KR20230070232A - 표면 개질된 실리카 입자 및 이러한 입자를 포함하는 조성물 - Google Patents

표면 개질된 실리카 입자 및 이러한 입자를 포함하는 조성물 Download PDF

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Publication number
KR20230070232A
KR20230070232A KR1020237011384A KR20237011384A KR20230070232A KR 20230070232 A KR20230070232 A KR 20230070232A KR 1020237011384 A KR1020237011384 A KR 1020237011384A KR 20237011384 A KR20237011384 A KR 20237011384A KR 20230070232 A KR20230070232 A KR 20230070232A
Authority
KR
South Korea
Prior art keywords
silica particles
modified silica
alkoxy
substrate
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237011384A
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English (en)
Korean (ko)
Inventor
에릭 자뀌노
Original Assignee
메르크 파텐트 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 메르크 파텐트 게엠베하 filed Critical 메르크 파텐트 게엠베하
Publication of KR20230070232A publication Critical patent/KR20230070232A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/146—After-treatment of sols
    • C01B33/149—Coating
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/146—After-treatment of sols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H01L21/3212—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Silicon Compounds (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020237011384A 2020-09-23 2021-09-21 표면 개질된 실리카 입자 및 이러한 입자를 포함하는 조성물 Pending KR20230070232A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20306085.0 2020-09-23
EP20306085 2020-09-23
PCT/EP2021/075868 WO2022063742A1 (en) 2020-09-23 2021-09-21 Surface-modified silica particles and compositions comprising such particles

Publications (1)

Publication Number Publication Date
KR20230070232A true KR20230070232A (ko) 2023-05-22

Family

ID=72840437

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237011384A Pending KR20230070232A (ko) 2020-09-23 2021-09-21 표면 개질된 실리카 입자 및 이러한 입자를 포함하는 조성물

Country Status (7)

Country Link
US (1) US20230374346A1 (https=)
EP (1) EP4217312A1 (https=)
JP (1) JP2023543732A (https=)
KR (1) KR20230070232A (https=)
CN (1) CN116323485A (https=)
TW (1) TWI902906B (https=)
WO (1) WO2022063742A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025210929A1 (ja) * 2024-04-05 2025-10-09 株式会社アドマテックス 球状複合酸化物粒子材料及びその製造方法、スラリー組成物並びに透明樹脂組成物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070037892A1 (en) * 2004-09-08 2007-02-15 Irina Belov Aqueous slurry containing metallate-modified silica particles
JP5493528B2 (ja) * 2009-07-15 2014-05-14 日立化成株式会社 Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法
RU2584987C2 (ru) * 2011-03-14 2016-05-27 Акцо Нобель Кемикалз Интернэшнл Б.В. Модифицированные частицы диоксида кремния
US10090159B2 (en) * 2013-05-15 2018-10-02 Basf Se Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of N-vinyl-homopolymers and N-vinyl copolymers
JP2017122134A (ja) * 2014-05-22 2017-07-13 日立化成株式会社 金属膜用研磨液及びそれを用いた研磨方法
PL3319906T3 (pl) * 2015-07-10 2022-01-31 Evonik Operations Gmbh Zawierająca SiO2 dyspersja o wysokiej stabilności soli
EP3368633B1 (en) * 2015-10-26 2020-05-27 Evonik Operations GmbH Method of obtaining mineral oil using a silica fluid
US9783702B1 (en) * 2016-10-19 2017-10-10 Rohm And Haas Electronic Materials Cmp Holdings Inc. Aqueous compositions of low abrasive silica particles
US10647887B2 (en) * 2018-01-08 2020-05-12 Cabot Microelectronics Corporation Tungsten buff polishing compositions with improved topography
US20190211228A1 (en) * 2018-01-09 2019-07-11 Cabot Microelectronics Corporation Tungsten bulk polishing method with improved topography
US11274043B2 (en) * 2018-06-12 2022-03-15 Evonik Operations Gmbh Increased particle loading by surface modification with polyethersilane
US20200102475A1 (en) * 2018-09-28 2020-04-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mecahnical polishing composition and method of polishing silcon dioxide over silicon nitiride
US10759970B2 (en) * 2018-12-19 2020-09-01 Fujifilm Electronic Materials U.S.A., Inc. Polishing compositions and methods of using same
US11198797B2 (en) 2019-01-24 2021-12-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions having stabilized abrasive particles for polishing dielectric substrates

Also Published As

Publication number Publication date
EP4217312A1 (en) 2023-08-02
TWI902906B (zh) 2025-11-01
CN116323485A (zh) 2023-06-23
JP2023543732A (ja) 2023-10-18
TW202219208A (zh) 2022-05-16
WO2022063742A1 (en) 2022-03-31
US20230374346A1 (en) 2023-11-23

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