CN114096798B - 用于在保持晶片翘曲覆盖率时使用不太有效像素增强数据处理吞吐量的系统及方法 - Google Patents
用于在保持晶片翘曲覆盖率时使用不太有效像素增强数据处理吞吐量的系统及方法 Download PDFInfo
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- CN114096798B CN114096798B CN202080049425.5A CN202080049425A CN114096798B CN 114096798 B CN114096798 B CN 114096798B CN 202080049425 A CN202080049425 A CN 202080049425A CN 114096798 B CN114096798 B CN 114096798B
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02055—Reduction or prevention of errors; Testing; Calibration
- G01B9/02075—Reduction or prevention of errors; Testing; Calibration of particular errors
- G01B9/02078—Caused by ambiguity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02083—Interferometers characterised by particular signal processing and presentation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/40—Caliper-like sensors
- G01B2210/44—Caliper-like sensors with detectors on both sides of the object to be measured
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/40—Caliper-like sensors
- G01B2210/48—Caliper-like sensors for measurement of a wafer
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0484—Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
- G06F3/04842—Selection of displayed objects or displayed text elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962880341P | 2019-07-30 | 2019-07-30 | |
| US62/880,341 | 2019-07-30 | ||
| US16/688,539 US11035665B2 (en) | 2019-07-30 | 2019-11-19 | System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage |
| US16/688,539 | 2019-11-19 | ||
| PCT/US2020/043924 WO2021021838A1 (en) | 2019-07-30 | 2020-07-29 | System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114096798A CN114096798A (zh) | 2022-02-25 |
| CN114096798B true CN114096798B (zh) | 2024-10-18 |
Family
ID=74228636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080049425.5A Active CN114096798B (zh) | 2019-07-30 | 2020-07-29 | 用于在保持晶片翘曲覆盖率时使用不太有效像素增强数据处理吞吐量的系统及方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11035665B2 (https=) |
| JP (1) | JP7362893B2 (https=) |
| KR (1) | KR102932684B1 (https=) |
| CN (1) | CN114096798B (https=) |
| IL (2) | IL301483B2 (https=) |
| TW (2) | TWI841765B (https=) |
| WO (1) | WO2021021838A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11035665B2 (en) * | 2019-07-30 | 2021-06-15 | Kla Corporation | System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage |
| US11469571B2 (en) | 2019-11-21 | 2022-10-11 | Kla Corporation | Fast phase-shift interferometry by laser frequency shift |
| DE102020201958B3 (de) * | 2020-02-17 | 2021-01-07 | Carl Zeiss Smt Gmbh | Messvorrichtung zur interferometrischen Formvermessung |
| WO2022225897A1 (en) * | 2021-04-20 | 2022-10-27 | Nikon Corporation | Systems and methods for measuring height properties of surfaces |
| US11629952B2 (en) * | 2021-06-02 | 2023-04-18 | Kla Corporation | Detection aided two-stage phase unwrapping on pattern wafer geometry measurement |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101276323A (zh) * | 2008-05-05 | 2008-10-01 | 南京大学 | 基于相位不连续区域检测的最小不连续二维相位展开方法 |
| CN101655357A (zh) * | 2009-09-11 | 2010-02-24 | 南京大学 | 一种用于二维相位展开的相位梯度相关质量图获取方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6107953A (en) * | 1999-03-10 | 2000-08-22 | Veridian Erim International, Inc. | Minimum-gradient-path phase unwrapping |
| US7385707B2 (en) | 2002-03-14 | 2008-06-10 | Taylor Hobson Limited | Surface profiling apparatus |
| US6703835B2 (en) | 2002-04-11 | 2004-03-09 | Ge Medical Systems Global Technology Co. Llc | System and method for unwrapping phase difference images |
| US7324214B2 (en) * | 2003-03-06 | 2008-01-29 | Zygo Corporation | Interferometer and method for measuring characteristics of optically unresolved surface features |
| US6847458B2 (en) | 2003-03-20 | 2005-01-25 | Phase Shift Technology, Inc. | Method and apparatus for measuring the shape and thickness variation of polished opaque plates |
| EP1664932B1 (en) * | 2003-09-15 | 2015-01-28 | Zygo Corporation | Interferometric analysis of surfaces |
| JP5087253B2 (ja) | 2006-09-27 | 2012-12-05 | 株式会社ミツトヨ | 干渉縞解析における位相接続方法 |
| JP2011141251A (ja) | 2010-01-08 | 2011-07-21 | Nikon Corp | 位相接続方法およびその方法を用いる干渉測定装置 |
| CN102032877B (zh) * | 2010-11-30 | 2012-05-23 | 东南大学 | 基于小波变换的三维测量方法 |
| US8643847B1 (en) * | 2011-05-08 | 2014-02-04 | Bruker Nano Inc. | Interferometric technique for measuring patterned sapphire substrates |
| US8949057B1 (en) | 2011-10-27 | 2015-02-03 | Kla-Tencor Corporation | Method for compensating for wafer shape measurement variation due to variation of environment temperature |
| US9121684B2 (en) | 2012-01-17 | 2015-09-01 | Kla-Tencor Corporation | Method for reducing wafer shape and thickness measurement errors resulted from cavity shape changes |
| US9020293B2 (en) | 2012-02-07 | 2015-04-28 | National Cheung Kung University | Integration of filters and phase unwrapping algorithms for removing noise in image reconstruction |
| US8463077B1 (en) * | 2012-03-26 | 2013-06-11 | National Cheng Kung University | Rotation phase unwrapping algorithm for image reconstruction |
| US10352691B1 (en) | 2014-04-18 | 2019-07-16 | Kla-Tencor Corporation | Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool |
| US9897433B2 (en) * | 2015-10-30 | 2018-02-20 | KLA—Tencor Corporation | Method and system for regional phase unwrapping with pattern-assisted correction |
| JP6766995B2 (ja) * | 2016-11-09 | 2020-10-14 | 株式会社ミツトヨ | 位相シフト干渉計 |
| US10571543B2 (en) | 2017-01-18 | 2020-02-25 | Shanghai United Imaging Healthcare Co., Ltd | Methods and apparatuses for phase unwrapping |
| CN109870129A (zh) * | 2019-03-25 | 2019-06-11 | 中国计量大学 | 一种基于相位偏折原理的晶圆表面粗糙度检测装置 |
| US11035665B2 (en) * | 2019-07-30 | 2021-06-15 | Kla Corporation | System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage |
-
2019
- 2019-11-19 US US16/688,539 patent/US11035665B2/en active Active
-
2020
- 2020-07-22 TW TW109124751A patent/TWI841765B/zh active
- 2020-07-22 TW TW112149803A patent/TWI857889B/zh active
- 2020-07-29 WO PCT/US2020/043924 patent/WO2021021838A1/en not_active Ceased
- 2020-07-29 IL IL301483A patent/IL301483B2/en unknown
- 2020-07-29 CN CN202080049425.5A patent/CN114096798B/zh active Active
- 2020-07-29 KR KR1020227005930A patent/KR102932684B1/ko active Active
- 2020-07-29 JP JP2022506110A patent/JP7362893B2/ja active Active
-
2021
- 2021-05-14 US US17/320,537 patent/US11668557B2/en active Active
-
2022
- 2022-01-12 IL IL289780A patent/IL289780B2/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101276323A (zh) * | 2008-05-05 | 2008-10-01 | 南京大学 | 基于相位不连续区域检测的最小不连续二维相位展开方法 |
| CN101655357A (zh) * | 2009-09-11 | 2010-02-24 | 南京大学 | 一种用于二维相位展开的相位梯度相关质量图获取方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7362893B2 (ja) | 2023-10-17 |
| TWI857889B (zh) | 2024-10-01 |
| KR102932684B1 (ko) | 2026-02-27 |
| WO2021021838A1 (en) | 2021-02-04 |
| TWI841765B (zh) | 2024-05-11 |
| IL301483B1 (en) | 2024-03-01 |
| CN114096798A (zh) | 2022-02-25 |
| IL289780B1 (en) | 2023-04-01 |
| IL301483A (en) | 2023-05-01 |
| US11035665B2 (en) | 2021-06-15 |
| KR20220038729A (ko) | 2022-03-29 |
| US11668557B2 (en) | 2023-06-06 |
| JP2022542959A (ja) | 2022-10-07 |
| IL301483B2 (en) | 2024-07-01 |
| IL289780A (en) | 2022-03-01 |
| IL289780B2 (en) | 2023-08-01 |
| TW202111279A (zh) | 2021-03-16 |
| TW202417811A (zh) | 2024-05-01 |
| US20210270598A1 (en) | 2021-09-02 |
| US20210033386A1 (en) | 2021-02-04 |
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