JP2023543732A5 - - Google Patents
Info
- Publication number
- JP2023543732A5 JP2023543732A5 JP2023518346A JP2023518346A JP2023543732A5 JP 2023543732 A5 JP2023543732 A5 JP 2023543732A5 JP 2023518346 A JP2023518346 A JP 2023518346A JP 2023518346 A JP2023518346 A JP 2023518346A JP 2023543732 A5 JP2023543732 A5 JP 2023543732A5
- Authority
- JP
- Japan
- Prior art keywords
- silica particles
- aqueous dispersion
- alkoxyorganosilane
- brought
- optionally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20306085.0 | 2020-09-23 | ||
| EP20306085 | 2020-09-23 | ||
| PCT/EP2021/075868 WO2022063742A1 (en) | 2020-09-23 | 2021-09-21 | Surface-modified silica particles and compositions comprising such particles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023543732A JP2023543732A (ja) | 2023-10-18 |
| JP2023543732A5 true JP2023543732A5 (https=) | 2025-12-11 |
Family
ID=72840437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023518346A Pending JP2023543732A (ja) | 2020-09-23 | 2021-09-21 | 表面修飾されたシリカ粒子およびかかる粒子を含む組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230374346A1 (https=) |
| EP (1) | EP4217312A1 (https=) |
| JP (1) | JP2023543732A (https=) |
| KR (1) | KR20230070232A (https=) |
| CN (1) | CN116323485A (https=) |
| TW (1) | TWI902906B (https=) |
| WO (1) | WO2022063742A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025210929A1 (ja) * | 2024-04-05 | 2025-10-09 | 株式会社アドマテックス | 球状複合酸化物粒子材料及びその製造方法、スラリー組成物並びに透明樹脂組成物 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070037892A1 (en) * | 2004-09-08 | 2007-02-15 | Irina Belov | Aqueous slurry containing metallate-modified silica particles |
| JP5493528B2 (ja) * | 2009-07-15 | 2014-05-14 | 日立化成株式会社 | Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法 |
| RU2584987C2 (ru) * | 2011-03-14 | 2016-05-27 | Акцо Нобель Кемикалз Интернэшнл Б.В. | Модифицированные частицы диоксида кремния |
| US10090159B2 (en) * | 2013-05-15 | 2018-10-02 | Basf Se | Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of N-vinyl-homopolymers and N-vinyl copolymers |
| JP2017122134A (ja) * | 2014-05-22 | 2017-07-13 | 日立化成株式会社 | 金属膜用研磨液及びそれを用いた研磨方法 |
| PL3319906T3 (pl) * | 2015-07-10 | 2022-01-31 | Evonik Operations Gmbh | Zawierająca SiO2 dyspersja o wysokiej stabilności soli |
| EP3368633B1 (en) * | 2015-10-26 | 2020-05-27 | Evonik Operations GmbH | Method of obtaining mineral oil using a silica fluid |
| US9783702B1 (en) * | 2016-10-19 | 2017-10-10 | Rohm And Haas Electronic Materials Cmp Holdings Inc. | Aqueous compositions of low abrasive silica particles |
| US10647887B2 (en) * | 2018-01-08 | 2020-05-12 | Cabot Microelectronics Corporation | Tungsten buff polishing compositions with improved topography |
| US20190211228A1 (en) * | 2018-01-09 | 2019-07-11 | Cabot Microelectronics Corporation | Tungsten bulk polishing method with improved topography |
| US11274043B2 (en) * | 2018-06-12 | 2022-03-15 | Evonik Operations Gmbh | Increased particle loading by surface modification with polyethersilane |
| US20200102475A1 (en) * | 2018-09-28 | 2020-04-02 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mecahnical polishing composition and method of polishing silcon dioxide over silicon nitiride |
| US10759970B2 (en) * | 2018-12-19 | 2020-09-01 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of using same |
| US11198797B2 (en) | 2019-01-24 | 2021-12-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions having stabilized abrasive particles for polishing dielectric substrates |
-
2021
- 2021-09-21 WO PCT/EP2021/075868 patent/WO2022063742A1/en not_active Ceased
- 2021-09-21 CN CN202180064555.0A patent/CN116323485A/zh active Pending
- 2021-09-21 KR KR1020237011384A patent/KR20230070232A/ko active Pending
- 2021-09-21 JP JP2023518346A patent/JP2023543732A/ja active Pending
- 2021-09-21 US US18/027,720 patent/US20230374346A1/en active Pending
- 2021-09-21 EP EP21777548.5A patent/EP4217312A1/en active Pending
- 2021-09-22 TW TW110135028A patent/TWI902906B/zh active
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