JP2023531986A5 - - Google Patents
Info
- Publication number
- JP2023531986A5 JP2023531986A5 JP2022579787A JP2022579787A JP2023531986A5 JP 2023531986 A5 JP2023531986 A5 JP 2023531986A5 JP 2022579787 A JP2022579787 A JP 2022579787A JP 2022579787 A JP2022579787 A JP 2022579787A JP 2023531986 A5 JP2023531986 A5 JP 2023531986A5
- Authority
- JP
- Japan
- Prior art keywords
- superconducting metal
- layer
- depositing
- superconducting
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063042865P | 2020-06-23 | 2020-06-23 | |
| US63/042,865 | 2020-06-23 | ||
| PCT/US2021/038519 WO2021262741A1 (en) | 2020-06-23 | 2021-06-22 | Methods for fabricating superconducting integrated circuits |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023531986A JP2023531986A (ja) | 2023-07-26 |
| JP2023531986A5 true JP2023531986A5 (https=) | 2024-06-26 |
| JP7705897B2 JP7705897B2 (ja) | 2025-07-10 |
Family
ID=79281777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022579787A Active JP7705897B2 (ja) | 2020-06-23 | 2021-06-22 | 超伝導集積回路を製造する方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20230240154A1 (https=) |
| JP (1) | JP7705897B2 (https=) |
| WO (1) | WO2021262741A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9768371B2 (en) | 2012-03-08 | 2017-09-19 | D-Wave Systems Inc. | Systems and methods for fabrication of superconducting integrated circuits |
| EP4443484A3 (en) | 2017-02-01 | 2025-01-08 | D-Wave Systems Inc. | Systems and methods for fabrication of superconducting integrated circuits |
| US20200152851A1 (en) | 2018-11-13 | 2020-05-14 | D-Wave Systems Inc. | Systems and methods for fabricating superconducting integrated circuits |
| WO2020168097A1 (en) | 2019-02-15 | 2020-08-20 | D-Wave Systems Inc. | Kinetic inductance for couplers and compact qubits |
| US12367412B2 (en) | 2019-12-05 | 2025-07-22 | 1372934 B.C. Ltd. | Systems and methods for fabricating flux trap mitigating superconducting integrated circuits |
| US12376501B2 (en) | 2020-05-11 | 2025-07-29 | 1372934 B.C. Ltd. | Kinetic inductance devices, methods for fabricating kinetic inductance devices, and articles employing the same |
| JP2024526085A (ja) | 2021-06-11 | 2024-07-17 | シーク, インコーポレイテッド | 超伝導量子回路のための磁束バイアスのシステム及び方法 |
| US12392823B2 (en) | 2021-11-05 | 2025-08-19 | D-Wave Systems Inc. | Systems and methods for on-chip noise measurements |
| US20240145537A1 (en) * | 2022-10-31 | 2024-05-02 | Wolfspeed, Inc. | Semiconductor devices with additional mesa structures for reduced surface roughness |
| CN117460398B (zh) * | 2023-10-30 | 2026-01-13 | 本源量子计算科技(合肥)股份有限公司 | 超导线路及其制造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS613481A (ja) * | 1984-06-15 | 1986-01-09 | Nippon Telegr & Teleph Corp <Ntt> | トンネル型ジヨセフソン素子及びその作製方法 |
| US5290761A (en) * | 1992-10-19 | 1994-03-01 | E. I. Du Pont De Nemours And Company | Process for making oxide superconducting films by pulsed excimer laser ablation |
| JP3395299B2 (ja) * | 1993-11-08 | 2003-04-07 | ソニー株式会社 | 半導体装置の配線構造及び配線形成方法 |
| JPH0936112A (ja) * | 1995-07-24 | 1997-02-07 | Oki Electric Ind Co Ltd | Al配線の形成方法 |
| JP2004235252A (ja) * | 2003-01-28 | 2004-08-19 | Fujitsu Ltd | 超伝導素子及び超伝導機器 |
| EP3098865B1 (en) * | 2009-02-27 | 2018-10-03 | D-Wave Systems Inc. | Method for fabricating a superconducting integrated circuit |
| US10003005B2 (en) * | 2016-08-23 | 2018-06-19 | Northrop Grumman Systems Corporation | Superconductor device interconnect |
| EP4443484A3 (en) * | 2017-02-01 | 2025-01-08 | D-Wave Systems Inc. | Systems and methods for fabrication of superconducting integrated circuits |
| US10276504B2 (en) * | 2017-05-17 | 2019-04-30 | Northrop Grumman Systems Corporation | Preclean and deposition methodology for superconductor interconnects |
| US10763419B2 (en) * | 2017-06-02 | 2020-09-01 | Northrop Grumman Systems Corporation | Deposition methodology for superconductor interconnects |
| US11276727B1 (en) * | 2017-06-19 | 2022-03-15 | Rigetti & Co, Llc | Superconducting vias for routing electrical signals through substrates and their methods of manufacture |
| US10243132B1 (en) * | 2018-03-23 | 2019-03-26 | International Business Machines Corporation | Vertical josephson junction superconducting device |
| US20200152851A1 (en) * | 2018-11-13 | 2020-05-14 | D-Wave Systems Inc. | Systems and methods for fabricating superconducting integrated circuits |
-
2021
- 2021-06-22 JP JP2022579787A patent/JP7705897B2/ja active Active
- 2021-06-22 US US18/010,283 patent/US20230240154A1/en active Pending
- 2021-06-22 WO PCT/US2021/038519 patent/WO2021262741A1/en not_active Ceased
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