JP2022510025A5 - - Google Patents

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Publication number
JP2022510025A5
JP2022510025A5 JP2021531979A JP2021531979A JP2022510025A5 JP 2022510025 A5 JP2022510025 A5 JP 2022510025A5 JP 2021531979 A JP2021531979 A JP 2021531979A JP 2021531979 A JP2021531979 A JP 2021531979A JP 2022510025 A5 JP2022510025 A5 JP 2022510025A5
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JP
Japan
Prior art keywords
measurement
model
tool
har
test
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JP2021531979A
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English (en)
Japanese (ja)
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JP2022510025A (ja
JP7268156B2 (ja
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Priority claimed from US16/287,523 external-priority patent/US11562289B2/en
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Publication of JP2022510025A5 publication Critical patent/JP2022510025A5/ja
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Publication of JP7268156B2 publication Critical patent/JP7268156B2/ja
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JP2021531979A 2018-12-06 2019-12-06 大量生産工程監視用に疎結合された検査及び計測システム Active JP7268156B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862776292P 2018-12-06 2018-12-06
US62/776,292 2018-12-06
US16/287,523 US11562289B2 (en) 2018-12-06 2019-02-27 Loosely-coupled inspection and metrology system for high-volume production process monitoring
US16/287,523 2019-02-27
PCT/US2019/064805 WO2020118125A1 (en) 2018-12-06 2019-12-06 Loosely coupled inspection and metrology system for high-volume production process monitoring

Publications (3)

Publication Number Publication Date
JP2022510025A JP2022510025A (ja) 2022-01-25
JP2022510025A5 true JP2022510025A5 (https=) 2022-12-08
JP7268156B2 JP7268156B2 (ja) 2023-05-02

Family

ID=70971025

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Application Number Title Priority Date Filing Date
JP2021531979A Active JP7268156B2 (ja) 2018-12-06 2019-12-06 大量生産工程監視用に疎結合された検査及び計測システム

Country Status (7)

Country Link
US (1) US11562289B2 (https=)
JP (1) JP7268156B2 (https=)
KR (1) KR102471847B1 (https=)
CN (1) CN113348358B (https=)
DE (1) DE112019006092T5 (https=)
TW (1) TWI805876B (https=)
WO (1) WO2020118125A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11761913B2 (en) * 2020-05-04 2023-09-19 Bruker Technologies Ltd. Transmission X-ray critical dimension (T-XCD) characterization of shift and tilt of stacks of high-aspect-ratio (HAR) structures
JP7458935B2 (ja) * 2020-08-26 2024-04-01 キオクシア株式会社 計測装置、及び、計測方法
US12117783B2 (en) * 2020-10-15 2024-10-15 Abb Schweiz Ag Online frequently derived measurements for process monitoring, control and optimization
US20240111256A1 (en) * 2022-09-30 2024-04-04 Onto Innovation Inc. Composite data for device metrology
US20250053096A1 (en) * 2023-08-07 2025-02-13 Kla Corporation Flexible Measurement Models For Model Based Measurements Of Semiconductor Structures

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020018217A1 (en) * 2000-08-11 2002-02-14 Michael Weber-Grabau Optical critical dimension metrology system integrated into semiconductor wafer process tool
US6816570B2 (en) 2002-03-07 2004-11-09 Kla-Tencor Corporation Multi-technique thin film analysis tool
US7330279B2 (en) * 2002-07-25 2008-02-12 Timbre Technologies, Inc. Model and parameter selection for optical metrology
US7478019B2 (en) 2005-01-26 2009-01-13 Kla-Tencor Corporation Multiple tool and structure analysis
US7511835B2 (en) * 2007-04-12 2009-03-31 Tokyo Electron Limited Optical metrology using a support vector machine with simulated diffraction signal inputs
US9103664B2 (en) * 2010-04-01 2015-08-11 Tokyo Electron Limited Automated process control using an adjusted metrology output signal
US8565379B2 (en) 2011-03-14 2013-10-22 Jordan Valley Semiconductors Ltd. Combining X-ray and VUV analysis of thin film layers
TWI471117B (zh) * 2011-04-29 2015-02-01 Nat Applied Res Laboratoires 可用於行動裝置之人臉膚質評估演算介面裝置
US8693747B2 (en) 2011-04-29 2014-04-08 General Electric Company Radiological image noise reduction system and method
US10013518B2 (en) * 2012-07-10 2018-07-03 Kla-Tencor Corporation Model building and analysis engine for combined X-ray and optical metrology
US9535018B2 (en) 2013-07-08 2017-01-03 Kla-Tencor Corporation Combined x-ray and optical metrology
CN105224704B (zh) * 2014-06-25 2018-08-24 中国科学院海洋研究所 一种海底不稳定性的评价方法
WO2016124345A1 (en) 2015-02-04 2016-08-11 Asml Netherlands B.V. Metrology method, metrology apparatus and device manufacturing method
US10697908B2 (en) * 2015-06-01 2020-06-30 Xwinsys Ltd. Metrology inspection apparatus
US10352695B2 (en) 2015-12-11 2019-07-16 Kla-Tencor Corporation X-ray scatterometry metrology for high aspect ratio structures
US9921152B2 (en) 2016-01-15 2018-03-20 Kla-Tencor Corporation Systems and methods for extended infrared spectroscopic ellipsometry
WO2018075808A1 (en) * 2016-10-20 2018-04-26 Kla-Tencor Corporation Hybrid metrology for patterned wafer characterization

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