CN114096798B - 用于在保持晶片翘曲覆盖率时使用不太有效像素增强数据处理吞吐量的系统及方法 - Google Patents

用于在保持晶片翘曲覆盖率时使用不太有效像素增强数据处理吞吐量的系统及方法 Download PDF

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CN114096798B
CN114096798B CN202080049425.5A CN202080049425A CN114096798B CN 114096798 B CN114096798 B CN 114096798B CN 202080049425 A CN202080049425 A CN 202080049425A CN 114096798 B CN114096798 B CN 114096798B
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CN114096798A (zh
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海伦·刘
张国庆
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KLA Corp
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KLA Tencor Corp
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608Height gauges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/02055Reduction or prevention of errors; Testing; Calibration
    • G01B9/02075Reduction or prevention of errors; Testing; Calibration of particular errors
    • G01B9/02078Caused by ambiguity
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/02083Interferometers characterised by particular signal processing and presentation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40Caliper-like sensors
    • G01B2210/44Caliper-like sensors with detectors on both sides of the object to be measured
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40Caliper-like sensors
    • G01B2210/48Caliper-like sensors for measurement of a wafer
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0484Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
    • G06F3/04842Selection of displayed objects or displayed text elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN202080049425.5A 2019-07-30 2020-07-29 用于在保持晶片翘曲覆盖率时使用不太有效像素增强数据处理吞吐量的系统及方法 Active CN114096798B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962880341P 2019-07-30 2019-07-30
US62/880,341 2019-07-30
US16/688,539 US11035665B2 (en) 2019-07-30 2019-11-19 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
US16/688,539 2019-11-19
PCT/US2020/043924 WO2021021838A1 (en) 2019-07-30 2020-07-29 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage

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Publication Number Publication Date
CN114096798A CN114096798A (zh) 2022-02-25
CN114096798B true CN114096798B (zh) 2024-10-18

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CN202080049425.5A Active CN114096798B (zh) 2019-07-30 2020-07-29 用于在保持晶片翘曲覆盖率时使用不太有效像素增强数据处理吞吐量的系统及方法

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Country Link
US (2) US11035665B2 (https=)
JP (1) JP7362893B2 (https=)
KR (1) KR102932684B1 (https=)
CN (1) CN114096798B (https=)
IL (2) IL301483B2 (https=)
TW (2) TWI841765B (https=)
WO (1) WO2021021838A1 (https=)

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US11035665B2 (en) * 2019-07-30 2021-06-15 Kla Corporation System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
US11469571B2 (en) 2019-11-21 2022-10-11 Kla Corporation Fast phase-shift interferometry by laser frequency shift
DE102020201958B3 (de) * 2020-02-17 2021-01-07 Carl Zeiss Smt Gmbh Messvorrichtung zur interferometrischen Formvermessung
WO2022225897A1 (en) * 2021-04-20 2022-10-27 Nikon Corporation Systems and methods for measuring height properties of surfaces
US11629952B2 (en) * 2021-06-02 2023-04-18 Kla Corporation Detection aided two-stage phase unwrapping on pattern wafer geometry measurement

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CN101655357A (zh) * 2009-09-11 2010-02-24 南京大学 一种用于二维相位展开的相位梯度相关质量图获取方法

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US7324214B2 (en) * 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
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EP1664932B1 (en) * 2003-09-15 2015-01-28 Zygo Corporation Interferometric analysis of surfaces
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US9121684B2 (en) 2012-01-17 2015-09-01 Kla-Tencor Corporation Method for reducing wafer shape and thickness measurement errors resulted from cavity shape changes
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US8463077B1 (en) * 2012-03-26 2013-06-11 National Cheng Kung University Rotation phase unwrapping algorithm for image reconstruction
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CN101655357A (zh) * 2009-09-11 2010-02-24 南京大学 一种用于二维相位展开的相位梯度相关质量图获取方法

Also Published As

Publication number Publication date
JP7362893B2 (ja) 2023-10-17
TWI857889B (zh) 2024-10-01
KR102932684B1 (ko) 2026-02-27
WO2021021838A1 (en) 2021-02-04
TWI841765B (zh) 2024-05-11
IL301483B1 (en) 2024-03-01
CN114096798A (zh) 2022-02-25
IL289780B1 (en) 2023-04-01
IL301483A (en) 2023-05-01
US11035665B2 (en) 2021-06-15
KR20220038729A (ko) 2022-03-29
US11668557B2 (en) 2023-06-06
JP2022542959A (ja) 2022-10-07
IL301483B2 (en) 2024-07-01
IL289780A (en) 2022-03-01
IL289780B2 (en) 2023-08-01
TW202111279A (zh) 2021-03-16
TW202417811A (zh) 2024-05-01
US20210270598A1 (en) 2021-09-02
US20210033386A1 (en) 2021-02-04

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