JP2023024891A - 配線回路基板 - Google Patents

配線回路基板 Download PDF

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Publication number
JP2023024891A
JP2023024891A JP2022210574A JP2022210574A JP2023024891A JP 2023024891 A JP2023024891 A JP 2023024891A JP 2022210574 A JP2022210574 A JP 2022210574A JP 2022210574 A JP2022210574 A JP 2022210574A JP 2023024891 A JP2023024891 A JP 2023024891A
Authority
JP
Japan
Prior art keywords
opening
peripheral edge
circuit board
terminal portion
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022210574A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023024891A5 (enExample
Inventor
優作 玉木
Yusaku Tamaki
周作 柴田
Shusaku Shibata
鉄平 新納
Teppei Niino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021174535A external-priority patent/JP7204856B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of JP2023024891A publication Critical patent/JP2023024891A/ja
Publication of JP2023024891A5 publication Critical patent/JP2023024891A5/ja
Pending legal-status Critical Current

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Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B21/00—Head arrangements not specific to the method of recording or reproducing
    • G11B21/16—Supporting the heads; Supporting the sockets for plug-in heads
    • G11B21/20—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier
    • G11B21/21—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
    • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2022210574A 2021-01-19 2022-12-27 配線回路基板 Pending JP2023024891A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021006128 2021-01-19
JP2021006128 2021-01-19
JP2021174535A JP7204856B2 (ja) 2021-01-19 2021-10-26 配線回路基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2021174535A Division JP7204856B2 (ja) 2021-01-19 2021-10-26 配線回路基板

Publications (2)

Publication Number Publication Date
JP2023024891A true JP2023024891A (ja) 2023-02-17
JP2023024891A5 JP2023024891A5 (enExample) 2024-10-28

Family

ID=82549656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022210574A Pending JP2023024891A (ja) 2021-01-19 2022-12-27 配線回路基板

Country Status (5)

Country Link
US (1) US20240090128A1 (enExample)
JP (1) JP2023024891A (enExample)
KR (1) KR20230133292A (enExample)
TW (1) TW202231138A (enExample)
WO (1) WO2022158118A1 (enExample)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011049316A (ja) * 2009-08-26 2011-03-10 Nitto Denko Corp 配線回路基板およびその製造方法
WO2017209296A1 (ja) * 2016-06-03 2017-12-07 大日本印刷株式会社 貫通電極基板及びその製造方法、並びに実装基板
JP2018045748A (ja) * 2016-09-15 2018-03-22 日東電工株式会社 回路付サスペンション基板、および、回路付サスペンション基板の製造方法
JP2019212675A (ja) * 2018-05-31 2019-12-12 日東電工株式会社 配線回路基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001209918A (ja) * 1999-11-19 2001-08-03 Nitto Denko Corp 回路付サスペンション基板
JP2008028376A (ja) * 2006-06-20 2008-02-07 Sanyo Electric Co Ltd 回路基板、半導体モジュールおよび回路基板の製造方法
JP2009129490A (ja) * 2007-11-21 2009-06-11 Nitto Denko Corp 配線回路基板
JP5762119B2 (ja) 2011-05-06 2015-08-12 日東電工株式会社 回路付きサスペンション基板およびその製造方法
JP5513637B2 (ja) * 2013-02-07 2014-06-04 日東電工株式会社 配線回路基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011049316A (ja) * 2009-08-26 2011-03-10 Nitto Denko Corp 配線回路基板およびその製造方法
WO2017209296A1 (ja) * 2016-06-03 2017-12-07 大日本印刷株式会社 貫通電極基板及びその製造方法、並びに実装基板
JP2018045748A (ja) * 2016-09-15 2018-03-22 日東電工株式会社 回路付サスペンション基板、および、回路付サスペンション基板の製造方法
JP2019212675A (ja) * 2018-05-31 2019-12-12 日東電工株式会社 配線回路基板

Also Published As

Publication number Publication date
WO2022158118A1 (ja) 2022-07-28
KR20230133292A (ko) 2023-09-19
US20240090128A1 (en) 2024-03-14
TW202231138A (zh) 2022-08-01

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