CN116323485A - 经表面改性的二氧化硅颗粒和包含该颗粒的组合物 - Google Patents

经表面改性的二氧化硅颗粒和包含该颗粒的组合物 Download PDF

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Publication number
CN116323485A
CN116323485A CN202180064555.0A CN202180064555A CN116323485A CN 116323485 A CN116323485 A CN 116323485A CN 202180064555 A CN202180064555 A CN 202180064555A CN 116323485 A CN116323485 A CN 116323485A
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CN
China
Prior art keywords
silica particles
modified silica
composition
alkoxyorganosilane
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180064555.0A
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English (en)
Chinese (zh)
Inventor
E·贾奎诺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merck Patent GmbH
Original Assignee
Merck Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Publication of CN116323485A publication Critical patent/CN116323485A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/146—After-treatment of sols
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/146—After-treatment of sols
    • C01B33/149—Coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Silicon Compounds (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN202180064555.0A 2020-09-23 2021-09-21 经表面改性的二氧化硅颗粒和包含该颗粒的组合物 Pending CN116323485A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20306085.0 2020-09-23
EP20306085 2020-09-23
PCT/EP2021/075868 WO2022063742A1 (en) 2020-09-23 2021-09-21 Surface-modified silica particles and compositions comprising such particles

Publications (1)

Publication Number Publication Date
CN116323485A true CN116323485A (zh) 2023-06-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180064555.0A Pending CN116323485A (zh) 2020-09-23 2021-09-21 经表面改性的二氧化硅颗粒和包含该颗粒的组合物

Country Status (7)

Country Link
US (1) US20230374346A1 (https=)
EP (1) EP4217312A1 (https=)
JP (1) JP2023543732A (https=)
KR (1) KR20230070232A (https=)
CN (1) CN116323485A (https=)
TW (1) TWI902906B (https=)
WO (1) WO2022063742A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025210929A1 (ja) * 2024-04-05 2025-10-09 株式会社アドマテックス 球状複合酸化物粒子材料及びその製造方法、スラリー組成物並びに透明樹脂組成物

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008512871A (ja) * 2004-09-08 2008-04-24 プラックセアー エス．ティ．テクノロジー、 インコーポレイテッド メタレート変性シリカ粒子を含有する水性スラリー
JP2011020208A (ja) * 2009-07-15 2011-02-03 Hitachi Chem Co Ltd Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法
CN107964374A (zh) * 2016-10-19 2018-04-27 罗门哈斯电子材料Cmp控股股份有限公司 低磨损二氧化硅颗粒的水性组合物
US20190211227A1 (en) * 2018-01-08 2019-07-11 Cabot Microelectronics Corporation Tungsten buff polishing compositions with improved topography
US20190375643A1 (en) * 2018-06-12 2019-12-12 Evonik Degussa Gmbh Increased particle loading by surface modification with polyethersilane
US10723628B2 (en) * 2015-07-10 2020-07-28 Evonik Operations Gmbh SiO2 containing dispersion with high salt stability
CN111566785A (zh) * 2018-01-09 2020-08-21 嘉柏微电子材料股份公司 具有经改善的形貌的钨大量抛光方法
US10767103B2 (en) * 2015-10-26 2020-09-08 Evonik Operations Gmbh Method of obtaining mineral oil using a silica fluid

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2584987C2 (ru) * 2011-03-14 2016-05-27 Акцо Нобель Кемикалз Интернэшнл Б.В. Модифицированные частицы диоксида кремния
US10090159B2 (en) * 2013-05-15 2018-10-02 Basf Se Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of N-vinyl-homopolymers and N-vinyl copolymers
JP2017122134A (ja) * 2014-05-22 2017-07-13 日立化成株式会社 金属膜用研磨液及びそれを用いた研磨方法
US20200102475A1 (en) * 2018-09-28 2020-04-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mecahnical polishing composition and method of polishing silcon dioxide over silicon nitiride
US10759970B2 (en) * 2018-12-19 2020-09-01 Fujifilm Electronic Materials U.S.A., Inc. Polishing compositions and methods of using same
US11198797B2 (en) 2019-01-24 2021-12-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions having stabilized abrasive particles for polishing dielectric substrates

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008512871A (ja) * 2004-09-08 2008-04-24 プラックセアー エス．ティ．テクノロジー、 インコーポレイテッド メタレート変性シリカ粒子を含有する水性スラリー
JP2011020208A (ja) * 2009-07-15 2011-02-03 Hitachi Chem Co Ltd Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法
US10723628B2 (en) * 2015-07-10 2020-07-28 Evonik Operations Gmbh SiO2 containing dispersion with high salt stability
US10767103B2 (en) * 2015-10-26 2020-09-08 Evonik Operations Gmbh Method of obtaining mineral oil using a silica fluid
CN107964374A (zh) * 2016-10-19 2018-04-27 罗门哈斯电子材料Cmp控股股份有限公司 低磨损二氧化硅颗粒的水性组合物
US20190211227A1 (en) * 2018-01-08 2019-07-11 Cabot Microelectronics Corporation Tungsten buff polishing compositions with improved topography
CN111566785A (zh) * 2018-01-09 2020-08-21 嘉柏微电子材料股份公司 具有经改善的形貌的钨大量抛光方法
US20190375643A1 (en) * 2018-06-12 2019-12-12 Evonik Degussa Gmbh Increased particle loading by surface modification with polyethersilane

Also Published As

Publication number Publication date
EP4217312A1 (en) 2023-08-02
TWI902906B (zh) 2025-11-01
JP2023543732A (ja) 2023-10-18
TW202219208A (zh) 2022-05-16
KR20230070232A (ko) 2023-05-22
WO2022063742A1 (en) 2022-03-31
US20230374346A1 (en) 2023-11-23

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