JP2022522424A - スタンプの生成及び硬化のための方法及び装置 - Google Patents

スタンプの生成及び硬化のための方法及び装置 Download PDF

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Publication number
JP2022522424A
JP2022522424A JP2021549626A JP2021549626A JP2022522424A JP 2022522424 A JP2022522424 A JP 2022522424A JP 2021549626 A JP2021549626 A JP 2021549626A JP 2021549626 A JP2021549626 A JP 2021549626A JP 2022522424 A JP2022522424 A JP 2022522424A
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JP
Japan
Prior art keywords
stamp
layer
resist
substrate
imprint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021549626A
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English (en)
Japanese (ja)
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JPWO2020180718A5 (https=
JP2022522424A5 (https=
Inventor
マイケル ワイ． ヤング，
ルドヴィーク ゴデット，
ロバート ジェイ． ヴィッサー，
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2022522424A publication Critical patent/JP2022522424A/ja
Publication of JPWO2020180718A5 publication Critical patent/JPWO2020180718A5/ja
Publication of JP2022522424A5 publication Critical patent/JP2022522424A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0015—Production of aperture devices, microporous systems or stamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2021549626A 2019-03-01 2020-02-28 スタンプの生成及び硬化のための方法及び装置 Pending JP2022522424A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/290,635 2019-03-01
US16/290,635 US20200278605A1 (en) 2019-03-01 2019-03-01 Method and apparatus for stamp generation and curing
PCT/US2020/020468 WO2020180718A1 (en) 2019-03-01 2020-02-28 Method and apparatus for stamp generation and curing

Publications (3)

Publication Number Publication Date
JP2022522424A true JP2022522424A (ja) 2022-04-19
JPWO2020180718A5 JPWO2020180718A5 (https=) 2023-03-08
JP2022522424A5 JP2022522424A5 (https=) 2023-03-08

Family

ID=72236252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021549626A Pending JP2022522424A (ja) 2019-03-01 2020-02-28 スタンプの生成及び硬化のための方法及び装置

Country Status (6)

Country Link
US (2) US20200278605A1 (https=)
EP (1) EP3931638A4 (https=)
JP (1) JP2022522424A (https=)
KR (1) KR20210124495A (https=)
CN (1) CN113508336A (https=)
WO (1) WO2020180718A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202332568A (zh) * 2021-11-15 2023-08-16 荷蘭商摩富塔尼克斯控股公司 壓印方法
US20240168207A1 (en) * 2022-11-23 2024-05-23 Google Llc Fabrication of slanted grating master and working stamp using grayscale lithography and plasma etching
US12572067B2 (en) 2023-03-23 2026-03-10 International Business Machines Corporation Guiding structures for fabrication of angled features in a semiconductor device
US12558835B1 (en) 2023-03-23 2026-02-24 International Business Machines Corporation Fabrication of asymmetric mandrel structures in semiconductor device
US20240319584A1 (en) * 2023-03-23 2024-09-26 International Business Machines Corporation Fabrication of angled mandrel structures in semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0580530A (ja) * 1991-09-24 1993-04-02 Hitachi Ltd 薄膜パターン製造方法
JPH09511710A (ja) * 1995-08-04 1997-11-25 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン リソグラフィ・プロセス用のスタンプ
JP2003249444A (ja) * 2002-01-23 2003-09-05 Hewlett Packard Co <Hp> ミクロンおよびサブミクロン構造を有する半導体および他のマイクロ装置およびナノ装置の製造中の光学−機械式構造作製方法
JP2010245130A (ja) * 2009-04-01 2010-10-28 Jsr Corp スタンパ及びこれを用いた光インプリントリソグラフィ方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6387787B1 (en) * 2001-03-02 2002-05-14 Motorola, Inc. Lithographic template and method of formation and use
WO2004086471A1 (en) * 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
KR100566700B1 (ko) * 2004-01-15 2006-04-03 삼성전자주식회사 반도체 공정에서 포토레지스트 패턴 형성 방법,포토레지스트 패턴 형성용 템플레이트 및 이의 제조 방법.
KR101413233B1 (ko) * 2007-09-14 2014-06-30 삼성전자 주식회사 나노 임프린트 리소그래피 공정
JP2010287625A (ja) * 2009-06-09 2010-12-24 Toshiba Corp テンプレート及びパターン形成方法
KR100988935B1 (ko) * 2009-10-28 2010-10-20 한국기계연구원 롤 임프린트 장치
BR112017013073A2 (pt) * 2014-12-22 2018-01-02 Koninklijke Philips Nv estampa para litografia de estampagem, método de fabricação de uma estampa, uso de uma estampa, e método de impressão
EP3481562A4 (en) * 2016-07-08 2019-06-26 University of Massachusetts STRUCTURING OF NANOSTRUCTURES WITH IMPRINT LITHOGRAPHY
WO2018170474A1 (en) * 2017-03-17 2018-09-20 University Of Massachusetts Direct printing of 3-d microbatteries and electrodes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0580530A (ja) * 1991-09-24 1993-04-02 Hitachi Ltd 薄膜パターン製造方法
JPH09511710A (ja) * 1995-08-04 1997-11-25 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン リソグラフィ・プロセス用のスタンプ
JP2003249444A (ja) * 2002-01-23 2003-09-05 Hewlett Packard Co <Hp> ミクロンおよびサブミクロン構造を有する半導体および他のマイクロ装置およびナノ装置の製造中の光学−機械式構造作製方法
JP2010245130A (ja) * 2009-04-01 2010-10-28 Jsr Corp スタンパ及びこれを用いた光インプリントリソグラフィ方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ARFAT PRADANA ET AL.: "Tailoring the refractive index ofnanoimprint resist by blending with TiO2 nanoparticles", OPTICAL MATERIALS EXPRESS, vol. Vol. 4, Issue 2, JPN6024013025, 24 January 2014 (2014-01-24), US, pages 329 - 337, ISSN: 0005452108 *

Also Published As

Publication number Publication date
EP3931638A1 (en) 2022-01-05
CN113508336A (zh) 2021-10-15
EP3931638A4 (en) 2022-12-28
WO2020180718A1 (en) 2020-09-10
KR20210124495A (ko) 2021-10-14
US20220057710A1 (en) 2022-02-24
US20200278605A1 (en) 2020-09-03

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