JP2023126759A5 - - Google Patents
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- JP2023126759A5 JP2023126759A5 JP2023092916A JP2023092916A JP2023126759A5 JP 2023126759 A5 JP2023126759 A5 JP 2023126759A5 JP 2023092916 A JP2023092916 A JP 2023092916A JP 2023092916 A JP2023092916 A JP 2023092916A JP 2023126759 A5 JP2023126759 A5 JP 2023126759A5
- Authority
- JP
- Japan
- Prior art keywords
- photolithography system
- during
- data
- stabilization
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025116329A JP2025165943A (ja) | 2019-02-15 | 2025-07-10 | デジタルリソグラフィツールのためのモデルベース動的位置補正 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/277,805 US10996572B2 (en) | 2019-02-15 | 2019-02-15 | Model based dynamic positional correction for digital lithography tools |
| US16/277,805 | 2019-02-15 | ||
| PCT/US2020/013861 WO2020167408A1 (en) | 2019-02-15 | 2020-01-16 | Model based dynamic positional correction for digital lithography tools |
| JP2021547456A JP7292397B2 (ja) | 2019-02-15 | 2020-01-16 | デジタルリソグラフィツールのためのモデルベース動的位置補正 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021547456A Division JP7292397B2 (ja) | 2019-02-15 | 2020-01-16 | デジタルリソグラフィツールのためのモデルベース動的位置補正 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025116329A Division JP2025165943A (ja) | 2019-02-15 | 2025-07-10 | デジタルリソグラフィツールのためのモデルベース動的位置補正 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023126759A JP2023126759A (ja) | 2023-09-12 |
| JP2023126759A5 true JP2023126759A5 (enExample) | 2025-07-29 |
Family
ID=72040798
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021547456A Active JP7292397B2 (ja) | 2019-02-15 | 2020-01-16 | デジタルリソグラフィツールのためのモデルベース動的位置補正 |
| JP2023092916A Pending JP2023126759A (ja) | 2019-02-15 | 2023-06-06 | デジタルリソグラフィツールのためのモデルベース動的位置補正 |
| JP2025116329A Pending JP2025165943A (ja) | 2019-02-15 | 2025-07-10 | デジタルリソグラフィツールのためのモデルベース動的位置補正 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021547456A Active JP7292397B2 (ja) | 2019-02-15 | 2020-01-16 | デジタルリソグラフィツールのためのモデルベース動的位置補正 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025116329A Pending JP2025165943A (ja) | 2019-02-15 | 2025-07-10 | デジタルリソグラフィツールのためのモデルベース動的位置補正 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10996572B2 (enExample) |
| JP (3) | JP7292397B2 (enExample) |
| KR (2) | KR102717090B1 (enExample) |
| CN (2) | CN118092083A (enExample) |
| TW (2) | TWI754209B (enExample) |
| WO (1) | WO2020167408A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102263718B1 (ko) * | 2019-06-10 | 2021-06-11 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
| US11481922B2 (en) * | 2020-04-07 | 2022-10-25 | Kla Corporation | Online navigational drift correction for metrology measurements |
| CN116540489A (zh) * | 2023-04-23 | 2023-08-04 | 上海华力集成电路制造有限公司 | 针对光刻中光罩热效应的修正方法 |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL9000503A (nl) * | 1990-03-05 | 1991-10-01 | Asm Lithography Bv | Apparaat en werkwijze voor het afbeelden van een maskerpatroon op een substraat. |
| JP3048508B2 (ja) * | 1994-11-04 | 2000-06-05 | キヤノン株式会社 | 位置決めステージ装置およびこれを用いた露光装置 |
| JP4308460B2 (ja) | 2001-09-27 | 2009-08-05 | 富士フイルム株式会社 | 画像記録装置 |
| KR100431329B1 (ko) | 2001-10-11 | 2004-05-12 | 삼성전자주식회사 | 반도체 웨이퍼 오버레이 보정방법 |
| JP4307140B2 (ja) | 2003-04-25 | 2009-08-05 | キヤノン株式会社 | 光学素子位置決め装置、それを用いた露光装置、デバイスの製造方法 |
| JP3978158B2 (ja) | 2003-07-02 | 2007-09-19 | 株式会社日立ハイテクノロジーズ | 電子線描画装置 |
| US7009359B2 (en) * | 2003-08-08 | 2006-03-07 | Asml Holding N.V. | Foam core chuck for the scanning stage of a lithography system |
| US7250237B2 (en) | 2003-12-23 | 2007-07-31 | Asml Netherlands B.V. | Optimized correction of wafer thermal deformations in a lithographic process |
| US7025280B2 (en) * | 2004-01-30 | 2006-04-11 | Tokyo Electron Limited | Adaptive real time control of a reticle/mask system |
| JP4760705B2 (ja) * | 2004-03-01 | 2011-08-31 | 株式会社ニコン | 事前計測処理方法、露光システム及び基板処理装置 |
| US7561251B2 (en) * | 2004-03-29 | 2009-07-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7453063B2 (en) | 2004-12-08 | 2008-11-18 | Asml Netherlands B.V. | Calibration substrate and method for calibrating a lithographic apparatus |
| JP2006293314A (ja) | 2005-02-08 | 2006-10-26 | Fuji Photo Film Co Ltd | 画像形成装置および画像形成方法 |
| JP2006295148A (ja) * | 2005-03-18 | 2006-10-26 | Canon Inc | 露光装置 |
| US7663732B2 (en) * | 2005-03-18 | 2010-02-16 | Canon Kabushiki Kaisha | Exposure apparatus, exposure method and device manufacturing method for compensating position measuring system using temperature |
| US7184853B2 (en) | 2005-05-18 | 2007-02-27 | Infineon Technologies Richmond, Lp | Lithography method and system with correction of overlay offset errors caused by wafer processing |
| WO2007030704A2 (en) * | 2005-09-09 | 2007-03-15 | Brion Technologies, Inc. | System and method for mask verification using an individual mask error model |
| US7830493B2 (en) | 2005-10-04 | 2010-11-09 | Asml Netherlands B.V. | System and method for compensating for radiation induced thermal distortions in a substrate or projection system |
| US7645546B2 (en) | 2006-02-06 | 2010-01-12 | Macronix International Co., Ltd. | Method for determining an overlay correlation set |
| WO2008001891A1 (en) * | 2006-06-30 | 2008-01-03 | Hitachi High-Technologies Corporation | Inspecting device, and inspecting method |
| CN101144976B (zh) * | 2007-10-30 | 2011-03-23 | 中国科学院电工研究所 | 一种光刻系统掩模邻近效应校正方法 |
| JP2009238922A (ja) | 2008-03-26 | 2009-10-15 | Nikon Corp | 露光装置、露光方法及びデバイスの製造方法 |
| DE102008042356A1 (de) * | 2008-09-25 | 2010-04-08 | Carl Zeiss Smt Ag | Projektionsbelichtungsanlage mit optimierter Justagemöglichkeit |
| NL2003223A (en) * | 2008-09-30 | 2010-03-31 | Asml Netherlands Bv | Projection system, lithographic apparatus, method of postitioning an optical element and method of projecting a beam of radiation onto a substrate. |
| US9052604B2 (en) | 2008-11-06 | 2015-06-09 | Micron Technology, Inc. | Photolithography systems and associated alignment correction methods |
| US20100259761A1 (en) * | 2009-04-08 | 2010-10-14 | Nikon Corporation | Robust Long Wire Resistance Thermometer |
| NL2004815A (en) | 2009-06-17 | 2010-12-20 | Asml Netherlands Bv | Method of overlay measurement, lithographic apparatus, inspection apparatus, processing apparatus and lithographic processing cell. |
| CN102445149B (zh) | 2010-10-14 | 2014-02-19 | 上海微电子装备有限公司 | 一种工件台位置测量装置与测量方法 |
| NL2010196A (en) * | 2012-02-09 | 2013-08-13 | Asml Netherlands Bv | Lens heating aware source mask optimization for advanced lithography. |
| JP5879234B2 (ja) * | 2012-09-03 | 2016-03-08 | 株式会社ニューフレアテクノロジー | マスク描画装置、電子ビームの補正方法 |
| JP6035105B2 (ja) | 2012-10-05 | 2016-11-30 | 株式会社Screenホールディングス | 画像記録装置および画像記録方法 |
| US9430593B2 (en) | 2012-10-11 | 2016-08-30 | Kla-Tencor Corporation | System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking |
| KR102166879B1 (ko) * | 2014-03-10 | 2020-10-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 다중 하전-입자 빔 리소그래피를 위한 픽셀 블렌딩 |
| US20160148850A1 (en) | 2014-11-25 | 2016-05-26 | Stream Mosaic, Inc. | Process control techniques for semiconductor manufacturing processes |
| US9499906B2 (en) * | 2015-02-13 | 2016-11-22 | Eastman Kodak Company | Coating substrate using bernoulli atomic-layer deposition |
| WO2017067752A1 (en) | 2015-10-19 | 2017-04-27 | Asml Netherlands B.V. | Method and apparatus to correct for patterning process error |
| DE102016205987B4 (de) * | 2016-04-11 | 2018-01-25 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit mindestens einem Manipulator und Verfahren zum Steuern einer Projektionsbelichtungsanlage |
| US10401704B2 (en) | 2016-11-11 | 2019-09-03 | Asml Netherlands B.V. | Compensating for a physical effect in an optical system |
| US10444643B2 (en) * | 2017-03-24 | 2019-10-15 | Nikon Research Corporation Of America | Lithographic thermal distortion compensation with the use of machine learning |
| US10534257B2 (en) * | 2017-05-01 | 2020-01-14 | Lam Research Corporation | Layout pattern proximity correction through edge placement error prediction |
-
2019
- 2019-02-15 US US16/277,805 patent/US10996572B2/en active Active
-
2020
- 2020-01-16 JP JP2021547456A patent/JP7292397B2/ja active Active
- 2020-01-16 KR KR1020217029491A patent/KR102717090B1/ko active Active
- 2020-01-16 CN CN202410249817.6A patent/CN118092083A/zh active Pending
- 2020-01-16 KR KR1020247033611A patent/KR20240151279A/ko active Pending
- 2020-01-16 WO PCT/US2020/013861 patent/WO2020167408A1/en not_active Ceased
- 2020-01-16 CN CN202080019314.XA patent/CN113544594B/zh active Active
- 2020-01-21 TW TW109102168A patent/TWI754209B/zh active
- 2020-01-21 TW TW110149464A patent/TWI789191B/zh active
-
2021
- 2021-03-30 US US17/217,799 patent/US12379671B2/en active Active
-
2023
- 2023-06-06 JP JP2023092916A patent/JP2023126759A/ja active Pending
-
2025
- 2025-07-10 JP JP2025116329A patent/JP2025165943A/ja active Pending
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