JP2022542959A5 - - Google Patents

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Publication number
JP2022542959A5
JP2022542959A5 JP2022506110A JP2022506110A JP2022542959A5 JP 2022542959 A5 JP2022542959 A5 JP 2022542959A5 JP 2022506110 A JP2022506110 A JP 2022506110A JP 2022506110 A JP2022506110 A JP 2022506110A JP 2022542959 A5 JP2022542959 A5 JP 2022542959A5
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JP
Japan
Prior art keywords
pixels
phase
map
subset
inspection system
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022506110A
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English (en)
Japanese (ja)
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JP7362893B2 (ja
JP2022542959A (ja
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Priority claimed from US16/688,539 external-priority patent/US11035665B2/en
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Publication of JP2022542959A publication Critical patent/JP2022542959A/ja
Publication of JP2022542959A5 publication Critical patent/JP2022542959A5/ja
Application granted granted Critical
Publication of JP7362893B2 publication Critical patent/JP7362893B2/ja
Active legal-status Critical Current
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JP2022506110A 2019-07-30 2020-07-29 ウェーハワープ適用範囲を維持しながら効率が劣るピクセルを用いてデータ処理スループットを向上させるシステム及び方法 Active JP7362893B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962880341P 2019-07-30 2019-07-30
US62/880,341 2019-07-30
US16/688,539 US11035665B2 (en) 2019-07-30 2019-11-19 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
US16/688,539 2019-11-19
PCT/US2020/043924 WO2021021838A1 (en) 2019-07-30 2020-07-29 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage

Publications (3)

Publication Number Publication Date
JP2022542959A JP2022542959A (ja) 2022-10-07
JP2022542959A5 true JP2022542959A5 (https=) 2023-07-21
JP7362893B2 JP7362893B2 (ja) 2023-10-17

Family

ID=74228636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022506110A Active JP7362893B2 (ja) 2019-07-30 2020-07-29 ウェーハワープ適用範囲を維持しながら効率が劣るピクセルを用いてデータ処理スループットを向上させるシステム及び方法

Country Status (7)

Country Link
US (2) US11035665B2 (https=)
JP (1) JP7362893B2 (https=)
KR (1) KR102932684B1 (https=)
CN (1) CN114096798B (https=)
IL (2) IL301483B2 (https=)
TW (2) TWI841765B (https=)
WO (1) WO2021021838A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11035665B2 (en) * 2019-07-30 2021-06-15 Kla Corporation System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
US11469571B2 (en) 2019-11-21 2022-10-11 Kla Corporation Fast phase-shift interferometry by laser frequency shift
DE102020201958B3 (de) * 2020-02-17 2021-01-07 Carl Zeiss Smt Gmbh Messvorrichtung zur interferometrischen Formvermessung
WO2022225897A1 (en) * 2021-04-20 2022-10-27 Nikon Corporation Systems and methods for measuring height properties of surfaces
US11629952B2 (en) * 2021-06-02 2023-04-18 Kla Corporation Detection aided two-stage phase unwrapping on pattern wafer geometry measurement

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6107953A (en) * 1999-03-10 2000-08-22 Veridian Erim International, Inc. Minimum-gradient-path phase unwrapping
US7385707B2 (en) 2002-03-14 2008-06-10 Taylor Hobson Limited Surface profiling apparatus
US6703835B2 (en) 2002-04-11 2004-03-09 Ge Medical Systems Global Technology Co. Llc System and method for unwrapping phase difference images
US7324214B2 (en) * 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
US6847458B2 (en) 2003-03-20 2005-01-25 Phase Shift Technology, Inc. Method and apparatus for measuring the shape and thickness variation of polished opaque plates
EP1664932B1 (en) * 2003-09-15 2015-01-28 Zygo Corporation Interferometric analysis of surfaces
JP5087253B2 (ja) 2006-09-27 2012-12-05 株式会社ミツトヨ 干渉縞解析における位相接続方法
CN100565498C (zh) * 2008-05-05 2009-12-02 南京大学 基于相位不连续区域检测的最小不连续二维相位展开方法
CN101655357B (zh) * 2009-09-11 2011-05-04 南京大学 一种用于二维相位展开的相位梯度相关质量图获取方法
JP2011141251A (ja) 2010-01-08 2011-07-21 Nikon Corp 位相接続方法およびその方法を用いる干渉測定装置
CN102032877B (zh) * 2010-11-30 2012-05-23 东南大学 基于小波变换的三维测量方法
US8643847B1 (en) * 2011-05-08 2014-02-04 Bruker Nano Inc. Interferometric technique for measuring patterned sapphire substrates
US8949057B1 (en) 2011-10-27 2015-02-03 Kla-Tencor Corporation Method for compensating for wafer shape measurement variation due to variation of environment temperature
US9121684B2 (en) 2012-01-17 2015-09-01 Kla-Tencor Corporation Method for reducing wafer shape and thickness measurement errors resulted from cavity shape changes
US9020293B2 (en) 2012-02-07 2015-04-28 National Cheung Kung University Integration of filters and phase unwrapping algorithms for removing noise in image reconstruction
US8463077B1 (en) * 2012-03-26 2013-06-11 National Cheng Kung University Rotation phase unwrapping algorithm for image reconstruction
US10352691B1 (en) 2014-04-18 2019-07-16 Kla-Tencor Corporation Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool
US9897433B2 (en) * 2015-10-30 2018-02-20 KLA—Tencor Corporation Method and system for regional phase unwrapping with pattern-assisted correction
JP6766995B2 (ja) * 2016-11-09 2020-10-14 株式会社ミツトヨ 位相シフト干渉計
US10571543B2 (en) 2017-01-18 2020-02-25 Shanghai United Imaging Healthcare Co., Ltd Methods and apparatuses for phase unwrapping
CN109870129A (zh) * 2019-03-25 2019-06-11 中国计量大学 一种基于相位偏折原理的晶圆表面粗糙度检测装置
US11035665B2 (en) * 2019-07-30 2021-06-15 Kla Corporation System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage

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