JP2023056187A - PtRu合金めっき液及びPtRu合金膜のめっき方法 - Google Patents

PtRu合金めっき液及びPtRu合金膜のめっき方法 Download PDF

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Publication number
JP2023056187A
JP2023056187A JP2021165368A JP2021165368A JP2023056187A JP 2023056187 A JP2023056187 A JP 2023056187A JP 2021165368 A JP2021165368 A JP 2021165368A JP 2021165368 A JP2021165368 A JP 2021165368A JP 2023056187 A JP2023056187 A JP 2023056187A
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JP
Japan
Prior art keywords
plating solution
ptru alloy
concentration
ptru
alloy plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021165368A
Other languages
English (en)
Japanese (ja)
Inventor
宏冶 片倉
Koji Katakura
量平 菊池
Ryohei Kikuchi
理▲か▼ 張
Like Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
EEJA Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EEJA Ltd filed Critical EEJA Ltd
Priority to JP2021165368A priority Critical patent/JP2023056187A/ja
Priority to TW111135733A priority patent/TWI820921B/zh
Priority to KR1020220123973A priority patent/KR20230050238A/ko
Priority to CN202211231454.0A priority patent/CN115948779A/zh
Publication of JP2023056187A publication Critical patent/JP2023056187A/ja
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/567Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2021165368A 2021-10-07 2021-10-07 PtRu合金めっき液及びPtRu合金膜のめっき方法 Pending JP2023056187A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021165368A JP2023056187A (ja) 2021-10-07 2021-10-07 PtRu合金めっき液及びPtRu合金膜のめっき方法
TW111135733A TWI820921B (zh) 2021-10-07 2022-09-21 PtRu合金鍍敷液及PtRu合金膜之鍍敷方法
KR1020220123973A KR20230050238A (ko) 2021-10-07 2022-09-29 PtRu 합금 도금액 및 PtRu 합금막의 도금 방법
CN202211231454.0A CN115948779A (zh) 2021-10-07 2022-10-08 PtRu合金镀液及PtRu合金膜的镀覆方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021165368A JP2023056187A (ja) 2021-10-07 2021-10-07 PtRu合金めっき液及びPtRu合金膜のめっき方法

Publications (1)

Publication Number Publication Date
JP2023056187A true JP2023056187A (ja) 2023-04-19

Family

ID=85896403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021165368A Pending JP2023056187A (ja) 2021-10-07 2021-10-07 PtRu合金めっき液及びPtRu合金膜のめっき方法

Country Status (4)

Country Link
JP (1) JP2023056187A (ko)
KR (1) KR20230050238A (ko)
CN (1) CN115948779A (ko)
TW (1) TWI820921B (ko)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1779457A (en) 1927-10-07 1930-10-28 Baker & Co Inc Electrodeposition of platinum metals
JP3302949B2 (ja) 1999-08-03 2002-07-15 株式会社日鉱マテリアルズ 黒色ルテニウムめっき液
CN101332425B (zh) * 2008-08-04 2010-12-01 山东大学 纳米多孔金担载超薄铂系金属薄膜催化剂及其制备方法
DE102008050135B4 (de) * 2008-10-04 2010-08-05 Umicore Galvanotechnik Gmbh Verfahren zur Abscheidung von Platin-Rhodiumschichten mit verbesserter Helligkeit
JP5086485B1 (ja) * 2011-09-20 2012-11-28 Jx日鉱日石金属株式会社 電子部品用金属材料及びその製造方法
US8980460B2 (en) * 2012-02-07 2015-03-17 Battelle Memorial Institute Methods and electrolytes for electrodeposition of smooth films
CN103628102A (zh) * 2013-12-09 2014-03-12 深圳市嘉达高科产业发展有限公司 电镀液、Pt-Ru催化剂膜及其制备方法和膜燃料电池

Also Published As

Publication number Publication date
TWI820921B (zh) 2023-11-01
CN115948779A (zh) 2023-04-11
TW202319591A (zh) 2023-05-16
KR20230050238A (ko) 2023-04-14

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