KR102932684B1 - 웨이퍼 휨 커버리지를 유지하면서 유효 픽셀을 덜 사용하여 데이터 처리 스루풋을 향상시키기 위한 시스템 및 방법 - Google Patents

웨이퍼 휨 커버리지를 유지하면서 유효 픽셀을 덜 사용하여 데이터 처리 스루풋을 향상시키기 위한 시스템 및 방법

Info

Publication number
KR102932684B1
KR102932684B1 KR1020227005930A KR20227005930A KR102932684B1 KR 102932684 B1 KR102932684 B1 KR 102932684B1 KR 1020227005930 A KR1020227005930 A KR 1020227005930A KR 20227005930 A KR20227005930 A KR 20227005930A KR 102932684 B1 KR102932684 B1 KR 102932684B1
Authority
KR
South Korea
Prior art keywords
pixels
phase
map
subset
unfolding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227005930A
Other languages
English (en)
Korean (ko)
Other versions
KR20220038729A (ko
Inventor
헬렌 리우
구오칭 장
Original Assignee
케이엘에이 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 케이엘에이 코포레이션 filed Critical 케이엘에이 코포레이션
Publication of KR20220038729A publication Critical patent/KR20220038729A/ko
Application granted granted Critical
Publication of KR102932684B1 publication Critical patent/KR102932684B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02055—Reduction or prevention of errors; Testing; Calibration
    • G01B9/02075—Reduction or prevention of errors; Testing; Calibration of particular errors
    • G01B9/02078—Caused by ambiguity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02083—Interferometers characterised by particular signal processing and presentation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/44—Caliper-like sensors with detectors on both sides of the object to be measured
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/48—Caliper-like sensors for measurement of a wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0484—Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
    • G06F3/04842—Selection of displayed objects or displayed text elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020227005930A 2019-07-30 2020-07-29 웨이퍼 휨 커버리지를 유지하면서 유효 픽셀을 덜 사용하여 데이터 처리 스루풋을 향상시키기 위한 시스템 및 방법 Active KR102932684B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962880341P 2019-07-30 2019-07-30
US62/880,341 2019-07-30
US16/688,539 US11035665B2 (en) 2019-07-30 2019-11-19 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
US16/688,539 2019-11-19
PCT/US2020/043924 WO2021021838A1 (en) 2019-07-30 2020-07-29 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage

Publications (2)

Publication Number Publication Date
KR20220038729A KR20220038729A (ko) 2022-03-29
KR102932684B1 true KR102932684B1 (ko) 2026-02-27

Family

ID=74228636

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227005930A Active KR102932684B1 (ko) 2019-07-30 2020-07-29 웨이퍼 휨 커버리지를 유지하면서 유효 픽셀을 덜 사용하여 데이터 처리 스루풋을 향상시키기 위한 시스템 및 방법

Country Status (7)

Country Link
US (2) US11035665B2 (https=)
JP (1) JP7362893B2 (https=)
KR (1) KR102932684B1 (https=)
CN (1) CN114096798B (https=)
IL (2) IL301483B2 (https=)
TW (2) TWI841765B (https=)
WO (1) WO2021021838A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11035665B2 (en) * 2019-07-30 2021-06-15 Kla Corporation System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
US11469571B2 (en) 2019-11-21 2022-10-11 Kla Corporation Fast phase-shift interferometry by laser frequency shift
DE102020201958B3 (de) * 2020-02-17 2021-01-07 Carl Zeiss Smt Gmbh Messvorrichtung zur interferometrischen Formvermessung
WO2022225897A1 (en) * 2021-04-20 2022-10-27 Nikon Corporation Systems and methods for measuring height properties of surfaces
US11629952B2 (en) * 2021-06-02 2023-04-18 Kla Corporation Detection aided two-stage phase unwrapping on pattern wafer geometry measurement

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008082869A (ja) 2006-09-27 2008-04-10 Mitsutoyo Corp 干渉縞解析における位相接続方法
JP2011141251A (ja) 2010-01-08 2011-07-21 Nikon Corp 位相接続方法およびその方法を用いる干渉測定装置
US20130202181A1 (en) * 2012-02-07 2013-08-08 National Cheng Kung University Integration of filters and phase unwrapping algorithms for removing noise in image reconstruction
US20170241764A1 (en) * 2015-10-30 2017-08-24 Kla-Tencor Corporation Method and System for Regional Phase Unwrapping with Pattern-Assisted Correction
US20180203087A1 (en) 2017-01-18 2018-07-19 Shanghai United Imaging Healthcare Co., Ltd. Methods and apparatuses for phase unwrapping

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6107953A (en) * 1999-03-10 2000-08-22 Veridian Erim International, Inc. Minimum-gradient-path phase unwrapping
US7385707B2 (en) 2002-03-14 2008-06-10 Taylor Hobson Limited Surface profiling apparatus
US6703835B2 (en) 2002-04-11 2004-03-09 Ge Medical Systems Global Technology Co. Llc System and method for unwrapping phase difference images
US7324214B2 (en) * 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
US6847458B2 (en) 2003-03-20 2005-01-25 Phase Shift Technology, Inc. Method and apparatus for measuring the shape and thickness variation of polished opaque plates
EP1664932B1 (en) * 2003-09-15 2015-01-28 Zygo Corporation Interferometric analysis of surfaces
CN100565498C (zh) * 2008-05-05 2009-12-02 南京大学 基于相位不连续区域检测的最小不连续二维相位展开方法
CN101655357B (zh) * 2009-09-11 2011-05-04 南京大学 一种用于二维相位展开的相位梯度相关质量图获取方法
CN102032877B (zh) * 2010-11-30 2012-05-23 东南大学 基于小波变换的三维测量方法
US8643847B1 (en) * 2011-05-08 2014-02-04 Bruker Nano Inc. Interferometric technique for measuring patterned sapphire substrates
US8949057B1 (en) 2011-10-27 2015-02-03 Kla-Tencor Corporation Method for compensating for wafer shape measurement variation due to variation of environment temperature
US9121684B2 (en) 2012-01-17 2015-09-01 Kla-Tencor Corporation Method for reducing wafer shape and thickness measurement errors resulted from cavity shape changes
US8463077B1 (en) * 2012-03-26 2013-06-11 National Cheng Kung University Rotation phase unwrapping algorithm for image reconstruction
US10352691B1 (en) 2014-04-18 2019-07-16 Kla-Tencor Corporation Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool
JP6766995B2 (ja) * 2016-11-09 2020-10-14 株式会社ミツトヨ 位相シフト干渉計
CN109870129A (zh) * 2019-03-25 2019-06-11 中国计量大学 一种基于相位偏折原理的晶圆表面粗糙度检测装置
US11035665B2 (en) * 2019-07-30 2021-06-15 Kla Corporation System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008082869A (ja) 2006-09-27 2008-04-10 Mitsutoyo Corp 干渉縞解析における位相接続方法
JP2011141251A (ja) 2010-01-08 2011-07-21 Nikon Corp 位相接続方法およびその方法を用いる干渉測定装置
US20130202181A1 (en) * 2012-02-07 2013-08-08 National Cheng Kung University Integration of filters and phase unwrapping algorithms for removing noise in image reconstruction
US20170241764A1 (en) * 2015-10-30 2017-08-24 Kla-Tencor Corporation Method and System for Regional Phase Unwrapping with Pattern-Assisted Correction
US20180203087A1 (en) 2017-01-18 2018-07-19 Shanghai United Imaging Healthcare Co., Ltd. Methods and apparatuses for phase unwrapping

Also Published As

Publication number Publication date
JP7362893B2 (ja) 2023-10-17
TWI857889B (zh) 2024-10-01
WO2021021838A1 (en) 2021-02-04
CN114096798B (zh) 2024-10-18
TWI841765B (zh) 2024-05-11
IL301483B1 (en) 2024-03-01
CN114096798A (zh) 2022-02-25
IL289780B1 (en) 2023-04-01
IL301483A (en) 2023-05-01
US11035665B2 (en) 2021-06-15
KR20220038729A (ko) 2022-03-29
US11668557B2 (en) 2023-06-06
JP2022542959A (ja) 2022-10-07
IL301483B2 (en) 2024-07-01
IL289780A (en) 2022-03-01
IL289780B2 (en) 2023-08-01
TW202111279A (zh) 2021-03-16
TW202417811A (zh) 2024-05-01
US20210270598A1 (en) 2021-09-02
US20210033386A1 (en) 2021-02-04

Similar Documents

Publication Publication Date Title
KR102932684B1 (ko) 웨이퍼 휨 커버리지를 유지하면서 유효 픽셀을 덜 사용하여 데이터 처리 스루풋을 향상시키기 위한 시스템 및 방법
US10809055B2 (en) Apparatus and method for measuring topography and gradient of the surfaces, shape, and thickness of patterned and unpatterned wafers
JP6906292B2 (ja) パターン援用補正を用いる局所的位相アンラッピングの方法とシステム
JP5222954B2 (ja) 偏光スキャンを利用した干渉計
CN106500589B (zh) 一种多波长可调谐显微干涉的测量方法及其装置
US20120224183A1 (en) Interferometric metrology of surfaces, films and underresolved structures
US8854628B2 (en) Interferometric methods for metrology of surfaces, films and underresolved structures
EP3635328B1 (en) Methods and systems of holographic interferometry
US20120089365A1 (en) Data interpolation methods for metrology of surfaces, films and underresolved structures
WO2015125149A1 (en) Optical critical dimension metrology
US11892292B2 (en) Methods and systems of holographic interferometry
CN114631001A (zh) 高度翘曲样本的表面轮廓测量
CN104570616A (zh) 一种自参考散射测量装置及方法
WO2021222464A1 (en) Compact snapshot dual-mode interferometric system
JP7451704B2 (ja) レーザ周波数シフトによる高速位相シフト干渉法
Vishnyakov et al. Phase-shifting interferometer for monitoring flat and spherical optical components

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

B15 Application refused following examination

Free format text: ST27 STATUS EVENT CODE: N-2-6-B10-B15-EXM-PE0601 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

E13 Pre-grant limitation requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

F13 Ip right granted in full following pre-grant review

Free format text: ST27 STATUS EVENT CODE: A-3-4-F10-F13-REX-PX0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PX0701 Decision of registration after re-examination

St.27 status event code: A-3-4-F10-F13-rex-PX0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)