TWI841765B - 用於在保持晶圓翹曲覆蓋率時使用較少有效像素增強資料處理產量之系統和方法 - Google Patents

用於在保持晶圓翹曲覆蓋率時使用較少有效像素增強資料處理產量之系統和方法 Download PDF

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Publication number
TWI841765B
TWI841765B TW109124751A TW109124751A TWI841765B TW I841765 B TWI841765 B TW I841765B TW 109124751 A TW109124751 A TW 109124751A TW 109124751 A TW109124751 A TW 109124751A TW I841765 B TWI841765 B TW I841765B
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TW
Taiwan
Prior art keywords
phase
pixels
map
subset
detection system
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TW109124751A
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English (en)
Chinese (zh)
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TW202111279A (zh
Inventor
海倫 劉
張國慶
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美商科磊股份有限公司
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Publication of TW202111279A publication Critical patent/TW202111279A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02055—Reduction or prevention of errors; Testing; Calibration
    • G01B9/02075—Reduction or prevention of errors; Testing; Calibration of particular errors
    • G01B9/02078—Caused by ambiguity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02083—Interferometers characterised by particular signal processing and presentation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/44—Caliper-like sensors with detectors on both sides of the object to be measured
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/48—Caliper-like sensors for measurement of a wafer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0484—Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
    • G06F3/04842—Selection of displayed objects or displayed text elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW109124751A 2019-07-30 2020-07-22 用於在保持晶圓翹曲覆蓋率時使用較少有效像素增強資料處理產量之系統和方法 TWI841765B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962880341P 2019-07-30 2019-07-30
US62/880,341 2019-07-30
US16/688,539 US11035665B2 (en) 2019-07-30 2019-11-19 System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
US16/688,539 2019-11-19

Publications (2)

Publication Number Publication Date
TW202111279A TW202111279A (zh) 2021-03-16
TWI841765B true TWI841765B (zh) 2024-05-11

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW109124751A TWI841765B (zh) 2019-07-30 2020-07-22 用於在保持晶圓翹曲覆蓋率時使用較少有效像素增強資料處理產量之系統和方法
TW112149803A TWI857889B (zh) 2019-07-30 2020-07-22 用於在保持晶圓翹曲覆蓋率時使用較少有效像素增強資料處理產量之系統和方法

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TW112149803A TWI857889B (zh) 2019-07-30 2020-07-22 用於在保持晶圓翹曲覆蓋率時使用較少有效像素增強資料處理產量之系統和方法

Country Status (7)

Country Link
US (2) US11035665B2 (https=)
JP (1) JP7362893B2 (https=)
KR (1) KR102932684B1 (https=)
CN (1) CN114096798B (https=)
IL (2) IL301483B2 (https=)
TW (2) TWI841765B (https=)
WO (1) WO2021021838A1 (https=)

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US11035665B2 (en) * 2019-07-30 2021-06-15 Kla Corporation System and method for enhancing data processing throughput using less effective pixel while maintaining wafer warp coverage
US11469571B2 (en) 2019-11-21 2022-10-11 Kla Corporation Fast phase-shift interferometry by laser frequency shift
DE102020201958B3 (de) * 2020-02-17 2021-01-07 Carl Zeiss Smt Gmbh Messvorrichtung zur interferometrischen Formvermessung
WO2022225897A1 (en) * 2021-04-20 2022-10-27 Nikon Corporation Systems and methods for measuring height properties of surfaces
US11629952B2 (en) * 2021-06-02 2023-04-18 Kla Corporation Detection aided two-stage phase unwrapping on pattern wafer geometry measurement

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TWI334921B (en) * 2003-09-15 2010-12-21 Zygo Corp Surface profiling using an interference pattern matching template
US20120278036A1 (en) * 2010-11-30 2012-11-01 Southeast University Three-dimensional measurement method based on wavelet transform
TWI417518B (zh) * 2005-11-15 2013-12-01 Zygo Corp 干涉儀及量測光學解析下表面特徵之特性的方法
US20170241764A1 (en) * 2015-10-30 2017-08-24 Kla-Tencor Corporation Method and System for Regional Phase Unwrapping with Pattern-Assisted Correction

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US7385707B2 (en) 2002-03-14 2008-06-10 Taylor Hobson Limited Surface profiling apparatus
US6703835B2 (en) 2002-04-11 2004-03-09 Ge Medical Systems Global Technology Co. Llc System and method for unwrapping phase difference images
US6847458B2 (en) 2003-03-20 2005-01-25 Phase Shift Technology, Inc. Method and apparatus for measuring the shape and thickness variation of polished opaque plates
JP5087253B2 (ja) 2006-09-27 2012-12-05 株式会社ミツトヨ 干渉縞解析における位相接続方法
CN100565498C (zh) * 2008-05-05 2009-12-02 南京大学 基于相位不连续区域检测的最小不连续二维相位展开方法
CN101655357B (zh) * 2009-09-11 2011-05-04 南京大学 一种用于二维相位展开的相位梯度相关质量图获取方法
JP2011141251A (ja) 2010-01-08 2011-07-21 Nikon Corp 位相接続方法およびその方法を用いる干渉測定装置
US8643847B1 (en) * 2011-05-08 2014-02-04 Bruker Nano Inc. Interferometric technique for measuring patterned sapphire substrates
US8949057B1 (en) 2011-10-27 2015-02-03 Kla-Tencor Corporation Method for compensating for wafer shape measurement variation due to variation of environment temperature
US9121684B2 (en) 2012-01-17 2015-09-01 Kla-Tencor Corporation Method for reducing wafer shape and thickness measurement errors resulted from cavity shape changes
US9020293B2 (en) 2012-02-07 2015-04-28 National Cheung Kung University Integration of filters and phase unwrapping algorithms for removing noise in image reconstruction
US8463077B1 (en) * 2012-03-26 2013-06-11 National Cheng Kung University Rotation phase unwrapping algorithm for image reconstruction
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CN109870129A (zh) * 2019-03-25 2019-06-11 中国计量大学 一种基于相位偏折原理的晶圆表面粗糙度检测装置
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TWI334921B (en) * 2003-09-15 2010-12-21 Zygo Corp Surface profiling using an interference pattern matching template
TWI417518B (zh) * 2005-11-15 2013-12-01 Zygo Corp 干涉儀及量測光學解析下表面特徵之特性的方法
US20120278036A1 (en) * 2010-11-30 2012-11-01 Southeast University Three-dimensional measurement method based on wavelet transform
US20170241764A1 (en) * 2015-10-30 2017-08-24 Kla-Tencor Corporation Method and System for Regional Phase Unwrapping with Pattern-Assisted Correction

Also Published As

Publication number Publication date
JP7362893B2 (ja) 2023-10-17
TWI857889B (zh) 2024-10-01
KR102932684B1 (ko) 2026-02-27
WO2021021838A1 (en) 2021-02-04
CN114096798B (zh) 2024-10-18
IL301483B1 (en) 2024-03-01
CN114096798A (zh) 2022-02-25
IL289780B1 (en) 2023-04-01
IL301483A (en) 2023-05-01
US11035665B2 (en) 2021-06-15
KR20220038729A (ko) 2022-03-29
US11668557B2 (en) 2023-06-06
JP2022542959A (ja) 2022-10-07
IL301483B2 (en) 2024-07-01
IL289780A (en) 2022-03-01
IL289780B2 (en) 2023-08-01
TW202111279A (zh) 2021-03-16
TW202417811A (zh) 2024-05-01
US20210270598A1 (en) 2021-09-02
US20210033386A1 (en) 2021-02-04

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