JP2022545796A5 - - Google Patents
Info
- Publication number
- JP2022545796A5 JP2022545796A5 JP2022511074A JP2022511074A JP2022545796A5 JP 2022545796 A5 JP2022545796 A5 JP 2022545796A5 JP 2022511074 A JP2022511074 A JP 2022511074A JP 2022511074 A JP2022511074 A JP 2022511074A JP 2022545796 A5 JP2022545796 A5 JP 2022545796A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- layer
- ions
- source
- iron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19192262.4 | 2019-08-19 | ||
| EP19192262 | 2019-08-19 | ||
| PCT/EP2020/073185 WO2021032775A1 (en) | 2019-08-19 | 2020-08-19 | Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022545796A JP2022545796A (ja) | 2022-10-31 |
| JP2022545796A5 true JP2022545796A5 (https=) | 2023-08-29 |
| JP7651556B2 JP7651556B2 (ja) | 2025-03-26 |
Family
ID=67659253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022511074A Active JP7651556B2 (ja) | 2019-08-19 | 2020-08-19 | 高密度相互接続プリント回路板のための製造シーケンスおよび高密度相互接続プリント回路板 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12063751B2 (https=) |
| EP (1) | EP4018790A1 (https=) |
| JP (1) | JP7651556B2 (https=) |
| KR (1) | KR20220047373A (https=) |
| CN (1) | CN114342569A (https=) |
| TW (1) | TWI886143B (https=) |
| WO (1) | WO2021032775A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI816388B (zh) * | 2021-05-17 | 2023-09-21 | 美商麥克達米德恩索龍股份有限公司 | 在印刷電路板或其它基板上填充穿孔的單步電解法 |
| US12052825B2 (en) * | 2021-06-23 | 2024-07-30 | International Business Machines Corporation | Flexible circuit structure for circuit line bending |
| DE102021209537A1 (de) | 2021-08-31 | 2023-03-02 | Vitesco Technologies GmbH | Transformator |
| CN114401584A (zh) * | 2021-11-01 | 2022-04-26 | 安捷利美维电子(厦门)有限责任公司 | 一种高密度互联电路板层间互联结构及加工工艺 |
| CN114928945B (zh) * | 2022-05-27 | 2024-02-06 | 珠海达汉电子科技有限公司 | 超细线路印刷线路板的制作工艺 |
| CN116367429A (zh) * | 2023-03-17 | 2023-06-30 | 深圳市迅捷兴科技股份有限公司 | 含盲埋孔的电源电路板制造方法 |
| CN118334275B (zh) * | 2024-06-12 | 2024-08-20 | 芯瑞微(上海)电子科技有限公司 | Pcb模型的层间自适应网格加密方法及相关设备 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4344387C2 (de) | 1993-12-24 | 1996-09-05 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens |
| DE19545231A1 (de) | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Verfahren zur elektrolytischen Abscheidung von Metallschichten |
| JP3502979B2 (ja) * | 1997-12-24 | 2004-03-02 | グンゼ株式会社 | 電磁波シールド用透明部材とその製造方法 |
| JP2001267726A (ja) | 2000-03-22 | 2001-09-28 | Toyota Autom Loom Works Ltd | 配線基板の電解メッキ方法及び配線基板の電解メッキ装置 |
| EP1148156A3 (en) * | 2000-04-11 | 2004-02-04 | Shipley Company LLC | Copper Electroplating |
| TWI268966B (en) | 2001-06-07 | 2006-12-21 | Shipley Co Llc | Electrolytic copper plating method |
| JP2005019577A (ja) * | 2003-06-25 | 2005-01-20 | Hitachi Cable Ltd | 半導体装置用テープキャリアの製造方法 |
| DE102004005300A1 (de) | 2004-01-29 | 2005-09-08 | Atotech Deutschland Gmbh | Verfahren zum Behandeln von Trägermaterial zur Herstellung von Schltungsträgern und Anwendung des Verfahrens |
| DE102004023161A1 (de) * | 2004-05-07 | 2005-11-24 | Eilenburger Elektrolyse- Und Umwelttechnik Gmbh | Elektrolysezelle mit Mehrlagen-Streckmetall-Kathoden |
| DE102004045451B4 (de) | 2004-09-20 | 2007-05-03 | Atotech Deutschland Gmbh | Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer |
| DE502007005345D1 (de) | 2006-03-30 | 2010-11-25 | Atotech Deutschland Gmbh | Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen |
| KR20090117237A (ko) * | 2008-05-09 | 2009-11-12 | 삼성전기주식회사 | 전자소자 내장 인쇄회로기판 및 그 제조방법 |
| US8388824B2 (en) * | 2008-11-26 | 2013-03-05 | Enthone Inc. | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers |
| US20100206737A1 (en) | 2009-02-17 | 2010-08-19 | Preisser Robert F | Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv) |
| US20110127673A1 (en) * | 2009-12-01 | 2011-06-02 | International Business Machines Corporation | Wiring structure and method |
| US20120097547A1 (en) * | 2010-10-25 | 2012-04-26 | Universiteit Gent | Method for Copper Electrodeposition |
| CN103179806B (zh) * | 2011-12-21 | 2019-05-28 | 奥特斯有限公司 | 组合的通孔镀覆和孔填充的方法 |
| JP6114527B2 (ja) | 2012-10-05 | 2017-04-12 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| JP6077886B2 (ja) | 2013-03-04 | 2017-02-08 | 株式会社荏原製作所 | めっき装置 |
| EP3029178A1 (en) * | 2014-12-05 | 2016-06-08 | ATOTECH Deutschland GmbH | Method and apparatus for electroplating a metal onto a substrate |
| EP3034655A1 (en) * | 2014-12-19 | 2016-06-22 | ATOTECH Deutschland GmbH | Trench pattern wet chemical copper metal filling using a hard mask structure |
| US10349520B2 (en) * | 2017-06-28 | 2019-07-09 | Catlam, Llc | Multi-layer circuit board using interposer layer and conductive paste |
-
2020
- 2020-08-19 CN CN202080057850.9A patent/CN114342569A/zh active Pending
- 2020-08-19 KR KR1020227009041A patent/KR20220047373A/ko active Pending
- 2020-08-19 EP EP20756871.8A patent/EP4018790A1/en active Pending
- 2020-08-19 US US17/636,500 patent/US12063751B2/en active Active
- 2020-08-19 JP JP2022511074A patent/JP7651556B2/ja active Active
- 2020-08-19 TW TW109128288A patent/TWI886143B/zh active
- 2020-08-19 WO PCT/EP2020/073185 patent/WO2021032775A1/en not_active Ceased
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