US1779457A - Electrodeposition of platinum metals - Google Patents

Electrodeposition of platinum metals Download PDF

Info

Publication number
US1779457A
US1779457A US224764A US22476427A US1779457A US 1779457 A US1779457 A US 1779457A US 224764 A US224764 A US 224764A US 22476427 A US22476427 A US 22476427A US 1779457 A US1779457 A US 1779457A
Authority
US
United States
Prior art keywords
platinum
metal
nitrite
electrodeposition
electrolyte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US224764A
Inventor
Zschiegner Herbert Emil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Baker and Co Inc
Original Assignee
Baker and Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baker and Co Inc filed Critical Baker and Co Inc
Priority to US224764A priority Critical patent/US1779457A/en
Priority to DER75932D priority patent/DE549775C/en
Application granted granted Critical
Publication of US1779457A publication Critical patent/US1779457A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals

Definitions

  • This invention relates to the electro-deposition of platinum metals and especially to the electro-deposition of metals of the group compalladous chloride (PdCl 2H O) or rhodium trichloride RhCl are preferable; to this solution I add an excess of sodium nitrite and heat until the color change indicates a reaction after which I make the hot solution ammoniacal with ammonium hydroxide.
  • the sodium nitrite reacts with the metal chloride and forms a double nitrite of sodium and the metal, and upon the subsequent addition of ammonium hydroxide, as stated, an ammino nitrite of the metal is formed in solution in the ammoniacal bath and from such a bath the metal can be electrodeposited.
  • the electro-deposition is done from the hot solution with a potential of 4 to 10 volts and a current of 0.05 to 0.20 amperes per square inch.
  • An insoluble anode such as platinum or other precious metal, graphite, etc. may be used.
  • alloys of the metals platinum, palladium and rhodium can be electrodeposited from my bath if it be prepared from ammino nitrites of the metals to be deposited.
  • the preparation and use of such an alloy plating bath is analogous to the preparation and use of a single metal bath, as is more fully set forth hereinafter.
  • Example I 2 grams of chloroplatinic acid were dissolved in 140 c. c. distilled water and 3 grams of sodium nitrite added. This 4 Application flied October 7, 1927. Serial Io. 224,704.
  • the object to be plated was made the cathode and an anode of platinum was provided. I have found that the best results were obtained at 7 volts with a current density of 0.05 to 0.08 amperes per square inch of cathode surface while the bath is maintained at 7 5-95 C. A bright adherent plate of platinum was obtained.
  • ammino nitrite solutions are especially adapted for plating the precious metals on copper, nickel, gold or alloys such as brass or white gold, and other precious metal alloys used in ewelry or scientific instruments.
  • An electrolyte for the electro-deposition of a metal of the group comprising platinum, palladium and rhodium comprising the heat treated aqueous solution of a chloride of said metal and an excess of sodium nitrite containing an excess of ammonia.
  • An electrolyte for the electrode -osition of a metal of the group, platinum, pa ladium and rhodium comprising an ammoniacal aqueous solution of the reaction product of a chloride of the metal with an alkali metal nitrite.
  • An electrolyte for the electrodeposition of platinum comprising an ammoniacal aqueous solution of the reaction product of a chloride of platinum with an alkali metal nitrite.
  • An electrolyte for the electrodeposition of platinum comprising an ammoniacal aqueous solution of the reaction product of a chloride of platinum with sodium nitrite.
  • Method of preparing an electrolyte for the electrodeposition of metals of the group comprising platinum, palladium and rhodium which comprises treating an aqueous solution of a chloride of the metal to be deposited with an excess of an alkali metal nitrite until a reaction has taken place and then adding an excess of ammonia.
  • Method for the preparation of an electrolyte for the electro-deposition of a. metal or alloy of the group comprising platinum, palladium and rhodium which comprises treating an aqueous solution of a chloride of said metal with an excess of sodium nitrite until a reaction has taken place and then adding an excess of ammonia.
  • An electrolyte for the electrodeposition of platinum containing in solution an ammino nitrite of platinum, the electrolyte being ammoniacal.

Description

Patented Oct. 28, 1930 UNITED STATES PATENT OFFICE HERBERT mun ZSCHIEGNEB, OI WOODBRIDGE, NEW JERSEY, ASSIGNOB, BY will! ASSIGNMENTS, TO BAKER & 00., INC., 0]? NEWARK, NEW JERSEY, A. CORPORATION 0! NEW JERSEY ELEC'IBODEPOSITION OF PLATINUM. mus
Io Drawing.
This invention relates to the electro-deposition of platinum metals and especially to the electro-deposition of metals of the group compalladous chloride (PdCl 2H O) or rhodium trichloride RhCl are preferable; to this solution I add an excess of sodium nitrite and heat until the color change indicates a reaction after which I make the hot solution ammoniacal with ammonium hydroxide. In the first part of this reaction, the sodium nitrite reacts with the metal chloride and forms a double nitrite of sodium and the metal, and upon the subsequent addition of ammonium hydroxide, as stated, an ammino nitrite of the metal is formed in solution in the ammoniacal bath and from such a bath the metal can be electrodeposited.
The electro-deposition is done from the hot solution with a potential of 4 to 10 volts and a current of 0.05 to 0.20 amperes per square inch. An insoluble anode such as platinum or other precious metal, graphite, etc. may be used.
I have also found that alloys of the metals platinum, palladium and rhodium can be electrodeposited from my bath if it be prepared from ammino nitrites of the metals to be deposited. The preparation and use of such an alloy plating bath is analogous to the preparation and use of a single metal bath, as is more fully set forth hereinafter.
Further details of my bath'and procedure are given in the following examples which show the preparation and use of a platinum plating bath and a platinum-rhodium alloy bath.
Example I.2 grams of chloroplatinic acid were dissolved in 140 c. c. distilled water and 3 grams of sodium nitrite added. This 4 Application flied October 7, 1927. Serial Io. 224,704.
solution was now heated at 85 to 90 C. until the orange color of the original solution was changed to colorless or a very pale yellow. This color change probably indicates a reduction from tetravalent to divalent platinum to form the complex salt sodium platinum nitrite. 5 c. c. of ammonium hydroxide (sp. gr. 0.90) was now added forming a platinum ammino nitrite after which the solution was ready for use.
The object to be plated was made the cathode and an anode of platinum was provided. I have found that the best results were obtained at 7 volts with a current density of 0.05 to 0.08 amperes per square inch of cathode surface while the bath is maintained at 7 5-95 C. A bright adherent plate of platinum was obtained.
Emample Il.+1.8 ams platinum chloride and 0.2 grams rho ium chloride were dissolved in 140 c. c. distilled water and 3 grams sodium nitrite added. This solution was now heated at 8590 C. until a change of color to a very pale yellow took place. 5 c. c. of ammonium hydroxide solution was now added. This solution when used as the electrolyte as described above with a platinum anode gave an adherent cathode deposit of approximately 90% platinum and 10% rhodium.
The ammino nitrite solutions are especially adapted for plating the precious metals on copper, nickel, gold or alloys such as brass or white gold, and other precious metal alloys used in ewelry or scientific instruments.
I have found that the concentration of my plating bath can be considerably varied and still good plating results will be obtained, and I do not wish to be limited to the exact quantities given. I have increased the platinic chloride concentration up to 3 times that given; the amount of nitrite and ammonia added is not critical and the proportions have been doubled and tripled without harmful efi'ects. Potassium or ammonium nitrite may be used.
Claims:
1. An electrolyte for the electro-deposition of a metal of the group comprising platinum, palladium and rhodium, comprising the heat treated aqueous solution of a chloride of said metal and an excess of sodium nitrite containing an excess of ammonia.
2. An electrolyte for the electrode -osition of a metal of the group, platinum, pa ladium and rhodium, comprising an ammoniacal aqueous solution of the reaction product of a chloride of the metal with an alkali metal nitrite.
3. An electrolyte for the electrode osition of a metal of the group, platinum, pa ladium and rhodium, com rising an ammoniacal aqueous solution 0 the reaction product of the chloride of the metal with sodium nitrite'.
4. An electrolyte for the electrodeposition of platinum comprising an ammoniacal aqueous solution of the reaction product of a chloride of platinum with an alkali metal nitrite.
5. An electrolyte for the electrodeposition of platinum comprising an ammoniacal aqueous solution of the reaction product of a chloride of platinum with sodium nitrite.
6. Method of preparing an electrolyte for the electrodeposition of metals of the group comprising platinum, palladium and rhodium which comprises treating an aqueous solution of a chloride of the metal to be deposited with an excess of an alkali metal nitrite until a reaction has taken place and then adding an excess of ammonia.
'7. Method for the preparation of an electrolyte for the electro-deposition of a. metal or alloy of the group comprising platinum, palladium and rhodium which comprises treating an aqueous solution of a chloride of said metal with an excess of sodium nitrite until a reaction has taken place and then adding an excess of ammonia.
8. An electrolyte for the electrodeposition of a metal or alloy of the group platinum, palladium and rhodium, containing in solution an ammino nitrite of the metal to be deposited, the electrolyte being ammoniacal.
9. An electrolyte for the electrodeposition of platinum containing in solution an ammino nitrite of platinum, the electrolyte being ammoniacal.
Signed at Perth Amboy in the county of Middlesex and State of New Jersey this 3rd day of October, A. D. 1927.
HERBERT EMIL ZSGHIIEIGNER.
US224764A 1927-10-07 1927-10-07 Electrodeposition of platinum metals Expired - Lifetime US1779457A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US224764A US1779457A (en) 1927-10-07 1927-10-07 Electrodeposition of platinum metals
DER75932D DE549775C (en) 1927-10-07 1928-10-05 Process for generating electrolytic deposits of metals of the platinum group

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US224764A US1779457A (en) 1927-10-07 1927-10-07 Electrodeposition of platinum metals

Publications (1)

Publication Number Publication Date
US1779457A true US1779457A (en) 1930-10-28

Family

ID=22842094

Family Applications (1)

Application Number Title Priority Date Filing Date
US224764A Expired - Lifetime US1779457A (en) 1927-10-07 1927-10-07 Electrodeposition of platinum metals

Country Status (2)

Country Link
US (1) US1779457A (en)
DE (1) DE549775C (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3013956A (en) * 1957-04-05 1961-12-19 Baldwin Piano Co Methods of etching metals in the platinum group and producing printed circuits therefrom
US3296102A (en) * 1961-08-01 1967-01-03 Exxon Research Engineering Co Catalysts and electrodes for electrochemical cells
US3356538A (en) * 1964-09-29 1967-12-05 Gen Electric Electrodeposited ion exchange membrane and method of forming
US3444003A (en) * 1965-09-30 1969-05-13 Leesona Corp Multilayer catalytic electrode having a layer of noble metal and lead and a surface layer free of lead and method of constructing same
US4285784A (en) * 1980-07-10 1981-08-25 The United States Of America As Represented By The Secretary Of The Interior Process of electroplating a platinum-rhodium alloy coating
US6306277B1 (en) 2000-01-14 2001-10-23 Honeywell International Inc. Platinum electrolyte for use in electrolytic plating
WO2010037495A1 (en) * 2008-10-04 2010-04-08 Umicore Galvanotechnik Gmbh Process for the deposition of platinum-rhodium layers having improved whiteness
KR20230050238A (en) 2021-10-07 2023-04-14 이이쟈 가부시키가이샤 PtRu ALLOY PLATING SOLUTION AND METHOD FOR PLATING PtRu ALLOY FILM

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3013956A (en) * 1957-04-05 1961-12-19 Baldwin Piano Co Methods of etching metals in the platinum group and producing printed circuits therefrom
US3296102A (en) * 1961-08-01 1967-01-03 Exxon Research Engineering Co Catalysts and electrodes for electrochemical cells
US3356538A (en) * 1964-09-29 1967-12-05 Gen Electric Electrodeposited ion exchange membrane and method of forming
US3444003A (en) * 1965-09-30 1969-05-13 Leesona Corp Multilayer catalytic electrode having a layer of noble metal and lead and a surface layer free of lead and method of constructing same
US4285784A (en) * 1980-07-10 1981-08-25 The United States Of America As Represented By The Secretary Of The Interior Process of electroplating a platinum-rhodium alloy coating
US6306277B1 (en) 2000-01-14 2001-10-23 Honeywell International Inc. Platinum electrolyte for use in electrolytic plating
US6521113B2 (en) 2000-01-14 2003-02-18 Honeywell International Inc. Method of improving the oxidation resistance of a platinum modified aluminide diffusion coating
WO2010037495A1 (en) * 2008-10-04 2010-04-08 Umicore Galvanotechnik Gmbh Process for the deposition of platinum-rhodium layers having improved whiteness
KR20230050238A (en) 2021-10-07 2023-04-14 이이쟈 가부시키가이샤 PtRu ALLOY PLATING SOLUTION AND METHOD FOR PLATING PtRu ALLOY FILM

Also Published As

Publication number Publication date
DE549775C (en) 1932-05-02

Similar Documents

Publication Publication Date Title
JP2859316B2 (en) Platinum or platinum alloy electroplating bath and electroplating method
US4144141A (en) Ammonia free palladium deposition using aminoacetic acid
GB1282530A (en) Production of protective layers on cobalt-based alloys
US2452308A (en) Process of plating palladium and plating bath therefor
JP5887381B2 (en) Method for obtaining yellow gold alloy deposits by electroplating without using toxic or semi-metals
GB394637A (en) Method of producing galvanic deposits on aluminium and its alloys
US3489657A (en) Process for producing solderable aluminum materials
US1779457A (en) Electrodeposition of platinum metals
US2027358A (en) Electrodeposition of metals of the platinum group
GB374003A (en) Improvements in tarnish resisting silver and process of producing it
US3530049A (en) Gold and ruthenium plating baths
GB1272536A (en) Electroplating solutions and process for electroplating using such solutions
US744170A (en) Process of depositing metallic coatings on metallic objects.
US2057638A (en) Process and bath for depositing ruthenium
EP0059452B1 (en) Palladium and palladium alloys electroplating procedure
US3892638A (en) Electrolyte and method for electrodepositing rhodium-ruthenium alloys
US3503799A (en) Method of preparing an electrode coated with a platinum metal
US2577365A (en) Rhodium plating
US3639219A (en) Iridium plating
US4297179A (en) Palladium electroplating bath and process
US3206382A (en) Electrodeposition of platinum or palladium
US2377229A (en) Electrolytic deposition of chromium
US1991995A (en) Platinum metal ammino cyanide plating bath and process for electrodeposition of platinum metal therefrom
Keitel et al. Electrodeposition of Platinum, Palladium and Rhodium
GB2101633A (en) Bath for the electrodeposition of ruthenium