JP7362893B2 - ウェーハワープ適用範囲を維持しながら効率が劣るピクセルを用いてデータ処理スループットを向上させるシステム及び方法 - Google Patents

ウェーハワープ適用範囲を維持しながら効率が劣るピクセルを用いてデータ処理スループットを向上させるシステム及び方法 Download PDF

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JP7362893B2
JP7362893B2 JP2022506110A JP2022506110A JP7362893B2 JP 7362893 B2 JP7362893 B2 JP 7362893B2 JP 2022506110 A JP2022506110 A JP 2022506110A JP 2022506110 A JP2022506110 A JP 2022506110A JP 7362893 B2 JP7362893 B2 JP 7362893B2
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pixels
phase
map
subset
inspection system
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JP2022542959A (ja
JP2022542959A5 (https=
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ヘレン リウ
グオチン ジャン
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KLA Corp
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KLA Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02083—Interferometers characterised by particular signal processing and presentation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02055—Reduction or prevention of errors; Testing; Calibration
    • G01B9/02075—Reduction or prevention of errors; Testing; Calibration of particular errors
    • G01B9/02078—Caused by ambiguity
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0484—Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
    • G06F3/04842—Selection of displayed objects or displayed text elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/44—Caliper-like sensors with detectors on both sides of the object to be measured
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/48—Caliper-like sensors for measurement of a wafer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2022506110A 2019-07-30 2020-07-29 ウェーハワープ適用範囲を維持しながら効率が劣るピクセルを用いてデータ処理スループットを向上させるシステム及び方法 Active JP7362893B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962880341P 2019-07-30 2019-07-30
US62/880,341 2019-07-30
US16/688,539 US11035665B2 (en) 2019-07-30 2019-11-19 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
US16/688,539 2019-11-19
PCT/US2020/043924 WO2021021838A1 (en) 2019-07-30 2020-07-29 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage

Publications (3)

Publication Number Publication Date
JP2022542959A JP2022542959A (ja) 2022-10-07
JP2022542959A5 JP2022542959A5 (https=) 2023-07-21
JP7362893B2 true JP7362893B2 (ja) 2023-10-17

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JP2022506110A Active JP7362893B2 (ja) 2019-07-30 2020-07-29 ウェーハワープ適用範囲を維持しながら効率が劣るピクセルを用いてデータ処理スループットを向上させるシステム及び方法

Country Status (7)

Country Link
US (2) US11035665B2 (https=)
JP (1) JP7362893B2 (https=)
KR (1) KR102932684B1 (https=)
CN (1) CN114096798B (https=)
IL (2) IL301483B2 (https=)
TW (2) TWI841765B (https=)
WO (1) WO2021021838A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11035665B2 (en) * 2019-07-30 2021-06-15 Kla Corporation System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
US11469571B2 (en) 2019-11-21 2022-10-11 Kla Corporation Fast phase-shift interferometry by laser frequency shift
DE102020201958B3 (de) * 2020-02-17 2021-01-07 Carl Zeiss Smt Gmbh Messvorrichtung zur interferometrischen Formvermessung
WO2022225897A1 (en) * 2021-04-20 2022-10-27 Nikon Corporation Systems and methods for measuring height properties of surfaces
US11629952B2 (en) * 2021-06-02 2023-04-18 Kla Corporation Detection aided two-stage phase unwrapping on pattern wafer geometry measurement

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005520144A (ja) 2002-03-14 2005-07-07 テイラー・ホブソン・リミテッド 表面プロファイリング装置及び表面プロファイルデータ作成方法
JP2008082869A (ja) 2006-09-27 2008-04-10 Mitsutoyo Corp 干渉縞解析における位相接続方法
JP2011141251A (ja) 2010-01-08 2011-07-21 Nikon Corp 位相接続方法およびその方法を用いる干渉測定装置
US20180203087A1 (en) 2017-01-18 2018-07-19 Shanghai United Imaging Healthcare Co., Ltd. Methods and apparatuses for phase unwrapping

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6107953A (en) * 1999-03-10 2000-08-22 Veridian Erim International, Inc. Minimum-gradient-path phase unwrapping
US6703835B2 (en) 2002-04-11 2004-03-09 Ge Medical Systems Global Technology Co. Llc System and method for unwrapping phase difference images
US7324214B2 (en) * 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
US6847458B2 (en) 2003-03-20 2005-01-25 Phase Shift Technology, Inc. Method and apparatus for measuring the shape and thickness variation of polished opaque plates
EP1664932B1 (en) * 2003-09-15 2015-01-28 Zygo Corporation Interferometric analysis of surfaces
CN100565498C (zh) * 2008-05-05 2009-12-02 南京大学 基于相位不连续区域检测的最小不连续二维相位展开方法
CN101655357B (zh) * 2009-09-11 2011-05-04 南京大学 一种用于二维相位展开的相位梯度相关质量图获取方法
CN102032877B (zh) * 2010-11-30 2012-05-23 东南大学 基于小波变换的三维测量方法
US8643847B1 (en) * 2011-05-08 2014-02-04 Bruker Nano Inc. Interferometric technique for measuring patterned sapphire substrates
US8949057B1 (en) 2011-10-27 2015-02-03 Kla-Tencor Corporation Method for compensating for wafer shape measurement variation due to variation of environment temperature
US9121684B2 (en) 2012-01-17 2015-09-01 Kla-Tencor Corporation Method for reducing wafer shape and thickness measurement errors resulted from cavity shape changes
US9020293B2 (en) 2012-02-07 2015-04-28 National Cheung Kung University Integration of filters and phase unwrapping algorithms for removing noise in image reconstruction
US8463077B1 (en) * 2012-03-26 2013-06-11 National Cheng Kung University Rotation phase unwrapping algorithm for image reconstruction
US10352691B1 (en) 2014-04-18 2019-07-16 Kla-Tencor Corporation Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool
US9897433B2 (en) * 2015-10-30 2018-02-20 KLA—Tencor Corporation Method and system for regional phase unwrapping with pattern-assisted correction
JP6766995B2 (ja) * 2016-11-09 2020-10-14 株式会社ミツトヨ 位相シフト干渉計
CN109870129A (zh) * 2019-03-25 2019-06-11 中国计量大学 一种基于相位偏折原理的晶圆表面粗糙度检测装置
US11035665B2 (en) * 2019-07-30 2021-06-15 Kla Corporation System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005520144A (ja) 2002-03-14 2005-07-07 テイラー・ホブソン・リミテッド 表面プロファイリング装置及び表面プロファイルデータ作成方法
JP2008082869A (ja) 2006-09-27 2008-04-10 Mitsutoyo Corp 干渉縞解析における位相接続方法
JP2011141251A (ja) 2010-01-08 2011-07-21 Nikon Corp 位相接続方法およびその方法を用いる干渉測定装置
US20180203087A1 (en) 2017-01-18 2018-07-19 Shanghai United Imaging Healthcare Co., Ltd. Methods and apparatuses for phase unwrapping

Also Published As

Publication number Publication date
TWI857889B (zh) 2024-10-01
KR102932684B1 (ko) 2026-02-27
WO2021021838A1 (en) 2021-02-04
CN114096798B (zh) 2024-10-18
TWI841765B (zh) 2024-05-11
IL301483B1 (en) 2024-03-01
CN114096798A (zh) 2022-02-25
IL289780B1 (en) 2023-04-01
IL301483A (en) 2023-05-01
US11035665B2 (en) 2021-06-15
KR20220038729A (ko) 2022-03-29
US11668557B2 (en) 2023-06-06
JP2022542959A (ja) 2022-10-07
IL301483B2 (en) 2024-07-01
IL289780A (en) 2022-03-01
IL289780B2 (en) 2023-08-01
TW202111279A (zh) 2021-03-16
TW202417811A (zh) 2024-05-01
US20210270598A1 (en) 2021-09-02
US20210033386A1 (en) 2021-02-04

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