Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
  • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0237—High frequency adaptations
  • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
  • G11B21/00—Head arrangements not specific to the method of recording or reproducing
  • G11B21/16—Supporting the heads; Supporting the sockets for plug-in heads
  • G11B21/20—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier
  • G11B21/21—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
  • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
  • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
  • G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
  • G11B5/60—Fluid-dynamic spacing of heads from record-carriers
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09372—Pads and lands
  • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09372—Pads and lands
  • H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits

Definitions

• the present invention relates to a printed circuit board. Background technology
• a wired circuit board includes a metal supporting board, an insulating layer on the metal supporting board, and a conductor layer on the insulating layer.
• the conductor layer includes a wiring portion and a terminal portion connected to the wiring portion.
• the characteristic impedance of the terminal portion is adjusted for impedance matching between the wiring portion and the terminal portion.
• the characteristic impedance of the terminal section is adjusted, for example, by forming an opening facing the terminal section through an insulating layer in the metal supporting board.
• Patent Document 1 Prior art documents
• Patent Document 1 Japanese Unexamined Patent Application Publication No. 2012-235013 Outline of the Invention Problems to be Solved by the Invention
• the present invention provides a printed circuit board that is suitable for adjusting the characteristic impedance of the terminal portion while ensuring the supporting strength for the terminal portion.
• Means to solve problems [0006]
• the present invention [1] comprises a metal supporting substrate, an insulating layer, and a conductor layer in this order toward one side in the thickness direction, and the conductor layer includes at least one terminal portion, a wiring portion extending from the terminal portion, wherein the metal supporting substrate has an opening that penetrates the metal supporting substrate in the thickness direction and faces the terminal portion through the insulating layer;
• the opening has a first opening peripheral edge on one side in the thickness direction and a second opening peripheral edge on the other side in the thickness direction, and when projected in the thickness direction, the
• the second opening peripheral edge includes a printed circuit board arranged outside the first opening peripheral edge and extending along the first opening peripheral edge.
• the metal supporting substrate is formed with openings facing the terminal portions via the insulating layer.
• Such a configuration is suitable for adjusting the characteristic impedance of the terminal section.
• the second opening peripheral edge is arranged outside the first opening peripheral edge and extends along the first opening peripheral edge. That is, in the opening, the opening area of the end on one side in the thickness direction (terminal side) is relatively small, and the opening area of the end on the other side in the thickness direction is relatively large.
• Such a configuration is suitable for adjusting the characteristic impedance of the terminal portion by securing a wide opening space for the opening portion while suppressing a decrease in the supporting strength of the terminal portion due to the metal supporting board. Therefore, the wiring circuit board is suitable for adjusting the characteristic impedance of the terminal portion while ensuring the supporting strength for the terminal portion.
• the present invention [2] includes the wired circuit board according to [1] above, wherein, in the projection view, the entire peripheral edge of the first opening is arranged inside the terminal portion. ⁇
• Such a configuration is preferable from the viewpoint of ensuring the supporting strength of the terminal portion by the metal supporting substrate.
• the present invention [3] includes the wired circuit board according to [2] above, wherein, in the projection view, the entire peripheral edge of the second opening is arranged inside the terminal portion.
• the present invention [4] includes the wired circuit board according to [1] above, wherein, in the projection view, the entire peripheral edge of the first opening is arranged outside the terminal portion.
• Such a configuration is preferable from the viewpoint of securing a wide opening space for the opening.
• the present invention [5] is the wiring according to [2] or [4] above, wherein the entire peripheral edge of the second opening is arranged outside the terminal portion in the projection view. Including circuit boards.
• Such a configuration is preferable from the viewpoint of securing a wide opening space for the opening.
• the first opening peripheral edge is arranged inside the terminal part in the projection view, and outside the terminal part in the projection view.
• Such a configuration is preferable from the viewpoint of ensuring both the support strength of the terminal portion by the metal supporting substrate and the opening space of the opening.
• the present invention is the above [6], wherein the second opening peripheral edge includes a third portion arranged inside the terminal portion in the projection view and extending along the first portion. Including the printed circuit board according to.
• Such a configuration is preferable from the viewpoint of ensuring the supporting strength of the terminal portion by the metal supporting board.
• the second opening peripheral edge includes a fourth portion arranged outside the terminal portion in the projection view and extending along the first portion, the above [6]. Including the printed circuit board according to.
• Such a configuration is preferable from the viewpoint of securing a wide opening space for the opening.
• the conductor layer includes a plurality of the terminal portions, and the openings are The wired circuit board according to any one of the above [1] to [8], which faces the plurality of terminal portions via the insulating layer.
• Such a configuration is preferable from the viewpoint of increasing the density of the arrangement of the terminal portions.
• the opening has a curved wall surface that is arranged between the first opening peripheral edge and the second opening peripheral edge and is curved to bulge outward. and the printed circuit board according to any one of [1] to [9] above.
• Such a configuration is suitable for securing a wide opening space of the opening.
• the separation distance between the peripheral edge of the first opening and the peripheral edge of the second opening in the projection view is 20/ ⁇ m or more and 120/ ⁇ m
• the printed circuit board according to any one of the above [1] to [10] is included.
• Such a configuration is suitable for ensuring both support strength for the terminal portion and adjustment of the characteristic impedance of the terminal portion.
• the metal supporting substrate is 2 O jucm or more.
• the wired circuit board according to any one of [1] to [11] above, wherein
• FIG. 1 A partial plan view of a first embodiment of a wired circuit board of the present invention.
• Fig. 2 is a plan view of a terminal portion and its vicinity in the printed circuit board shown in Fig. 1.
• FIG. 3 A sectional view along line III-II! of Fig. 2.
• FIG. 4 A cross-sectional view taken along line IV-IV in Fig. 2.
• FIG. 5 An example of a manufacturing method of the printed circuit board shown in Fig. 1 is shown.
• 5A represents the base insulating layer forming process
• FIG. 5B represents the conductor layer forming process
• FIG. 5C represents the cover insulating layer forming process
• FIG. 5D represents the opening forming process.
• Fig. 6 is a partial cross-sectional view of a modification of the printed circuit board shown in Fig. 1; In this modified example, the opening of the metal supporting substrate has a shape that bulges outward in a vertical cross-sectional view.
• Fig. 7 is a partial cross-sectional view of a modification of the printed circuit board shown in Fig. 1; In this modified example, the terminal portion has a two-layer structure.
• Fig. 8 is a partial plan view of a modification of the printed circuit board shown in Fig. 1;
• the entire first opening peripheral edge of the opening of the metal supporting substrate is arranged inside the terminal section, and the entire second opening peripheral edge of the opening is located. is placed outside the terminal area.
• FIG. 9 A sectional view taken along line IX-IX in Fig. 8.
• FIG. 10 A cross-sectional view taken along line X-X in Fig. 8.
• Fig. 11 is a partial plan view of a modification of the printed circuit board shown in Fig. 1.
• Fig. 12 A sectional view taken along the line XII-XI! of Fig. 11.
• FIG. 13 A sectional view taken along the line XIII-XIII in Fig. 11.
• Fig. 14 is a partial plan view of a modification of the printed circuit board shown in Fig. 1;
• the first opening peripheral edge of the opening of the metal supporting board is divided into a first portion arranged inside the terminal portion and an outside portion arranged outside the terminal portion when viewed in thickness direction projection. and a second part that Also, in this modified example, the first portion extends in the first direction.
• Fig. 15 is a cross-sectional view taken along line XV-XV of Fig. 14;
• FIG. 16 A sectional view along line XVI-XV! of Fig. 14.
• Fig. 17 is a partial plan view of a modification of the printed circuit board shown in Fig. 1; In this modified example, in comparison with the modified examples shown in FIGS. 14 to 16, the end of the terminal portion on the side opposite to the wiring portion connection side is positioned above the opening in the thickness direction projection view.
• Fig. 18 is a partial plan view of a modification of the printed circuit board shown in Fig. 1;
• the end of the terminal portion opposite to the wiring connection side is positioned above the opening when viewed in thickness direction projection.
• the opening is open in the surface direction.
• Fig. 19 is a partial plan view of a modification of the printed circuit board shown in Fig. 1;
• the first opening peripheral edge of the opening of the metal supporting substrate comprises a first portion arranged inside the terminal portion and a second portion arranged outside the terminal portion when viewed in thickness direction projection. including.
• the first portion extends in the second direction.
• FIG. 20 A sectional view taken along line XX-XX in Fig. 19.
• FIG. 21 A sectional view along line XXI-XX! of Fig. 19.
• Fig. 22 is a partial plan view of a second embodiment of the wired circuit board of the present invention.
• FIG. 23 A cross-sectional view taken along line XXIII-XXIII in Fig. 22.
• FIG. 24 A cross-sectional view along line XXIV-XXIV in Fig. 22.
• Fig. 25 is a partial plan view of a modification of the wired circuit board shown in Fig. 22. [Fig. In this modification, the first opening peripheral edge of the opening of the metal supporting board is divided into a first portion arranged inside the terminal portion and an outside portion arranged outside the terminal portion when viewed in thickness direction projection. and a second part.
• FIG. 26 A sectional view along line XXVI-XXVI in Fig. 25.
• FIG. 27 A sectional view taken along line XXVII-XXVII of Fig. 25.
• FIG. 28 A partial plan view of a modification of the printed circuit board shown in Figs. 25 to 27. [Fig. In this modification, in comparison with the modification shown in FIG. 25, the end of each terminal on the side opposite to the wiring connection side is positioned above the opening in the thickness direction projection view.
• FIG. 29 A partial plan view of a modification of the wired circuit board shown in Figs. 25 to 27.
• the end of each terminal on the side opposite to the wiring connection side is positioned above the opening when viewed in thickness direction projection, and the opening The part is open in the plane direction.
• the wired circuit board X1 as the first embodiment of the wired circuit board of the present invention is as shown in FIG.
• a metal supporting board 10 As shown in FIGS. 1 to 4, a metal supporting board 10, an insulating layer 20 as a base insulating layer, a conductor layer 30, and an insulating layer 40 as a cover insulating layer are arranged in the thickness direction T. Prepare in this order towards one side.
• the printed circuit board X1 extends in a direction (surface direction) perpendicular to the thickness direction and has a predetermined plan view shape.
• Metal support board 1 O is a base material for ensuring the strength of the wiring circuit board X1.
• Materials for the metal support substrate 10 include, for example, stainless steel, copper, copper alloys, aluminum, nickel, titanium, and 42 alloy. Examples of stainless steel include SUS 304 based on AISI (American Iron and Steel Institute) standards.
• the metal supporting substrate 1 ⁇ preferably contains at least one selected from the group consisting of stainless steel, copper alloy, aluminum, nickel, and titanium, and more preferably, It consists of at least one selected from the group consisting of stainless steel, copper alloy, aluminum, nickel, and titanium. From the viewpoint of compatibility between the strength and conductivity of the metal supporting substrate 1 ⁇ , the metal supporting substrate 1 ⁇ is preferably made of a copper alloy.
• Metal support substrate 10 has a plurality of openings 10A. Each of the plurality of openings 1OA is formed corresponding to each of the plurality of terminal portions 31 described later. Details of the opening 10A will be described later.
• the thickness of the metal supporting substrate 10 is preferably 20 mm or more, more preferably 3 mm. M m or more, more preferably 40 M m or more, even more preferably 50 M m or more, particularly preferably 6 O jucm or more. Such a configuration is preferable from the viewpoint of ensuring the strength of the metal supporting substrate 10.
• the thickness of the metal support substrate 10 is preferably 250 mm or less, more preferably 200" m or less. Such a configuration ensures flexibility of the metal support substrate 10. preferable from this point of view.
• the insulating layer 20 is arranged on one side of the metal supporting substrate 10 in the thickness direction T.
• the insulating layer 20 is arranged on one surface in the thickness direction T of the metal supporting substrate 10.
• the material of the insulating layer 20 include resin materials such as polyimide, polyethernitrile, polyethersulfone, polyethylene terephthalate, polyethylene naphthalate, and polyvinyl chloride (the material of the insulating layer 40 described later). As a material, similar resin materials can be mentioned).
• the thickness of the insulating layer 20 is preferably 1 ⁇ m or more, more preferably 3 mm or more, and preferably 35 mm or less, more preferably 20 mm. U m or less.
• the conductor layer 30 is arranged on one side of the metal supporting board 10 in the thickness direction T.
• the conductor layer 30 is arranged on one surface in the thickness direction T of the metal supporting substrate 10.
• Examples of the material of the conductor layer 30 include copper, nickel, gold, and alloys thereof, preferably copper.
• the thickness of the conductor layer 30 is, for example, 1"m or more, preferably 3mm or more.
• the thickness of the conductor layer 30 is, for example, 50mm or less, preferably 30mm. It is below.
• the conductor layer 30 includes a plurality of terminal portions 31 and a plurality of wiring portions 32.
• the three terminal portions 31 are arranged in a row in the first direction D1 and are separated from each other, and the wiring portion extends from one side of the terminal portions 31 in the second direction D2 (perpendicular to the first direction D1).
• a case where 32 is extended is illustrated as an example.
• Examples of the planar shape of the terminal portion 31 include a circle, a square, and a square with rounded corners.
• Quadrilaterals include squares and rectangles.
• Rounded rectangles include rounded squares and rounded rectangles (the case where the terminal portion 31 has a rounded rectangle in plan view is illustrated as an example).
• the length L1 of the terminal portion 31 shown in FIG. 2 (the length of the terminal portion 31 in the first direction D1) is, for example, 1000 ⁇ m.
• the length L2 of the terminal portion 31 shown in FIG. 2 (the length of the terminal portion 31 in the second direction D2) is, for example, 10-1OOOum.
• the wiring part 32 has a predetermined pattern shape (not shown) on the insulating layer 20. As shown in FIG. One end of the wiring portion 32 is connected to the terminal portion 31 (in FIGS. 1 and 2, a portion of the wiring portion 32 covered with an insulating layer 40 described later is indicated by a dashed line). The other end of the wiring portion 32 is connected to, for example, another terminal portion 31 (not shown).
• the width of the wiring portion 32 (the dimension in the direction perpendicular to the extending direction of the wiring portion 32) is, for example, 5 mm or more, preferably 8 mm or more, and is, for example, 1 mm or less, preferably is 50 Mm or less.
• the insulating layer 40 is arranged on one side of the insulating layer 20 in the thickness direction T so as to cover a part of the conductor layer 30.
• the insulating layer 40 includes the wiring portion 3
• the thickness of the insulating layer 40 on the insulating layer 20 or in the wiring part 32 ⁇ is preferably is 2 Atm or more, more preferably 4/£m or more, and is preferably 60/£m or less, more preferably 40 jucm or less.
• the opening 10A penetrates the metal supporting substrate 10 in the thickness direction T.
• the opening 10A faces the terminal portion 31 through the insulating layer 20.
• Examples of the planar shape of the opening 10A include a circle, a rectangle, and a rounded rectangle.
• a quadrangle includes a square and a rectangle (the case where the planar view shape of the opening 10A is a rectangle is illustrated as an example).
• Rounded rectangles include rounded squares and rounded rectangles.
• the opening 10A preferably has substantially the same planar shape as the terminal 31.
• the opening 10A includes a first opening peripheral edge 11 on one side in the thickness direction T, a second opening peripheral edge 12 on the other side in the thickness direction T, and a first opening peripheral edge 12 on the other side in the thickness direction T. It has an edge 11 and an inner wall surface 13 between the second opening peripheral edge 12.
• the first opening peripheral edge 11 defines a first opening end 10a on one side (insulating layer 20 side) in the thickness direction T of the opening 10A. do.
• the second opening peripheral edge 12 defines the second opening end 10b on the other side in the thickness direction T of the opening 10A.
• the second opening peripheral edge 12 is arranged outside the first opening peripheral edge 11 and is positioned outside the first opening peripheral edge 11. Extends along 11.
• the opening area of the first opening end 10a is relatively small, and the opening area of the second opening end 10b is relatively large.
• the cross-sectional area of the opening 10A gradually increases from the first opening peripheral edge 11 to the second opening peripheral edge 12.
• the inner wall surface 13 is inclined.
• the separation distance d1 shown in FIG.
• first opening peripheral edge 11 and the second opening peripheral edge 12 in the projection view is preferably 2 ⁇ m or more, more preferably It is 30 mm or more, more preferably 40 mm or more.
• the separation distance d1 is preferably 12 Oum or less, more preferably 11 Oum or less, and still more preferably 10 Oum or less.
• the separation distance d2 (shown in Fig. 2) between the edge of the terminal portion 31 and the peripheral edge 11 of the first opening in the projection view is preferably 5 mm or more. , more preferably 1 ⁇ m or more.
• the separation distance d2 is preferably 400"m or less, more preferably 300 ⁇ m or less.
• the ratio of the length L3 (the length in the first direction D1) is preferably 0.3 or more and 0.98 or less.
• the ratio of the length L4 (the length in the second direction D2) shown in Fig. 2 is preferably 3 or more and 98 or less.
• the ratio of the length L5 (the length in the first direction D1) shown in Fig. 2 is preferably 0.31 or more and 0.99 or less.
• the ratio of the length L6 (the length in the second direction D2) shown in FIG. 2 of b is preferably 0.31 or more and 0.99 or less.
• FIGS. 5A to 5D show an example of a method for manufacturing the printed circuit board X1.
• 5A to 5D represent this manufacturing method as cross-sectional variations corresponding to FIG.
• the insulating layer 20 is formed, for example, as follows. First, a solution of photosensitive resin (varnish) is applied to the metal supporting substrate 1 ⁇ to form a coating film. The coating is then dried by heating. Next, the coating film is subjected to exposure processing through a predetermined mask, development processing after that, and baking processing if necessary. For example, as described above, the insulating layer 20 can be formed on the metal supporting substrate 1 ⁇ .
• a conductor layer 30 is formed on the insulating layer 20 (conductor layer forming step).
• a seed layer (not shown) is formed by a method. Seed layer materials include, for example, Cr, Cu, Ni, Ti, and alloys thereof.
• the seed layer may have a single layer structure or a multilayer structure of two or more layers. When the seed layer has a multi-layer structure, the seed layer consists, for example, of a chromium layer as a lower layer and a copper layer on the chromium layer.
• a resist pattern is formed on the seed layer. The resist pattern has an opening with a shape corresponding to the pattern shape of the conductor layer 30 .
• a resist pattern for example, after forming a resist film by bonding a photosensitive resist film on a seed layer, the resist film is exposed through a predetermined mask, and then developed. processed and then baked if necessary.
• the above metal is grown on the seed layer in the openings of the resist pattern by, for example, electrolytic plating.
• the resist pattern is removed by etching.
• the portion of the seed layer exposed by removing the resist pattern is removed by etching.
• the conductor layer 30 (the terminal portion 31 and the wiring portion 32) having a predetermined pattern can be formed as described above.
• an insulating layer 40 is formed on the insulating layer 20 so as to partially cover the conductor layer 30 (cover insulating layer forming step).
• the insulating layer 40 is formed, for example, as follows. First, a solution (varnish) of a photosensitive resin is applied on the insulating layer 20 and the conductor layer 30 to form a coating film. The coating is then dried. Next, the coating film is subjected to exposure processing through a predetermined mask, development processing after that, and baking processing if necessary.
• the insulating layer 40 can be formed as described above.
• an opening 10A is formed in the metal supporting substrate 10 (opening forming step).
• a resist pattern is formed on the other side of the metal supporting substrate 10 in the thickness direction T.
• the resist pattern has an opening having a shape corresponding to the shape of the second opening peripheral edge 12 of the opening 10A described above.
• a photosensitive resist film is laminated on the other surface of the metal supporting substrate 10 to form a resist film, and then the resist film is formed.
• the resist film is subjected to an exposure process through a predetermined mask, a subsequent development process, and then a baking process if necessary.
• the metal supporting substrate 10 is wet-etched from the other side in the thickness direction T (etching process).
• Etching solutions for etching include, for example, ferric chloride aqueous solutions and cupric chloride solutions.
• concentration of the etchant is, for example, 30-55 mass %.
• the temperature of the etchant is, for example, 20°C-55°C.
• the etching time is, for example, 1 to 15 minutes.
• the printed circuit board X1 can be manufactured.
• the opening 10A facing the terminal portion 31 via the insulating layer 20 is formed in the metal supporting board 10.
• the second opening peripheral edge 12 of the opening 10A is arranged outside the first opening peripheral edge 11 and is located outside the first opening peripheral edge 11. 1 extends along the perimeter edge 1 1 of the opening. That is, in the opening 10A, the first opening area at the end on one side (terminal side) in the thickness direction T is relatively small, and the second opening area at the end on the other side in the thickness direction T is relatively small. is relatively large.
• the printed circuit board X1 is suitable for adjusting the characteristic impedance of the terminal portion 31 while ensuring the supporting strength for the terminal portion 13.
• the opening 10A may have a shape that bulges outward in a vertical cross-sectional view, as shown in FIG. That is, the inner wall surface 13 of the opening 10A may be a curved wall surface (curved surface) that curves outward (the center of curvature of the curved surface is located within the opening 10A).
• the inner wall surface 13 of the opening 10A may be a curved wall surface (curved surface) that curves outward (the center of curvature of the curved surface is located within the opening 10A).
• Such a configuration reduces the area of the first opening end 10a of the opening 10, while reducing the opening 1. Suitable for securing a wide opening space for A.
• an aqueous solution of ferric chloride is preferably used as an etchant in the wet etching described above with reference to Fig. 5D.
• the concentration of the etchant is preferably 30% by mass or more, more preferably 32% by mass or more.
• the concentration of the etchant is preferably 55% by mass or less, more preferably 53% by mass or less. The lower the concentration of the etchant, the easier it is to widen the separation distance d1 between the first opening peripheral edge 11 and the second opening peripheral edge 12 in the projection view in the thickness direction T.
• the temperature of the etchant is preferably 20°C or higher, more preferably 25°C or higher, and even more preferably 30°C or higher.
• the temperature of the etchant is preferably 80°C or lower, more preferably 75°C or lower.
• the etching time is preferably 1 minute or longer, more preferably 2 minutes or longer.
• the etching time is preferably 15 minutes or less, more preferably 12 minutes or less.
• the terminal portion 31 in the wired circuit board X1 may have a two-layer structure as shown in FIG. Specifically, the terminal portion 31 shown in FIG. It includes a conductor layer 31A and a second conductor layer 31B on the first conductor layer 31A.
• the first conductor layer 31A is the same as the terminal part 31 described above with reference to FIGS.
• the second conductor layer 31B has an outline shape that fits within the outline shape of the first conductor layer 31A in plan view.
• the thickness of the second conductor layer 31B is, for example, 1 mm or more, preferably 3 mm or more.
• the thickness of the second conductor layer 31B is, for example, 50 mm or less, preferably 30 mm or less.
• Materials for the second conductor layer 31B include the materials described above for the conductor layer 30.
• the material of the first conductor layer 31A and the material of the second conductor layer 31B are preferably the same, more preferably copper.
• the material of the first conductor layer 31A and the material of the second conductor layer 31B may be different.
• the terminal portion 31 has a two-layer structure.
• the fact that the terminal portion 31 may have such a two-layer structure is the same in the modified example and the second embodiment described later.
• the entire second opening peripheral edge 12 may be arranged outside the terminal portion 31 .
• Such a configuration is preferable from the viewpoint of securing a wide opening space for the opening 10A.
• the ratio of the length L3 of the first opening end 10a shown in FIG. is.
• the ratio of the length L4 of the first open end 10a shown in FIG. 8 to the length L2 of the terminal portion 31 is preferably 0.4 or more and 0.98 or less.
• the ratio of the length L5 shown in FIG. 8 of the second open end 10b to the length L1 is preferably 1.01 or more and 3 or less.
• the ratio of the length L6 shown in FIG. 8 of the second open end 10b to the length L2 is , preferably 1.01 or more and 3 or less.
• the entire peripheral edge 12 may be arranged outside the terminal portion 31. Such a configuration is preferable from the viewpoint of ensuring a wide opening space for the opening 10A.
• the separation distance d2 (shown in Fig. 11) between the edge of the terminal portion 31 and the peripheral edge 11 of the first opening in the projection view is preferably 5 mm. or more, more preferably 1 ⁇ m or more.
• the separation distance d2 is preferably 400 ⁇ m or less, more preferably 300 ⁇ m or less.
• the ratio of the length L3 of the first open end 10a shown in FIG. 11 to the length L1 of the terminal portion 31 is preferably 1.01 or more and 4 or less.
• the ratio of the length L4 shown in FIG. 11 of the first open end 10a to the length L2 of the terminal portion 31 is preferably 1.01 or more and 4 or less.
• the ratio of the length L5 of the second open end 10b shown in FIG. 11 to the length L1 is preferably 1.05 or more and 5 or less.
• Fig. 1 of the second open end 10b for the length L2! is preferably 1.05 or more and 5 or less.
• the portion 11a is arranged inside the terminal portion 31, and the portion 11b is arranged outside the terminal portion 31.
• the portion 11a extends in the first direction D1.
• the portion 11b includes a portion extending in the second direction D2 and a portion extending in the first direction D1.
• the second opening peripheral edge 12 includes a portion 12a (third portion) arranged inside the terminal portion 31 and extending along the portion 11a, and a portion 12b arranged outside the terminal portion 31 and extending along the portion 11b.
• the second opening peripheral edge 12 has a portion 12a (fourth portion) arranged outside the terminal portion 31 and extending along the portion 11a, and a portion arranged outside the terminal portion 31. It may include portions 12b extending along 11b. These configurations are preferable from the viewpoint of ensuring both the supporting strength of the terminal portion 31 by the metal supporting board 10 and the opening space of the opening 10A. preferred.
• the separation distance d3 (shown in Fig. 14) between the edge of the terminal portion 31 and the portion 11a in the projection view is preferably 5 mm or more, more preferably or 1 ⁇ m or more.
• the separation distance d3 is preferably 400" m or less, more preferably 300 ⁇ m or less.
• the separation distance d4 between the edge of the terminal portion 31 and the portion 11b in the projection view. (shown in FIG. 14) is preferably 5 ⁇ m or more, more preferably 1 ⁇ m or more.
• the separation distance d4 is preferably 400 ⁇ m or less, more preferably 300 ⁇ m or less. be.
• the ratio of the length L4 shown in FIG. 14 of the first open end 10a to the length L2 of the terminal portion 31 is preferably 0.31 or more and 99 or less.
• the ratio of the length L5 shown in FIG. 14 of the second opening dimension 10b to the length 1 is preferably 1.05 or more and 5 or less.
• the ratio of the length L6 shown in FIG. 14 of the second open end 10b to the length L2 is preferably 0.31 or more and 0.99 or less.
• the portion 11c is arranged inside the terminal portion 31, and the portion 11d is arranged outside the terminal portion 31.
• the portion 11c extends in the second direction D2.
• the portion 11d includes a portion extending in the first direction D1 and a portion extending in the second direction D2.
• the second opening peripheral edge 12 is arranged inside the terminal portion 31 and extends along the portion 11c. and a portion 12c (third portion) extending along the terminal portion 31 and a portion 12d disposed outside the terminal portion 31 and extending along the portion 11d.
• the second opening peripheral edge 12 has a portion 12c (fourth portion) arranged outside the terminal portion 31 and extending along the portion 11c, and a portion arranged outside the terminal portion 31. It may include portions 12d and extending along 11d. These configurations are preferable from the viewpoint of ensuring both the supporting strength of the terminal portion 31 by the metal supporting board 10 and the opening space of the opening 10A.
• the separation distance d5 (shown in FIG. 19) between the edge of the terminal part 31 and the part 11c in the projection view is preferably 5 Mm or more, more preferably is greater than or equal to 1 ⁇ m.
• the separation distance d5 is preferably 400" m or less, more preferably 300 ⁇ m or less.
• the separation distance d6 between the edge of the terminal portion 31 and the portion 11d in the projection view. (shown in FIG. 19) is preferably 5 ⁇ m or more, more preferably 1 ⁇ m or more.
• the separation distance d6 is preferably 400 ⁇ m or less, more preferably 300 ⁇ m or less. be.
• the ratio of the length L4 shown in FIG. 19 of the first open end 10a to the length L2 of the terminal portion 31 is preferably 1.01 or more and 4 or less.
• the ratio of the length L5 shown in FIG. 19 of the second opening dimension 10b to the length 1 is preferably 0.31 or more and 0.99 or less.
• the ratio of the length L6 shown in FIG. 19 of the second open end 10b to the length L2 is preferably 1.05 or more and 5 or less.
• Figures 22 to 24 show a wired circuit board X2 as a second embodiment of the wired circuit board of the present invention.
• the wired circuit board X2 includes: a metal supporting board 10; an insulating layer 20 as a base insulating layer; a conductor layer 30; An insulating layer 40 as an insulating cover layer is provided in this order toward one side in the thickness direction T.
• the wired circuit board X2 instead of the opening 10A facing one terminal portion 31 via the insulating layer 20, one opening 10A is provided via the insulating layer 20. It is different from the printed circuit board X 1 in that it faces the terminal portions 3 1 (arranged in a row spaced apart in the first direction D 1 ).
• the wired circuit board X2 has the same configuration as the wired circuit board X1.
• the opening 10A in the printed circuit board X2 has the entire first opening peripheral edge 11 and the second opening peripheral edge in the projection view in the thickness direction T. 1 2 are all arranged outside the terminal portion 3 1 .
• Such a configuration is preferable from the viewpoint of ensuring a wide opening space for the opening 10A.
• the separation distance d7 between the edge of the terminal portion 31 and the peripheral edge 11 of the first opening in the projection view is preferably 5 mm or more, more preferably 10 Atm or better.
• the separation distance d7 is preferably 400" m or less, more preferably 300 um or less.
• the ratio of the length L4 shown in is preferably 1.01 or more and 4 or less o
• the ratio of the length L6 shown in FIG. 22 of the second open end 10b to the length L2 is preferably is 1.01 or more and 5 or less.
• the portion 11a is arranged inside the terminal portion 31, and the portion 11b is arranged outside the terminal portion 31.
• the portion 11a extends in the first direction D1.
• the portion 11b includes a portion extending in the first direction D1 and a portion extending in the second direction D2.
• the second opening peripheral edge 12 includes a portion 12a (third portion) arranged inside the terminal portion 31 and extending along the portion 11a, and a terminal portion. and a portion 12b located outside of 31 and extending along portion 11b.
• the second opening peripheral edge 12 has a portion 12a (fourth portion) arranged outside the terminal portion 31 and extending along the portion 11a, and a portion arranged outside the terminal portion 31. including a portion 12b extending along 11b You can These configurations are preferable from the viewpoint of ensuring both the supporting strength of the terminal portion 31 by the metal supporting board 10 and the opening space of the opening portion 10A.
• the distance d8 between the edge of the terminal part 31 and the part 11a in the projection view is preferably 5 Mm or more, more preferably is greater than or equal to 1 ⁇ m.
• the separation distance d8 is preferably 400" m or less, more preferably 300 ⁇ m or less.
• the separation distance d9 between the edge of the terminal portion 31 and the portion 11b in the projection view. is preferably 5 ⁇ m or more, more preferably 1 ⁇ m or more.
• the separation distance d9 is preferably 400 ⁇ m or less, more preferably 300 ⁇ m or less. be.
• the ratio of the length L6 shown in FIG. 25 of the second open end 10b to the length L2 is preferably: . 3 1 or more. . 9 9 or less ⁇
• the wired circuit board of the present invention can be applied to a wired circuit board having a metal supporting substrate as a supporting base.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Structure Of Printed Boards (AREA)
• Insulated Metal Substrates For Printed Circuits (AREA)
• Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

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Publications (1)

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ID=82549656

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• 2021
  • 2021-12-03 KR KR1020237023723A patent/KR20230133292A/ko active Pending
  • 2021-12-03 US US18/261,231 patent/US20240090128A1/en active Pending
  • 2021-12-03 WO PCT/JP2021/043378 patent/WO2022158118A1/ja not_active Ceased
  • 2021-12-03 TW TW110145211A patent/TW202231138A/zh unknown
• 2022
  • 2022-12-27 JP JP2022210574A patent/JP2023024891A/ja active Pending

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