JP2023030680A - 銅張積層板および電子回路基板 - Google Patents

銅張積層板および電子回路基板 Download PDF

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Publication number
JP2023030680A
JP2023030680A JP2021135935A JP2021135935A JP2023030680A JP 2023030680 A JP2023030680 A JP 2023030680A JP 2021135935 A JP2021135935 A JP 2021135935A JP 2021135935 A JP2021135935 A JP 2021135935A JP 2023030680 A JP2023030680 A JP 2023030680A
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JP
Japan
Prior art keywords
copper
liquid crystal
crystal polymer
clad laminate
structural unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021135935A
Other languages
English (en)
Japanese (ja)
Inventor
優美子 登
Yumiko NOBORI
雅貴 野口
Masaki Noguchi
央司 曾禰
Hisashi Sone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Eneos Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eneos Corp filed Critical Eneos Corp
Priority to JP2021135935A priority Critical patent/JP2023030680A/ja
Priority to PCT/JP2022/031742 priority patent/WO2023027076A1/fr
Priority to TW111131614A priority patent/TWI835254B/zh
Priority to CN202280056573.9A priority patent/CN117897273A/zh
Priority to KR1020247005412A priority patent/KR20240035854A/ko
Publication of JP2023030680A publication Critical patent/JP2023030680A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
JP2021135935A 2021-08-23 2021-08-23 銅張積層板および電子回路基板 Pending JP2023030680A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021135935A JP2023030680A (ja) 2021-08-23 2021-08-23 銅張積層板および電子回路基板
PCT/JP2022/031742 WO2023027076A1 (fr) 2021-08-23 2022-08-23 Plaque stratifiée cuivrée et carte de circuit électronique
TW111131614A TWI835254B (zh) 2021-08-23 2022-08-23 銅箔積層板及電子電路基板
CN202280056573.9A CN117897273A (zh) 2021-08-23 2022-08-23 覆铜层叠板及电子电路基板
KR1020247005412A KR20240035854A (ko) 2021-08-23 2022-08-23 동장 적층판 및 전자 회로 기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021135935A JP2023030680A (ja) 2021-08-23 2021-08-23 銅張積層板および電子回路基板

Publications (1)

Publication Number Publication Date
JP2023030680A true JP2023030680A (ja) 2023-03-08

Family

ID=85322854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021135935A Pending JP2023030680A (ja) 2021-08-23 2021-08-23 銅張積層板および電子回路基板

Country Status (5)

Country Link
JP (1) JP2023030680A (fr)
KR (1) KR20240035854A (fr)
CN (1) CN117897273A (fr)
TW (1) TWI835254B (fr)
WO (1) WO2023027076A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4014964B2 (ja) * 2001-10-24 2007-11-28 三井・デュポンフロロケミカル株式会社 フッ素樹脂積層体及びその製造方法
JP2008030464A (ja) * 2006-06-30 2008-02-14 Sumitomo Chemical Co Ltd 液晶ポリエステル積層フィルムの製造方法、および液晶ポリエステル積層フィルム
JP6182856B2 (ja) * 2012-12-05 2017-08-23 株式会社村田製作所 液晶ポリマーフィルムの製造方法
JP6252988B2 (ja) 2014-10-31 2017-12-27 住友金属鉱山株式会社 ２層銅張積層板及びその製造方法、並びにそれを用いたフレキシブル配線板及びその製造方法
JP6295013B2 (ja) * 2016-02-29 2018-03-14 ポリプラスチックス株式会社 液晶ポリマー粒子を含有する樹脂組成物、それを用いた成形体、及びそれらの製造方法
JP7491689B2 (ja) * 2019-12-27 2024-05-28 日鉄ケミカル＆マテリアル株式会社 樹脂フィルムの製造方法及び金属張積層板の製造方法
JP7518647B2 (ja) * 2020-03-31 2024-07-18 日鉄ケミカル＆マテリアル株式会社 樹脂組成物、その製造方法、樹脂フィルム及び金属張積層板

Also Published As

Publication number Publication date
TWI835254B (zh) 2024-03-11
KR20240035854A (ko) 2024-03-18
CN117897273A (zh) 2024-04-16
TW202321030A (zh) 2023-06-01
WO2023027076A1 (fr) 2023-03-02

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