CN118254094A - 研磨装置 - Google Patents

研磨装置 Download PDF

Info

Publication number
CN118254094A
CN118254094A CN202311793004.5A CN202311793004A CN118254094A CN 118254094 A CN118254094 A CN 118254094A CN 202311793004 A CN202311793004 A CN 202311793004A CN 118254094 A CN118254094 A CN 118254094A
Authority
CN
China
Prior art keywords
light
polishing
measurement
pad
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311793004.5A
Other languages
English (en)
Chinese (zh)
Inventor
盐川阳一
木下将毅
渡边夕贵
金马利文
田上景太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of CN118254094A publication Critical patent/CN118254094A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN202311793004.5A 2022-12-27 2023-12-25 研磨装置 Pending CN118254094A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-210985 2022-12-27
JP2022210985A JP2024094186A (ja) 2022-12-27 2022-12-27 研磨装置

Publications (1)

Publication Number Publication Date
CN118254094A true CN118254094A (zh) 2024-06-28

Family

ID=91603294

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311793004.5A Pending CN118254094A (zh) 2022-12-27 2023-12-25 研磨装置

Country Status (5)

Country Link
US (1) US20240278378A1 (cg-RX-API-DMAC7.html)
JP (1) JP2024094186A (cg-RX-API-DMAC7.html)
KR (1) KR20240104006A (cg-RX-API-DMAC7.html)
CN (1) CN118254094A (cg-RX-API-DMAC7.html)
TW (1) TW202426176A (cg-RX-API-DMAC7.html)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5635309Y2 (cg-RX-API-DMAC7.html) 1974-11-21 1981-08-20
US6383058B1 (en) * 2000-01-28 2002-05-07 Applied Materials, Inc. Adaptive endpoint detection for chemical mechanical polishing
JP2002261059A (ja) * 2001-03-01 2002-09-13 Omron Corp 研磨状態検出装置
DE102008021569A1 (de) * 2008-04-30 2009-11-05 Advanced Micro Devices, Inc., Sunnyvale System und Verfahren zur optischen Endpunkterkennung während des CMP unter Anwendung eines substratüberspannenenden Signals
JP5167010B2 (ja) * 2008-07-23 2013-03-21 株式会社荏原製作所 研磨終点検知方法および研磨装置
TW201819107A (zh) * 2016-08-26 2018-06-01 美商應用材料股份有限公司 用於化學機械研磨的研磨墊厚度監測
JP6861116B2 (ja) * 2017-07-14 2021-04-21 株式会社荏原製作所 膜厚測定装置、研磨装置、および研磨方法
JP6847811B2 (ja) * 2017-10-24 2021-03-24 株式会社荏原製作所 研磨方法および研磨装置
JP7068831B2 (ja) * 2018-01-18 2022-05-17 株式会社荏原製作所 研磨装置
JP7751399B2 (ja) * 2021-04-02 2025-10-08 株式会社荏原製作所 研磨パッド、研磨装置、研磨方法

Also Published As

Publication number Publication date
JP2024094186A (ja) 2024-07-09
TW202426176A (zh) 2024-07-01
US20240278378A1 (en) 2024-08-22
KR20240104006A (ko) 2024-07-04

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