JP2022545091A - 銅で充填されたマイクロビアを含む高密度相互接続プリント回路基板の製造方法 - Google Patents

銅で充填されたマイクロビアを含む高密度相互接続プリント回路基板の製造方法 Download PDF

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JP2022545091A
JP2022545091A JP2022511079A JP2022511079A JP2022545091A JP 2022545091 A JP2022545091 A JP 2022545091A JP 2022511079 A JP2022511079 A JP 2022511079A JP 2022511079 A JP2022511079 A JP 2022511079A JP 2022545091 A JP2022545091 A JP 2022545091A
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copper
layer
conductive
peripheral surface
outer peripheral
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JP2022545091A5 (https=
Inventor
ベルト・リーンツ
アキフ・オズキョク
スンス・キム
ホルスト・ブリュグマン
ヘルヴィヒ・ヨーゼフ・ベルトホルト
マルシン・クロブス
トーマス・シウォン
マルコ・ミルコヴィッチ
Original Assignee
アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー
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Publication of JP2022545091A publication Critical patent/JP2022545091A/ja
Publication of JP2022545091A5 publication Critical patent/JP2022545091A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automation & Control Theory (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2022511079A 2019-08-19 2020-08-19 銅で充填されたマイクロビアを含む高密度相互接続プリント回路基板の製造方法 Pending JP2022545091A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP19192196.4 2019-08-19
EP19192196 2019-08-19
PCT/EP2020/073186 WO2021032776A1 (en) 2019-08-19 2020-08-19 Method of preparing a high density interconnect printed circuit board including microvias filled with copper

Publications (2)

Publication Number Publication Date
JP2022545091A true JP2022545091A (ja) 2022-10-25
JP2022545091A5 JP2022545091A5 (https=) 2023-08-29

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JP2022511079A Pending JP2022545091A (ja) 2019-08-19 2020-08-19 銅で充填されたマイクロビアを含む高密度相互接続プリント回路基板の製造方法

Country Status (7)

Country Link
US (2) US12245383B2 (https=)
EP (1) EP4018791A1 (https=)
JP (1) JP2022545091A (https=)
KR (2) KR102875198B1 (https=)
CN (1) CN114303447A (https=)
TW (1) TWI886142B (https=)
WO (1) WO2021032776A1 (https=)

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TWI816388B (zh) * 2021-05-17 2023-09-21 美商麥克達米德恩索龍股份有限公司 在印刷電路板或其它基板上填充穿孔的單步電解法
KR20230067984A (ko) 2021-11-10 2023-05-17 (주)티에스이 극미세 비아를 포함하는 다층 회로 기판의 제조 방법 및 이에 의해 제조된 다층 회로 기판

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10190224A (ja) * 1996-12-27 1998-07-21 Ibiden Co Ltd 多層プリント配線板およびその製造方法
JP2000500529A (ja) * 1995-11-21 2000-01-18 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 金属層の電解析出のための方法
JP2001267726A (ja) * 2000-03-22 2001-09-28 Toyota Autom Loom Works Ltd 配線基板の電解メッキ方法及び配線基板の電解メッキ装置
JP2006245588A (ja) * 2005-03-02 2006-09-14 Samsung Electro Mech Co Ltd キャパシタ内蔵型プリント回路基板およびその製造方法
KR100843367B1 (ko) * 2007-03-06 2008-07-03 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP2009516396A (ja) * 2005-12-28 2009-04-16 インテル・コーポレーション レーザ支援メタライゼーションおよび基板パターニングを利用するプリント回路基板のための方法および装置
KR20090116460A (ko) * 2008-05-07 2009-11-11 삼성전기주식회사 랜드리스 비아를 갖는 인쇄회로기판의 제조방법
CN101790288A (zh) * 2009-01-22 2010-07-28 上海美维科技有限公司 一种新型的印制电路板的制造方法
JP2013030605A (ja) * 2011-07-28 2013-02-07 Fujikura Ltd 貫通孔を有する構造体の製造方法、及びプリント配線板の製造方法
JP2013065874A (ja) * 2004-01-29 2013-04-11 Atotech Deutsche Gmbh 回路キャリアを製造する方法と当該方法の使用
JP2014154800A (ja) * 2013-02-13 2014-08-25 Shinko Electric Ind Co Ltd 配線基板及びその製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4344387C2 (de) 1993-12-24 1996-09-05 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Kupfer und Anordnung zur Durchführung des Verfahrens
EP1921902B1 (en) * 1996-12-19 2011-03-02 Ibiden Co., Ltd. Multilayered printed circuit board
MY144503A (en) * 1998-09-14 2011-09-30 Ibiden Co Ltd Printed circuit board and method for its production
TW561805B (en) * 2001-05-16 2003-11-11 Unimicron Technology Corp Fabrication method of micro-via
DE502007005345D1 (de) 2006-03-30 2010-11-25 Atotech Deutschland Gmbh Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen
US20080053688A1 (en) * 2006-09-01 2008-03-06 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
JP5447935B2 (ja) * 2008-10-28 2014-03-19 日立化成株式会社 三層配線基板およびその製造方法
US20100206737A1 (en) 2009-02-17 2010-08-19 Preisser Robert F Process for electrodeposition of copper chip to chip, chip to wafer and wafer to wafer interconnects in through-silicon vias (tsv)
CN101711095A (zh) * 2009-04-16 2010-05-19 深圳市精诚达电路有限公司 Hdi挠性电路板镀铜填孔工艺
TWI400025B (zh) * 2009-12-29 2013-06-21 Subtron Technology Co Ltd 線路基板及其製作方法
EP2518187A1 (en) * 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
CN103179806B (zh) * 2011-12-21 2019-05-28 奥特斯有限公司 组合的通孔镀覆和孔填充的方法
JP2013153051A (ja) * 2012-01-25 2013-08-08 Tokuyama Corp メタライズドセラミックスビア基板及びその製造方法
KR101332079B1 (ko) * 2012-03-29 2013-11-22 삼성전기주식회사 다층 인쇄회로기판 제조 방법 및 이에 따라 제조된 다층 인쇄회로기판
EP2645830B1 (en) * 2012-03-29 2014-10-08 Atotech Deutschland GmbH Method for manufacture of fine line circuitry
CN104066281B (zh) * 2014-07-04 2017-10-27 华进半导体封装先导技术研发中心有限公司 奇数层基板的制造方法和奇数层基板
TWI618821B (zh) * 2017-04-21 2018-03-21 萬億股份有限公司 製造印刷電路板線路的方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000500529A (ja) * 1995-11-21 2000-01-18 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 金属層の電解析出のための方法
JPH10190224A (ja) * 1996-12-27 1998-07-21 Ibiden Co Ltd 多層プリント配線板およびその製造方法
JP2001267726A (ja) * 2000-03-22 2001-09-28 Toyota Autom Loom Works Ltd 配線基板の電解メッキ方法及び配線基板の電解メッキ装置
JP2013065874A (ja) * 2004-01-29 2013-04-11 Atotech Deutsche Gmbh 回路キャリアを製造する方法と当該方法の使用
JP2006245588A (ja) * 2005-03-02 2006-09-14 Samsung Electro Mech Co Ltd キャパシタ内蔵型プリント回路基板およびその製造方法
JP2009516396A (ja) * 2005-12-28 2009-04-16 インテル・コーポレーション レーザ支援メタライゼーションおよび基板パターニングを利用するプリント回路基板のための方法および装置
KR100843367B1 (ko) * 2007-03-06 2008-07-03 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20090116460A (ko) * 2008-05-07 2009-11-11 삼성전기주식회사 랜드리스 비아를 갖는 인쇄회로기판의 제조방법
CN101790288A (zh) * 2009-01-22 2010-07-28 上海美维科技有限公司 一种新型的印制电路板的制造方法
JP2013030605A (ja) * 2011-07-28 2013-02-07 Fujikura Ltd 貫通孔を有する構造体の製造方法、及びプリント配線板の製造方法
JP2014154800A (ja) * 2013-02-13 2014-08-25 Shinko Electric Ind Co Ltd 配線基板及びその製造方法

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