IL301483B2 - System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage - Google Patents

System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage

Info

Publication number
IL301483B2
IL301483B2 IL301483A IL30148323A IL301483B2 IL 301483 B2 IL301483 B2 IL 301483B2 IL 301483 A IL301483 A IL 301483A IL 30148323 A IL30148323 A IL 30148323A IL 301483 B2 IL301483 B2 IL 301483B2
Authority
IL
Israel
Prior art keywords
pixels
phase
map
sub
sample
Prior art date
Application number
IL301483A
Other languages
English (en)
Hebrew (he)
Other versions
IL301483B1 (en
IL301483A (en
Original Assignee
Kla Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Corp filed Critical Kla Corp
Publication of IL301483A publication Critical patent/IL301483A/en
Publication of IL301483B1 publication Critical patent/IL301483B1/en
Publication of IL301483B2 publication Critical patent/IL301483B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02055—Reduction or prevention of errors; Testing; Calibration
    • G01B9/02075—Reduction or prevention of errors; Testing; Calibration of particular errors
    • G01B9/02078—Caused by ambiguity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02083—Interferometers characterised by particular signal processing and presentation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/44—Caliper-like sensors with detectors on both sides of the object to be measured
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/48—Caliper-like sensors for measurement of a wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0484—Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
    • G06F3/04842—Selection of displayed objects or displayed text elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
IL301483A 2019-07-30 2020-07-29 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage IL301483B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962880341P 2019-07-30 2019-07-30
US16/688,539 US11035665B2 (en) 2019-07-30 2019-11-19 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
PCT/US2020/043924 WO2021021838A1 (en) 2019-07-30 2020-07-29 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage

Publications (3)

Publication Number Publication Date
IL301483A IL301483A (en) 2023-05-01
IL301483B1 IL301483B1 (en) 2024-03-01
IL301483B2 true IL301483B2 (en) 2024-07-01

Family

ID=74228636

Family Applications (2)

Application Number Title Priority Date Filing Date
IL301483A IL301483B2 (en) 2019-07-30 2020-07-29 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
IL289780A IL289780B2 (en) 2019-07-30 2022-01-12 System and method for increasing data processing throughput using a less efficient pixel while maintaining slice distortion coverage

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL289780A IL289780B2 (en) 2019-07-30 2022-01-12 System and method for increasing data processing throughput using a less efficient pixel while maintaining slice distortion coverage

Country Status (7)

Country Link
US (2) US11035665B2 (https=)
JP (1) JP7362893B2 (https=)
KR (1) KR102932684B1 (https=)
CN (1) CN114096798B (https=)
IL (2) IL301483B2 (https=)
TW (2) TWI841765B (https=)
WO (1) WO2021021838A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11035665B2 (en) * 2019-07-30 2021-06-15 Kla Corporation System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
US11469571B2 (en) 2019-11-21 2022-10-11 Kla Corporation Fast phase-shift interferometry by laser frequency shift
DE102020201958B3 (de) * 2020-02-17 2021-01-07 Carl Zeiss Smt Gmbh Messvorrichtung zur interferometrischen Formvermessung
WO2022225897A1 (en) * 2021-04-20 2022-10-27 Nikon Corporation Systems and methods for measuring height properties of surfaces
US11629952B2 (en) * 2021-06-02 2023-04-18 Kla Corporation Detection aided two-stage phase unwrapping on pattern wafer geometry measurement

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6107953A (en) * 1999-03-10 2000-08-22 Veridian Erim International, Inc. Minimum-gradient-path phase unwrapping
US7385707B2 (en) 2002-03-14 2008-06-10 Taylor Hobson Limited Surface profiling apparatus
US6703835B2 (en) 2002-04-11 2004-03-09 Ge Medical Systems Global Technology Co. Llc System and method for unwrapping phase difference images
US7324214B2 (en) * 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
US6847458B2 (en) 2003-03-20 2005-01-25 Phase Shift Technology, Inc. Method and apparatus for measuring the shape and thickness variation of polished opaque plates
EP1664932B1 (en) * 2003-09-15 2015-01-28 Zygo Corporation Interferometric analysis of surfaces
JP5087253B2 (ja) 2006-09-27 2012-12-05 株式会社ミツトヨ 干渉縞解析における位相接続方法
CN100565498C (zh) * 2008-05-05 2009-12-02 南京大学 基于相位不连续区域检测的最小不连续二维相位展开方法
CN101655357B (zh) * 2009-09-11 2011-05-04 南京大学 一种用于二维相位展开的相位梯度相关质量图获取方法
JP2011141251A (ja) 2010-01-08 2011-07-21 Nikon Corp 位相接続方法およびその方法を用いる干渉測定装置
CN102032877B (zh) * 2010-11-30 2012-05-23 东南大学 基于小波变换的三维测量方法
US8643847B1 (en) * 2011-05-08 2014-02-04 Bruker Nano Inc. Interferometric technique for measuring patterned sapphire substrates
US8949057B1 (en) 2011-10-27 2015-02-03 Kla-Tencor Corporation Method for compensating for wafer shape measurement variation due to variation of environment temperature
US9121684B2 (en) 2012-01-17 2015-09-01 Kla-Tencor Corporation Method for reducing wafer shape and thickness measurement errors resulted from cavity shape changes
US9020293B2 (en) 2012-02-07 2015-04-28 National Cheung Kung University Integration of filters and phase unwrapping algorithms for removing noise in image reconstruction
US8463077B1 (en) * 2012-03-26 2013-06-11 National Cheng Kung University Rotation phase unwrapping algorithm for image reconstruction
US10352691B1 (en) 2014-04-18 2019-07-16 Kla-Tencor Corporation Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool
US9897433B2 (en) * 2015-10-30 2018-02-20 KLA—Tencor Corporation Method and system for regional phase unwrapping with pattern-assisted correction
JP6766995B2 (ja) * 2016-11-09 2020-10-14 株式会社ミツトヨ 位相シフト干渉計
US10571543B2 (en) 2017-01-18 2020-02-25 Shanghai United Imaging Healthcare Co., Ltd Methods and apparatuses for phase unwrapping
CN109870129A (zh) * 2019-03-25 2019-06-11 中国计量大学 一种基于相位偏折原理的晶圆表面粗糙度检测装置
US11035665B2 (en) * 2019-07-30 2021-06-15 Kla Corporation System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage

Also Published As

Publication number Publication date
JP7362893B2 (ja) 2023-10-17
TWI857889B (zh) 2024-10-01
KR102932684B1 (ko) 2026-02-27
WO2021021838A1 (en) 2021-02-04
CN114096798B (zh) 2024-10-18
TWI841765B (zh) 2024-05-11
IL301483B1 (en) 2024-03-01
CN114096798A (zh) 2022-02-25
IL289780B1 (en) 2023-04-01
IL301483A (en) 2023-05-01
US11035665B2 (en) 2021-06-15
KR20220038729A (ko) 2022-03-29
US11668557B2 (en) 2023-06-06
JP2022542959A (ja) 2022-10-07
IL289780A (en) 2022-03-01
IL289780B2 (en) 2023-08-01
TW202111279A (zh) 2021-03-16
TW202417811A (zh) 2024-05-01
US20210270598A1 (en) 2021-09-02
US20210033386A1 (en) 2021-02-04

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