TWI902906B - 經表面修飾之氧化矽粒子及包含此粒子之組合物 - Google Patents

經表面修飾之氧化矽粒子及包含此粒子之組合物

Info

Publication number
TWI902906B
TWI902906B TW110135028A TW110135028A TWI902906B TW I902906 B TWI902906 B TW I902906B TW 110135028 A TW110135028 A TW 110135028A TW 110135028 A TW110135028 A TW 110135028A TW I902906 B TWI902906 B TW I902906B
Authority
TW
Taiwan
Prior art keywords
composition
silicon oxide
particles
silica particles
oxide particles
Prior art date
Application number
TW110135028A
Other languages
English (en)
Chinese (zh)
Other versions
TW202219208A (zh
Inventor
埃里克 雅基諾
Original Assignee
德商馬克專利公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商馬克專利公司 filed Critical 德商馬克專利公司
Publication of TW202219208A publication Critical patent/TW202219208A/zh
Application granted granted Critical
Publication of TWI902906B publication Critical patent/TWI902906B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/146—After-treatment of sols
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/146—After-treatment of sols
    • C01B33/149—Coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Silicon Compounds (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW110135028A 2020-09-23 2021-09-22 經表面修飾之氧化矽粒子及包含此粒子之組合物 TWI902906B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP20306085.0 2020-09-23
EP20306085 2020-09-23

Publications (2)

Publication Number Publication Date
TW202219208A TW202219208A (zh) 2022-05-16
TWI902906B true TWI902906B (zh) 2025-11-01

Family

ID=72840437

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110135028A TWI902906B (zh) 2020-09-23 2021-09-22 經表面修飾之氧化矽粒子及包含此粒子之組合物

Country Status (7)

Country Link
US (1) US20230374346A1 (https=)
EP (1) EP4217312A1 (https=)
JP (1) JP2023543732A (https=)
KR (1) KR20230070232A (https=)
CN (1) CN116323485A (https=)
TW (1) TWI902906B (https=)
WO (1) WO2022063742A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025210929A1 (ja) * 2024-04-05 2025-10-09 株式会社アドマテックス 球状複合酸化物粒子材料及びその製造方法、スラリー組成物並びに透明樹脂組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107922198A (zh) * 2015-07-10 2018-04-17 赢创德固赛有限公司 具有高盐稳定性的含SiO2的分散体
US20190375643A1 (en) * 2018-06-12 2019-12-12 Evonik Degussa Gmbh Increased particle loading by surface modification with polyethersilane
TW202024285A (zh) * 2018-12-19 2020-07-01 美商富士軟片電子材料美國股份有限公司 研磨組成物及其使用方法
CN111566175A (zh) * 2018-01-08 2020-08-21 嘉柏微电子材料股份公司 具有经改善的形貌的钨磨光抛光组合物
CN111566785A (zh) * 2018-01-09 2020-08-21 嘉柏微电子材料股份公司 具有经改善的形貌的钨大量抛光方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070037892A1 (en) * 2004-09-08 2007-02-15 Irina Belov Aqueous slurry containing metallate-modified silica particles
JP5493528B2 (ja) * 2009-07-15 2014-05-14 日立化成株式会社 Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法
RU2584987C2 (ru) * 2011-03-14 2016-05-27 Акцо Нобель Кемикалз Интернэшнл Б.В. Модифицированные частицы диоксида кремния
US10090159B2 (en) * 2013-05-15 2018-10-02 Basf Se Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of N-vinyl-homopolymers and N-vinyl copolymers
JP2017122134A (ja) * 2014-05-22 2017-07-13 日立化成株式会社 金属膜用研磨液及びそれを用いた研磨方法
EP3368633B1 (en) * 2015-10-26 2020-05-27 Evonik Operations GmbH Method of obtaining mineral oil using a silica fluid
US9783702B1 (en) * 2016-10-19 2017-10-10 Rohm And Haas Electronic Materials Cmp Holdings Inc. Aqueous compositions of low abrasive silica particles
US20200102475A1 (en) * 2018-09-28 2020-04-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mecahnical polishing composition and method of polishing silcon dioxide over silicon nitiride
US11198797B2 (en) 2019-01-24 2021-12-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions having stabilized abrasive particles for polishing dielectric substrates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107922198A (zh) * 2015-07-10 2018-04-17 赢创德固赛有限公司 具有高盐稳定性的含SiO2的分散体
CN111566175A (zh) * 2018-01-08 2020-08-21 嘉柏微电子材料股份公司 具有经改善的形貌的钨磨光抛光组合物
CN111566785A (zh) * 2018-01-09 2020-08-21 嘉柏微电子材料股份公司 具有经改善的形貌的钨大量抛光方法
US20190375643A1 (en) * 2018-06-12 2019-12-12 Evonik Degussa Gmbh Increased particle loading by surface modification with polyethersilane
TW202024285A (zh) * 2018-12-19 2020-07-01 美商富士軟片電子材料美國股份有限公司 研磨組成物及其使用方法

Also Published As

Publication number Publication date
EP4217312A1 (en) 2023-08-02
CN116323485A (zh) 2023-06-23
JP2023543732A (ja) 2023-10-18
TW202219208A (zh) 2022-05-16
KR20230070232A (ko) 2023-05-22
WO2022063742A1 (en) 2022-03-31
US20230374346A1 (en) 2023-11-23

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