JP2023120061A5 - - Google Patents

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Publication number
JP2023120061A5
JP2023120061A5 JP2022023245A JP2022023245A JP2023120061A5 JP 2023120061 A5 JP2023120061 A5 JP 2023120061A5 JP 2022023245 A JP2022023245 A JP 2022023245A JP 2022023245 A JP2022023245 A JP 2022023245A JP 2023120061 A5 JP2023120061 A5 JP 2023120061A5
Authority
JP
Japan
Prior art keywords
semiconductor element
wiring member
main electrode
surface facing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022023245A
Other languages
English (en)
Japanese (ja)
Other versions
JP7689653B2 (ja
JP2023120061A (ja
Filing date
Publication date
Priority claimed from JP2022023245A external-priority patent/JP7689653B2/ja
Priority to JP2022023245A priority Critical patent/JP7689653B2/ja
Application filed filed Critical
Priority to PCT/JP2023/000865 priority patent/WO2023157522A1/ja
Priority to CN202380022010.2A priority patent/CN118696411A/zh
Publication of JP2023120061A publication Critical patent/JP2023120061A/ja
Publication of JP2023120061A5 publication Critical patent/JP2023120061A5/ja
Priority to US18/802,821 priority patent/US20240404981A1/en
Priority to JP2025080054A priority patent/JP2025114782A/ja
Priority to JP2025080055A priority patent/JP2025109841A/ja
Publication of JP7689653B2 publication Critical patent/JP7689653B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022023245A 2022-02-17 2022-02-17 半導体装置 Active JP7689653B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2022023245A JP7689653B2 (ja) 2022-02-17 2022-02-17 半導体装置
PCT/JP2023/000865 WO2023157522A1 (ja) 2022-02-17 2023-01-13 半導体装置
CN202380022010.2A CN118696411A (zh) 2022-02-17 2023-01-13 半导体装置
US18/802,821 US20240404981A1 (en) 2022-02-17 2024-08-13 Semiconductor device
JP2025080055A JP2025109841A (ja) 2022-02-17 2025-05-12 半導体装置
JP2025080054A JP2025114782A (ja) 2022-02-17 2025-05-12 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022023245A JP7689653B2 (ja) 2022-02-17 2022-02-17 半導体装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2025080054A Division JP2025114782A (ja) 2022-02-17 2025-05-12 半導体装置
JP2025080055A Division JP2025109841A (ja) 2022-02-17 2025-05-12 半導体装置

Publications (3)

Publication Number Publication Date
JP2023120061A JP2023120061A (ja) 2023-08-29
JP2023120061A5 true JP2023120061A5 (enExample) 2024-01-19
JP7689653B2 JP7689653B2 (ja) 2025-06-09

Family

ID=87578094

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2022023245A Active JP7689653B2 (ja) 2022-02-17 2022-02-17 半導体装置
JP2025080054A Pending JP2025114782A (ja) 2022-02-17 2025-05-12 半導体装置
JP2025080055A Pending JP2025109841A (ja) 2022-02-17 2025-05-12 半導体装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2025080054A Pending JP2025114782A (ja) 2022-02-17 2025-05-12 半導体装置
JP2025080055A Pending JP2025109841A (ja) 2022-02-17 2025-05-12 半導体装置

Country Status (4)

Country Link
US (1) US20240404981A1 (enExample)
JP (3) JP7689653B2 (enExample)
CN (1) CN118696411A (enExample)
WO (1) WO2023157522A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3719506B2 (ja) * 2001-12-19 2005-11-24 株式会社デンソー 半導体装置及びその製造方法
JP6686691B2 (ja) * 2016-05-16 2020-04-22 株式会社デンソー 電子装置
JP6958529B2 (ja) * 2018-10-02 2021-11-02 株式会社デンソー 半導体装置
JP7139862B2 (ja) * 2018-10-15 2022-09-21 株式会社デンソー 半導体装置
JP7452233B2 (ja) * 2020-05-01 2024-03-19 株式会社デンソー 半導体装置および電力変換装置

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