ja) * 2021-04-02 2025-10-08 株式会社荏原製作所 研磨パッド、研磨装置、研磨方法

Also Published As

Publication number Publication date
JP2024094186A (ja) 2024-07-09
US20240278378A1 (en) 2024-08-22
KR20240104006A (ko) 2024-07-04
CN118254094A (zh) 2024-06-28

Similar Documents

Publication Publication Date Title
KR100465929B1 (ko) 연마상황 모니터링 방법, 연마상황 모니터링 장치,연마장치, 프로세스 웨이퍼, 반도체 디바이스 제조방법 및반도체 디바이스
TWI788383B (zh) 研磨裝置及研磨方法
CN102263022B (zh) 半导体装置的制造方法
CN1447396A (zh) 化学机械抛光装置及其控制方法
KR20180094428A (ko) 화학 기계적 연마 장치
KR20200020799A (ko) 기판 처리 시스템, 기판 처리 방법 및 컴퓨터 기억 매체
CN117546280A (zh) 半导体晶片处理中的位移测量
JP2018134710A (ja) 基板の研磨装置および研磨方法
TWI848173B (zh) 研磨裝置及研磨方法
TWI858348B (zh) 使用光學感測器來進行化學機械研磨振動測量的設備及方法
KR20200095345A (ko) 더미 디스크, 드레싱 디스크, 및 더미 디스크를 이용한 표면 높이 측정 방법
JP7650594B2 (ja) 樹脂被覆方法及び樹脂被覆装置
JP3634060B2 (ja) 研磨方法及び研磨装置
CN118254094A (zh) 研磨装置
JP2009088073A (ja) 研削ステージでの半導体基板の厚み測定方法
KR101407708B1 (ko) 연삭 장치
JP7068849B2 (ja) 研削装置
CN112025547A (zh) 激光投影虚拟校正设备和方法
JP2026002406A (ja) 研磨装置および研磨方法
TWI916978B (zh) 拋光裝置、基板處理方法及凹槽探測站
JP2009026905A (ja) 研削ステージでの半導体基板の厚み測定方法
JP2021137934A (ja) 研削装置、及び研削方法
US20260061554A1 (en) Finding substrate notch on substrate in a chemical mechanical polishing system
US20260061553A1 (en) Finding substrate notch on substrate in a chemical mechanical polishing system
US20250114906A1 (en) Method of processing workpiece