JP2023520875A5 - - Google Patents
Info
- Publication number
- JP2023520875A5 JP2023520875A5 JP2022559399A JP2022559399A JP2023520875A5 JP 2023520875 A5 JP2023520875 A5 JP 2023520875A5 JP 2022559399 A JP2022559399 A JP 2022559399A JP 2022559399 A JP2022559399 A JP 2022559399A JP 2023520875 A5 JP2023520875 A5 JP 2023520875A5
- Authority
- JP
- Japan
- Prior art keywords
- colloidal silica
- silica particles
- approximately
- acid
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063002743P | 2020-03-31 | 2020-03-31 | |
| US63/002,743 | 2020-03-31 | ||
| PCT/US2021/024844 WO2021202500A1 (en) | 2020-03-31 | 2021-03-30 | Cmp composition including a novel abrasive |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023520875A JP2023520875A (ja) | 2023-05-22 |
| JP2023520875A5 true JP2023520875A5 (https=) | 2024-04-10 |
| JP7775213B2 JP7775213B2 (ja) | 2025-11-25 |
Family
ID=77855591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022559399A Active JP7775213B2 (ja) | 2020-03-31 | 2021-03-30 | 新規の研磨剤を含むｃｍｐ組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11725116B2 (https=) |
| EP (1) | EP4127089A4 (https=) |
| JP (1) | JP7775213B2 (https=) |
| KR (1) | KR20220156953A (https=) |
| CN (1) | CN115298276B (https=) |
| TW (1) | TWI785550B (https=) |
| WO (1) | WO2021202500A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023102392A1 (en) * | 2021-12-02 | 2023-06-08 | Versum Materials Us, Llc | Tungsten chemical mechanical polishing slurries |
| KR102771385B1 (ko) * | 2021-12-23 | 2025-02-26 | 주식회사 케이씨텍 | 연마 슬러리 조성물 |
| KR20250069933A (ko) * | 2022-09-22 | 2025-05-20 | 씨엠씨 머티리얼즈 엘엘씨 | 황 함유 음이온성 계면활성제를 포함하는 텅스텐 cmp 조성물 |
| KR20240126662A (ko) * | 2023-02-14 | 2024-08-21 | 에스케이엔펄스 주식회사 | 반도체 공정용 연마 조성물 및 이를 이용한 기판의 연마방법 |
| KR102911808B1 (ko) * | 2023-08-02 | 2026-01-12 | 한양대학교 산학협력단 | 금속막질 연마용 슬러리 조성물 |
| WO2026024912A1 (en) * | 2024-07-23 | 2026-01-29 | Entegris, Inc. | Compositions for chemical mechanical planarization and related systems and related methods |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6293848B1 (en) * | 1999-11-15 | 2001-09-25 | Cabot Microelectronics Corporation | Composition and method for planarizing surfaces |
| JP4231632B2 (ja) * | 2001-04-27 | 2009-03-04 | 花王株式会社 | 研磨液組成物 |
| US9303189B2 (en) | 2014-03-11 | 2016-04-05 | Cabot Microelectronics Corporation | Composition for tungsten CMP |
| US9303190B2 (en) * | 2014-03-24 | 2016-04-05 | Cabot Microelectronics Corporation | Mixed abrasive tungsten CMP composition |
| US9127187B1 (en) | 2014-03-24 | 2015-09-08 | Cabot Microelectronics Corporation | Mixed abrasive tungsten CMP composition |
| JP6412714B2 (ja) | 2014-04-16 | 2018-10-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| EP3261114B1 (en) * | 2015-02-19 | 2021-01-13 | Fujimi Incorporated | Composition for silicon wafer polishing and polishing method |
| KR101741707B1 (ko) | 2015-02-27 | 2017-05-30 | 유비머트리얼즈주식회사 | 연마 슬러리 및 이를 이용한 기판 연마 방법 |
| JP2019050307A (ja) * | 2017-09-11 | 2019-03-28 | 株式会社フジミインコーポレーテッド | 研磨方法、ならびに研磨用組成物およびその製造方法 |
| TWI723284B (zh) * | 2017-09-15 | 2021-04-01 | 美商Ｃｍｃ材料股份有限公司 | 鎢化學機械拋光(cmp)之組合物 |
-
2021
- 2021-03-30 TW TW110111502A patent/TWI785550B/zh active
- 2021-03-30 US US17/217,097 patent/US11725116B2/en active Active
- 2021-03-30 CN CN202180022398.7A patent/CN115298276B/zh active Active
- 2021-03-30 WO PCT/US2021/024844 patent/WO2021202500A1/en not_active Ceased
- 2021-03-30 JP JP2022559399A patent/JP7775213B2/ja active Active
- 2021-03-30 KR KR1020227037590A patent/KR20220156953A/ko active Pending
- 2021-03-30 EP EP21780412.9A patent/EP4127089A4/en active Pending
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