JP2021506133A5 - - Google Patents

Download PDF

Info

Publication number
JP2021506133A5
JP2021506133A5 JP2020531728A JP2020531728A JP2021506133A5 JP 2021506133 A5 JP2021506133 A5 JP 2021506133A5 JP 2020531728 A JP2020531728 A JP 2020531728A JP 2020531728 A JP2020531728 A JP 2020531728A JP 2021506133 A5 JP2021506133 A5 JP 2021506133A5
Authority
JP
Japan
Prior art keywords
measurement
target
layer
periodic
weighing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020531728A
Other languages
English (en)
Japanese (ja)
Other versions
JP7097971B2 (ja
JP2021506133A (ja
Filing date
Publication date
Priority claimed from US16/132,157 external-priority patent/US11085754B2/en
Application filed filed Critical
Publication of JP2021506133A publication Critical patent/JP2021506133A/ja
Publication of JP2021506133A5 publication Critical patent/JP2021506133A5/ja
Application granted granted Critical
Publication of JP7097971B2 publication Critical patent/JP7097971B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

JP2020531728A 2017-12-12 2018-09-24 計量ターゲット情報コンテンツの増強 Active JP7097971B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762597900P 2017-12-12 2017-12-12
US62/597,900 2017-12-12
US16/132,157 US11085754B2 (en) 2017-12-12 2018-09-14 Enhancing metrology target information content
US16/132,157 2018-09-14
PCT/US2018/052333 WO2019118039A1 (en) 2017-12-12 2018-09-24 Enhancing metrology target information content

Publications (3)

Publication Number Publication Date
JP2021506133A JP2021506133A (ja) 2021-02-18
JP2021506133A5 true JP2021506133A5 (https=) 2021-11-04
JP7097971B2 JP7097971B2 (ja) 2022-07-08

Family

ID=66735331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020531728A Active JP7097971B2 (ja) 2017-12-12 2018-09-24 計量ターゲット情報コンテンツの増強

Country Status (7)

Country Link
US (1) US11085754B2 (https=)
JP (1) JP7097971B2 (https=)
KR (1) KR102362670B1 (https=)
CN (1) CN111433559B (https=)
SG (1) SG11201913458TA (https=)
TW (1) TW201934958A (https=)
WO (1) WO2019118039A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113439240A (zh) * 2019-02-19 2021-09-24 Asml控股股份有限公司 量测系统、光刻设备和方法
US11353799B1 (en) * 2019-07-23 2022-06-07 Kla Corporation System and method for error reduction for metrology measurements
WO2021054928A1 (en) * 2019-09-16 2021-03-25 Kla Corporation Periodic semiconductor device misregistration metrology system and method
US11415898B2 (en) * 2019-10-14 2022-08-16 Kla Corporation Signal-domain adaptation for metrology
CN110823812B (zh) * 2019-10-29 2020-11-24 上海交通大学 基于机器学习的散射介质成像方法及系统
US12100574B2 (en) * 2020-07-01 2024-09-24 Kla Corporation Target and algorithm to measure overlay by modeling back scattering electrons on overlapping structures
US12250503B2 (en) * 2020-12-24 2025-03-11 Applied Materials Israel Ltd. Prediction of electrical properties of a semiconductor specimen
US20220284342A1 (en) * 2021-03-04 2022-09-08 Applied Materials, Inc. Systems and methods for process chamber health monitoring and diagnostics using virtual model
CN113095045B (zh) * 2021-04-20 2023-11-10 河海大学 一种基于逆向操作的中文数学应用题数据增强方法
US12181271B2 (en) * 2022-02-17 2024-12-31 Kla Corporation Estimating in-die overlay with tool induced shift correction

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1537703A (en) * 1976-01-27 1979-01-04 Rca Corp Fabrication of rectangular relief profiles in photoresist
JP4366458B2 (ja) * 1998-02-27 2009-11-18 新オプトウエア株式会社 光情報記録媒体
JP2000218708A (ja) * 1999-01-01 2000-08-08 Three D Syst Inc 立体造形装置および方法
JP3881125B2 (ja) * 1999-02-17 2007-02-14 レーザーテック株式会社 段差測定装置並びにこの段差測定装置を用いたエッチングモニタ装置及びエッチング方法
JP4199408B2 (ja) * 2000-04-28 2008-12-17 富士フイルム株式会社 波長変換素子、波長変換素子の製造方法、及び波長変換モジュール
US7541201B2 (en) 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US7317531B2 (en) 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7068833B1 (en) * 2000-08-30 2006-06-27 Kla-Tencor Corporation Overlay marks, methods of overlay mark design and methods of overlay measurements
JP5180419B2 (ja) 2000-08-30 2013-04-10 ケーエルエー−テンカー・コーポレーション 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法
JP3878027B2 (ja) * 2002-02-18 2007-02-07 東京エレクトロン株式会社 偏光解析方法及び光学的膜厚測定装置
JP2004118894A (ja) * 2002-09-24 2004-04-15 Victor Co Of Japan Ltd ディスク状磁気記録媒体
US7833640B2 (en) * 2005-08-19 2010-11-16 Hitachi Global Storage Technologies Netherlands B.V. Intermediate tri-layer structure for perpendicular recording media
US7863763B2 (en) 2005-11-22 2011-01-04 Asml Netherlands B.V. Binary sinusoidal sub-wavelength gratings as alignment marks
US7671990B1 (en) 2006-07-28 2010-03-02 Kla-Tencor Technologies Corporation Cross hatched metrology marks and associated method of use
CA2600900A1 (en) * 2006-09-21 2008-03-21 Nippon Sheet Glass Company, Limited Transmissive diffraction grating, and spectral separation element and spectroscope using the same
JP4897006B2 (ja) * 2008-03-04 2012-03-14 エーエスエムエル ネザーランズ ビー．ブイ． アラインメントマークを設ける方法、デバイス製造方法及びリソグラフィ装置
NL2003179A1 (nl) * 2008-07-18 2010-01-19 Asml Netherlands Bv Lithographic apparatus and device manufacturing method and scatterometry method and measurement system used therein.
US9709903B2 (en) 2011-11-01 2017-07-18 Kla-Tencor Corporation Overlay target geometry for measuring multiple pitches
US8879073B2 (en) * 2012-02-24 2014-11-04 Kla-Tencor Corporation Optical metrology using targets with field enhancement elements
US8913237B2 (en) 2012-06-26 2014-12-16 Kla-Tencor Corporation Device-like scatterometry overlay targets
CN103631761B (zh) * 2012-08-29 2018-02-27 睿励科学仪器（上海）有限公司 并行处理架构进行矩阵运算并用于严格波耦合分析的方法
US9093458B2 (en) * 2012-09-06 2015-07-28 Kla-Tencor Corporation Device correlated metrology (DCM) for OVL with embedded SEM structure overlay targets
WO2014062972A1 (en) 2012-10-18 2014-04-24 Kla-Tencor Corporation Symmetric target design in scatterometry overlay metrology
JP2014107348A (ja) * 2012-11-26 2014-06-09 Renesas Electronics Corp 半導体装置
WO2014194095A1 (en) * 2013-05-30 2014-12-04 Kla-Tencor Corporation Combined imaging and scatterometry metrology
US9490182B2 (en) * 2013-12-23 2016-11-08 Kla-Tencor Corporation Measurement of multiple patterning parameters
KR102285895B1 (ko) * 2014-03-31 2021-08-04 케이엘에이 코포레이션 산란측정 계측을 이용한 초점 측정
KR102574171B1 (ko) * 2014-08-29 2023-09-06 에이에스엠엘 네델란즈 비.브이. 메트롤로지 방법, 타겟 및 기판
WO2016123552A1 (en) 2015-01-30 2016-08-04 Kla-Tencor Corporation Device metrology targets and methods
US9903711B2 (en) * 2015-04-06 2018-02-27 KLA—Tencor Corporation Feed forward of metrology data in a metrology system
TWI715582B (zh) 2015-05-19 2021-01-11 美商克萊譚克公司 用於疊對測量之形貌相位控制
US10615084B2 (en) 2016-03-01 2020-04-07 Asml Netherlands B.V. Method and apparatus to determine a patterning process parameter, associated with a change in a physical configuration, using measured pixel optical characteristic values
US10551749B2 (en) 2017-01-04 2020-02-04 Kla-Tencor Corporation Metrology targets with supplementary structures in an intermediate layer

Similar Documents

Publication Publication Date Title
JP2021506133A5 (https=)
TWI735747B (zh) 度量方法及模組，分段疊對目標，及電腦程式產品
CN111033382B (zh) 在成像叠加计量中利用叠加错位误差估计
TWI604545B (zh) 使用晶圓尺寸幾何工具之晶圓高階形狀特徵化及晶圓分類之系統，方法及度量
KR20170088403A (ko) 랜드스케이프의 분석 및 활용
TW201818136A (zh) 以繞射為基礎之聚焦度量
CN110573832B (zh) 机器视觉系统
WO2017007535A1 (en) Method and apparatus for scanning object
JP2021509772A (ja) 電子顕微鏡を使用した半導体計測および欠陥分類
CN106294935B (zh) 一种基于图形密度的工艺模型建模与修正方法
JP2018505388A (ja) ウェハにおける臨界寸法問題及びパターン不良の干渉法を用いた予測及び制御
US10955359B2 (en) Method for quantification of process non uniformity using model-based metrology
TWI621908B (zh) 由差分程序的決定積體電路製造製程的參數的方法
JP6570010B2 (ja) マスクのための高密度位置合わせマップを生成するための方法、システム、およびコンピュータプログラム製品
US10837768B2 (en) Shape measurement method and shape measurement apparatus
Müller et al. Comparison of different measures for the single point uncertainty in industrial X-ray computed tomography
JP6376081B2 (ja) 被検体の形状算出方法、鋼板のプレス矯正方法および鋼板の製造方法
JP2020160464A (ja) 整合手順によってｉｃ製造プロセスに適用されるドーズ補正を決定するための方法
CN120155669B (zh) 一种全自动激光视觉打码机及打码路径优化方法
CN110870052B (zh) 在成像技术中估计振幅及相位不对称性以在叠加计量中达到高精准度
TWI878245B (zh) 單一單元灰階散射術之重疊目標及其使用變化照明參數之量測
JP2018531423A6 (ja) 整合手順によってｉｃ製造プロセスに適用されるドーズ補正を判断するための方法
CN108885407A (zh) 叠加方差稳定化方法及系统
JP6858391B2 (ja) Ｘ線ｃｔ装置、画像補正方法及び画像補正プログラム
KR102050628B1 (ko) 유도성 자기 조립 프로세스에서의 제품 상의 노광 파라미터들의 도출 및 조정