JP2024050679A5 - - Google Patents

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Publication number
JP2024050679A5
JP2024050679A5 JP2024009105A JP2024009105A JP2024050679A5 JP 2024050679 A5 JP2024050679 A5 JP 2024050679A5 JP 2024009105 A JP2024009105 A JP 2024009105A JP 2024009105 A JP2024009105 A JP 2024009105A JP 2024050679 A5 JP2024050679 A5 JP 2024050679A5
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JP
Japan
Prior art keywords
conductor
substrate
openings
opening
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024009105A
Other languages
English (en)
Japanese (ja)
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JP2024050679A (ja
Filing date
Publication date
Priority claimed from PCT/JP2021/035477 external-priority patent/WO2022071256A1/ja
Application filed filed Critical
Publication of JP2024050679A publication Critical patent/JP2024050679A/ja
Publication of JP2024050679A5 publication Critical patent/JP2024050679A5/ja
Pending legal-status Critical Current

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JP2024009105A 2020-09-30 2024-01-25 配線基体および電子装置 Pending JP2024050679A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020165236 2020-09-30
JP2020165236 2020-09-30
PCT/JP2021/035477 WO2022071256A1 (ja) 2020-09-30 2021-09-28 配線基体および電子装置
JP2022553973A JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2022553973A Division JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置

Publications (2)

Publication Number Publication Date
JP2024050679A JP2024050679A (ja) 2024-04-10
JP2024050679A5 true JP2024050679A5 (cg-RX-API-DMAC7.html) 2025-03-31

Family

ID=80950381

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022553973A Active JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置
JP2024009105A Pending JP2024050679A (ja) 2020-09-30 2024-01-25 配線基体および電子装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2022553973A Active JP7428821B2 (ja) 2020-09-30 2021-09-28 配線基体および電子装置

Country Status (5)

Country Link
US (1) US20240074035A1 (cg-RX-API-DMAC7.html)
EP (1) EP4224519A4 (cg-RX-API-DMAC7.html)
JP (2) JP7428821B2 (cg-RX-API-DMAC7.html)
CN (1) CN116235293A (cg-RX-API-DMAC7.html)
WO (1) WO2022071256A1 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115343812B (zh) * 2022-08-22 2023-10-17 德阳三环科技有限公司 输入输出构件和制备方法及封装基座和光器件

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3170030B2 (ja) * 1992-03-17 2001-05-28 新光電気工業株式会社 高周波用電子部品の信号線路
US6891731B1 (en) * 1999-11-01 2005-05-10 Advanced Micro Devices, Inc. Crosstalk cancellation for integrated circuit package configuration
US6624729B2 (en) * 2000-12-29 2003-09-23 Hewlett-Packard Development Company, L.P. Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board
JP2006086293A (ja) 2004-09-15 2006-03-30 Canon Inc プリント配線基板及び該配線基板のグランドパターン設計方法
CN102986308A (zh) * 2010-12-03 2013-03-20 株式会社村田制作所 高频信号线路
JP5842850B2 (ja) * 2012-06-29 2016-01-13 株式会社村田製作所 フラットケーブルおよび電子機器
JP6272131B2 (ja) * 2014-05-02 2018-01-31 日本電信電話株式会社 光モジュール
JP5943167B2 (ja) * 2014-05-29 2016-06-29 株式会社村田製作所 高周波信号線路及びこれを備えた電子機器
CN107534023B (zh) * 2015-05-20 2020-11-06 京瓷株式会社 半导体元件封装件、半导体装置以及安装构造体
JP6441850B2 (ja) * 2016-03-31 2018-12-19 Ritaエレクトロニクス株式会社 多層プリント配線板
JP6724648B2 (ja) * 2016-08-16 2020-07-15 富士ゼロックス株式会社 配線基板
JP6825986B2 (ja) * 2017-05-26 2021-02-03 京セラ株式会社 配線基板、電子部品収納用パッケージおよび電子装置
JP6939603B2 (ja) * 2018-01-26 2021-09-22 住友電気工業株式会社 光受信モジュール用パッケージ
JP7100487B2 (ja) * 2018-04-27 2022-07-13 京セラ株式会社 印刷配線板
US12068420B2 (en) * 2019-03-07 2024-08-20 Kyocera Corporation Wiring board, electronic component package, and electronic apparatus

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