JP2023543732A - 表面修飾されたシリカ粒子およびかかる粒子を含む組成物 - Google Patents

表面修飾されたシリカ粒子およびかかる粒子を含む組成物 Download PDF

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Publication number
JP2023543732A
JP2023543732A JP2023518346A JP2023518346A JP2023543732A JP 2023543732 A JP2023543732 A JP 2023543732A JP 2023518346 A JP2023518346 A JP 2023518346A JP 2023518346 A JP2023518346 A JP 2023518346A JP 2023543732 A JP2023543732 A JP 2023543732A
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JP
Japan
Prior art keywords
silica particles
modified silica
alkoxyorganosilane
composition
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023518346A
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English (en)
Japanese (ja)
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JP2023543732A5 (https=
Inventor
ジャキノート，エリック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merck Patent GmbH
Original Assignee
Merck Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Publication of JP2023543732A publication Critical patent/JP2023543732A/ja
Publication of JP2023543732A5 publication Critical patent/JP2023543732A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/146—After-treatment of sols
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/146—After-treatment of sols
    • C01B33/149—Coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Silicon Compounds (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2023518346A 2020-09-23 2021-09-21 表面修飾されたシリカ粒子およびかかる粒子を含む組成物 Pending JP2023543732A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20306085.0 2020-09-23
EP20306085 2020-09-23
PCT/EP2021/075868 WO2022063742A1 (en) 2020-09-23 2021-09-21 Surface-modified silica particles and compositions comprising such particles

Publications (2)

Publication Number Publication Date
JP2023543732A true JP2023543732A (ja) 2023-10-18
JP2023543732A5 JP2023543732A5 (https=) 2025-12-11

Family

ID=72840437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023518346A Pending JP2023543732A (ja) 2020-09-23 2021-09-21 表面修飾されたシリカ粒子およびかかる粒子を含む組成物

Country Status (7)

Country Link
US (1) US20230374346A1 (https=)
EP (1) EP4217312A1 (https=)
JP (1) JP2023543732A (https=)
KR (1) KR20230070232A (https=)
CN (1) CN116323485A (https=)
TW (1) TWI902906B (https=)
WO (1) WO2022063742A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025210929A1 (ja) * 2024-04-05 2025-10-09 株式会社アドマテックス 球状複合酸化物粒子材料及びその製造方法、スラリー組成物並びに透明樹脂組成物

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008512871A (ja) * 2004-09-08 2008-04-24 プラックセアー エス．ティ．テクノロジー、 インコーポレイテッド メタレート変性シリカ粒子を含有する水性スラリー
JP2011020208A (ja) * 2009-07-15 2011-02-03 Hitachi Chem Co Ltd Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法
JP2017122134A (ja) * 2014-05-22 2017-07-13 日立化成株式会社 金属膜用研磨液及びそれを用いた研磨方法
JP2017128504A (ja) * 2011-03-14 2017-07-27 アクゾ ノーベル ケミカルズ インターナショナル ベスローテン フエンノートシャップＡｋｚｏ Ｎｏｂｅｌ Ｃｈｅｍｉｃａｌｓ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｂ．Ｖ． 改質シリカ粒子
US20190211228A1 (en) * 2018-01-09 2019-07-11 Cabot Microelectronics Corporation Tungsten bulk polishing method with improved topography
JP2019135297A (ja) * 2013-05-15 2019-08-15 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ Ｎ−ビニル−ホモポリマーおよびｎ−ビニルコポリマーからなる群から選択される１種または複数のポリマーを含む化学機械研磨組成物
US20190375643A1 (en) * 2018-06-12 2019-12-12 Evonik Degussa Gmbh Increased particle loading by surface modification with polyethersilane

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL3319906T3 (pl) * 2015-07-10 2022-01-31 Evonik Operations Gmbh Zawierająca SiO2 dyspersja o wysokiej stabilności soli
EP3368633B1 (en) * 2015-10-26 2020-05-27 Evonik Operations GmbH Method of obtaining mineral oil using a silica fluid
US9783702B1 (en) * 2016-10-19 2017-10-10 Rohm And Haas Electronic Materials Cmp Holdings Inc. Aqueous compositions of low abrasive silica particles
US10647887B2 (en) * 2018-01-08 2020-05-12 Cabot Microelectronics Corporation Tungsten buff polishing compositions with improved topography
US20200102475A1 (en) * 2018-09-28 2020-04-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mecahnical polishing composition and method of polishing silcon dioxide over silicon nitiride
US10759970B2 (en) * 2018-12-19 2020-09-01 Fujifilm Electronic Materials U.S.A., Inc. Polishing compositions and methods of using same
US11198797B2 (en) 2019-01-24 2021-12-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions having stabilized abrasive particles for polishing dielectric substrates

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008512871A (ja) * 2004-09-08 2008-04-24 プラックセアー エス．ティ．テクノロジー、 インコーポレイテッド メタレート変性シリカ粒子を含有する水性スラリー
JP2011020208A (ja) * 2009-07-15 2011-02-03 Hitachi Chem Co Ltd Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法
JP2017128504A (ja) * 2011-03-14 2017-07-27 アクゾ ノーベル ケミカルズ インターナショナル ベスローテン フエンノートシャップＡｋｚｏ Ｎｏｂｅｌ Ｃｈｅｍｉｃａｌｓ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｂ．Ｖ． 改質シリカ粒子
JP2019135297A (ja) * 2013-05-15 2019-08-15 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ Ｎ−ビニル−ホモポリマーおよびｎ−ビニルコポリマーからなる群から選択される１種または複数のポリマーを含む化学機械研磨組成物
JP2017122134A (ja) * 2014-05-22 2017-07-13 日立化成株式会社 金属膜用研磨液及びそれを用いた研磨方法
US20190211228A1 (en) * 2018-01-09 2019-07-11 Cabot Microelectronics Corporation Tungsten bulk polishing method with improved topography
US20190375643A1 (en) * 2018-06-12 2019-12-12 Evonik Degussa Gmbh Increased particle loading by surface modification with polyethersilane

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025210929A1 (ja) * 2024-04-05 2025-10-09 株式会社アドマテックス 球状複合酸化物粒子材料及びその製造方法、スラリー組成物並びに透明樹脂組成物

Also Published As

Publication number Publication date
EP4217312A1 (en) 2023-08-02
TWI902906B (zh) 2025-11-01
CN116323485A (zh) 2023-06-23
TW202219208A (zh) 2022-05-16
KR20230070232A (ko) 2023-05-22
WO2022063742A1 (en) 2022-03-31
US20230374346A1 (en) 2023-11-23

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