JP7705897B2 - 超伝導集積回路を製造する方法 - Google Patents

超伝導集積回路を製造する方法 Download PDF

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JP7705897B2
JP7705897B2 JP2022579787A JP2022579787A JP7705897B2 JP 7705897 B2 JP7705897 B2 JP 7705897B2 JP 2022579787 A JP2022579787 A JP 2022579787A JP 2022579787 A JP2022579787 A JP 2022579787A JP 7705897 B2 JP7705897 B2 JP 7705897B2
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superconducting
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superconducting metal
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ヒョプ オ，ビョン
ジー． ラディジンスキー，エリック
ヤオ，ジェイ．ジェイソン
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ディー－ウェイブ システムズ インコーポレイテッド
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
    • G06N10/40—Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/383—Quantum effect devices, e.g. of devices using quantum reflection, diffraction or interference effects
    • H10D48/3835—Semiconductor qubit devices comprising a plurality of quantum mechanically interacting semiconductor quantum dots, e.g. Loss-DiVincenzo spin qubits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0912—Manufacture or treatment of Josephson-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/10—Junction-based devices
    • H10N60/12—Josephson-effect devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Analysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Computing Systems (AREA)
  • Evolutionary Computation (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Computational Mathematics (AREA)
  • Artificial Intelligence (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2022579787A 2020-06-23 2021-06-22 超伝導集積回路を製造する方法 Active JP7705897B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063042865P 2020-06-23 2020-06-23
US63/042,865 2020-06-23
PCT/US2021/038519 WO2021262741A1 (en) 2020-06-23 2021-06-22 Methods for fabricating superconducting integrated circuits

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JP2023531986A JP2023531986A (ja) 2023-07-26
JP2023531986A5 JP2023531986A5 (https=) 2024-06-26
JP7705897B2 true JP7705897B2 (ja) 2025-07-10

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JP (1) JP7705897B2 (https=)
WO (1) WO2021262741A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9768371B2 (en) 2012-03-08 2017-09-19 D-Wave Systems Inc. Systems and methods for fabrication of superconducting integrated circuits
EP4443484A3 (en) 2017-02-01 2025-01-08 D-Wave Systems Inc. Systems and methods for fabrication of superconducting integrated circuits
US20200152851A1 (en) 2018-11-13 2020-05-14 D-Wave Systems Inc. Systems and methods for fabricating superconducting integrated circuits
WO2020168097A1 (en) 2019-02-15 2020-08-20 D-Wave Systems Inc. Kinetic inductance for couplers and compact qubits
US12367412B2 (en) 2019-12-05 2025-07-22 1372934 B.C. Ltd. Systems and methods for fabricating flux trap mitigating superconducting integrated circuits
US12376501B2 (en) 2020-05-11 2025-07-29 1372934 B.C. Ltd. Kinetic inductance devices, methods for fabricating kinetic inductance devices, and articles employing the same
JP2024526085A (ja) 2021-06-11 2024-07-17 シーク， インコーポレイテッド 超伝導量子回路のための磁束バイアスのシステム及び方法
US12392823B2 (en) 2021-11-05 2025-08-19 D-Wave Systems Inc. Systems and methods for on-chip noise measurements
US20240145537A1 (en) * 2022-10-31 2024-05-02 Wolfspeed, Inc. Semiconductor devices with additional mesa structures for reduced surface roughness
CN117460398B (zh) * 2023-10-30 2026-01-13 本源量子计算科技（合肥）股份有限公司 超导线路及其制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004235252A (ja) 2003-01-28 2004-08-19 Fujitsu Ltd 超伝導素子及び超伝導機器
US20180337138A1 (en) 2017-05-17 2018-11-22 Northrop Grumman Systems Corporation Preclean and deposition methodology for superconductor interconnects
WO2019036081A2 (en) 2017-06-02 2019-02-21 Northrop Grumman Systems Corporation DEPOSIT METHODOLOGY FOR SUPERCONDUCTING INTERCONNECTIONS
JP2019528577A (ja) 2016-08-23 2019-10-10 ノースロップ グラマン システムズ コーポレイションＮｏｒｔｈｒｏｐ Ｇｒｕｍｍａｎ Ｓｙｓｔｅｍｓ Ｃｏｒｐｏｒａｔｉｏｎ 超伝導デバイスの相互接続
JP2020509608A (ja) 2017-02-01 2020-03-26 ディー−ウェイブ システムズ インコーポレイテッド 超伝導集積回路の製造のためのシステム及び方法

Family Cites Families (8)

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JPS613481A (ja) * 1984-06-15 1986-01-09 Nippon Telegr & Teleph Corp <Ntt> トンネル型ジヨセフソン素子及びその作製方法
US5290761A (en) * 1992-10-19 1994-03-01 E. I. Du Pont De Nemours And Company Process for making oxide superconducting films by pulsed excimer laser ablation
JP3395299B2 (ja) * 1993-11-08 2003-04-07 ソニー株式会社 半導体装置の配線構造及び配線形成方法
JPH0936112A (ja) * 1995-07-24 1997-02-07 Oki Electric Ind Co Ltd Ａｌ配線の形成方法
EP3098865B1 (en) * 2009-02-27 2018-10-03 D-Wave Systems Inc. Method for fabricating a superconducting integrated circuit
US11276727B1 (en) * 2017-06-19 2022-03-15 Rigetti & Co, Llc Superconducting vias for routing electrical signals through substrates and their methods of manufacture
US10243132B1 (en) * 2018-03-23 2019-03-26 International Business Machines Corporation Vertical josephson junction superconducting device
US20200152851A1 (en) * 2018-11-13 2020-05-14 D-Wave Systems Inc. Systems and methods for fabricating superconducting integrated circuits

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004235252A (ja) 2003-01-28 2004-08-19 Fujitsu Ltd 超伝導素子及び超伝導機器
JP2019528577A (ja) 2016-08-23 2019-10-10 ノースロップ グラマン システムズ コーポレイションＮｏｒｔｈｒｏｐ Ｇｒｕｍｍａｎ Ｓｙｓｔｅｍｓ Ｃｏｒｐｏｒａｔｉｏｎ 超伝導デバイスの相互接続
JP2020509608A (ja) 2017-02-01 2020-03-26 ディー−ウェイブ システムズ インコーポレイテッド 超伝導集積回路の製造のためのシステム及び方法
US20180337138A1 (en) 2017-05-17 2018-11-22 Northrop Grumman Systems Corporation Preclean and deposition methodology for superconductor interconnects
WO2019036081A2 (en) 2017-06-02 2019-02-21 Northrop Grumman Systems Corporation DEPOSIT METHODOLOGY FOR SUPERCONDUCTING INTERCONNECTIONS

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WO2021262741A1 (en) 2021-12-30
US20230240154A1 (en) 2023-07-27
JP2023531986A (ja) 2023-07-26

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