JP2023101384A - 積層型電子部品 - Google Patents
積層型電子部品 Download PDFInfo
- Publication number
- JP2023101384A JP2023101384A JP2022178062A JP2022178062A JP2023101384A JP 2023101384 A JP2023101384 A JP 2023101384A JP 2022178062 A JP2022178062 A JP 2022178062A JP 2022178062 A JP2022178062 A JP 2022178062A JP 2023101384 A JP2023101384 A JP 2023101384A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- multilayer electronic
- electrode
- insulating layer
- component according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220002964A KR20230107048A (ko) | 2022-01-07 | 2022-01-07 | 적층형 전자 부품 |
| KR10-2022-0002964 | 2022-01-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023101384A true JP2023101384A (ja) | 2023-07-20 |
| JP2023101384A5 JP2023101384A5 (enExample) | 2025-10-24 |
Family
ID=87057170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022178062A Pending JP2023101384A (ja) | 2022-01-07 | 2022-11-07 | 積層型電子部品 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12354803B2 (enExample) |
| JP (1) | JP2023101384A (enExample) |
| KR (1) | KR20230107048A (enExample) |
| CN (1) | CN116417261A (enExample) |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4479747B2 (ja) * | 2007-05-30 | 2010-06-09 | Tdk株式会社 | 積層コンデンサ |
| JP4835686B2 (ja) * | 2008-12-22 | 2011-12-14 | Tdk株式会社 | 積層コンデンサ |
| KR101422926B1 (ko) | 2012-10-26 | 2014-07-23 | 삼성전기주식회사 | 적층 칩 전자부품 및 그 실장 기판 |
| JP5920303B2 (ja) * | 2013-09-25 | 2016-05-18 | 株式会社村田製作所 | 電子部品およびその製造方法 |
| JP5920304B2 (ja) * | 2013-09-25 | 2016-05-18 | 株式会社村田製作所 | 電子部品およびその製造方法 |
| JP6156345B2 (ja) * | 2014-12-10 | 2017-07-05 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP6592923B2 (ja) | 2015-03-20 | 2019-10-23 | 株式会社村田製作所 | 電子部品およびその製造方法 |
| JP6421138B2 (ja) * | 2016-03-25 | 2018-11-07 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| KR101883061B1 (ko) * | 2016-09-08 | 2018-07-27 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조방법 |
| JP2018046131A (ja) * | 2016-09-14 | 2018-03-22 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| KR102715894B1 (ko) | 2016-11-21 | 2024-10-11 | 삼성전기주식회사 | 커패시터 및 그 제조 방법 |
| JP7019946B2 (ja) * | 2016-12-05 | 2022-02-16 | 株式会社村田製作所 | 積層コンデンサ内蔵基板 |
| KR101992450B1 (ko) * | 2017-08-23 | 2019-06-25 | 삼성전기주식회사 | 커패시터 부품 및 그 제조 방법 |
| JP7017893B2 (ja) * | 2017-09-25 | 2022-02-09 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| KR102620541B1 (ko) * | 2018-08-22 | 2024-01-03 | 삼성전기주식회사 | 커패시터 부품 |
| JP7221616B2 (ja) * | 2018-08-27 | 2023-02-14 | 太陽誘電株式会社 | セラミック電子部品、セラミック電子部品の製造方法および電子部品実装回路基板 |
| KR102142515B1 (ko) * | 2018-10-17 | 2020-08-07 | 삼성전기주식회사 | 전자 부품 |
| JP2020088191A (ja) * | 2018-11-27 | 2020-06-04 | 株式会社村田製作所 | 積層セラミック電子部品 |
| JP7275951B2 (ja) * | 2019-07-16 | 2023-05-18 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP7115461B2 (ja) * | 2019-12-12 | 2022-08-09 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JP7522585B2 (ja) * | 2020-06-01 | 2024-07-25 | 太陽誘電株式会社 | 電子部品、回路基板および電子部品の製造方法 |
| JP2022142214A (ja) * | 2021-03-16 | 2022-09-30 | 太陽誘電株式会社 | セラミック電子部品、実装基板およびセラミック電子部品の製造方法 |
| JP2022142212A (ja) * | 2021-03-16 | 2022-09-30 | 太陽誘電株式会社 | セラミック電子部品、実装基板およびセラミック電子部品の製造方法 |
| JP2022142213A (ja) * | 2021-03-16 | 2022-09-30 | 太陽誘電株式会社 | セラミック電子部品、実装基板およびセラミック電子部品の製造方法 |
-
2022
- 2022-01-07 KR KR1020220002964A patent/KR20230107048A/ko active Pending
- 2022-10-25 US US17/972,722 patent/US12354803B2/en active Active
- 2022-11-07 JP JP2022178062A patent/JP2023101384A/ja active Pending
-
2023
- 2023-01-05 CN CN202310012932.7A patent/CN116417261A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230107048A (ko) | 2023-07-14 |
| CN116417261A (zh) | 2023-07-11 |
| US20230223195A1 (en) | 2023-07-13 |
| US12354803B2 (en) | 2025-07-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251016 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251016 |