JPWO2020180718A5 - - Google Patents
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- Publication number
- JPWO2020180718A5 JPWO2020180718A5 JP2021549626A JP2021549626A JPWO2020180718A5 JP WO2020180718 A5 JPWO2020180718 A5 JP WO2020180718A5 JP 2021549626 A JP2021549626 A JP 2021549626A JP 2021549626 A JP2021549626 A JP 2021549626A JP WO2020180718 A5 JPWO2020180718 A5 JP WO2020180718A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- stamp
- resist
- substrate
- imprint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 60
- 239000010410 layer Substances 0.000 claims description 40
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 28
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 26
- 230000000903 blocking effect Effects 0.000 claims description 23
- 239000002105 nanoparticle Substances 0.000 claims description 17
- 230000005855 radiation Effects 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000011247 coating layer Substances 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 230000009977 dual effect Effects 0.000 claims description 2
- 238000000206 photolithography Methods 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims 5
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- -1 polydimethylsiloxane Polymers 0.000 claims 2
- 238000003825 pressing Methods 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000003362 replicative effect Effects 0.000 claims 1
- 238000004528 spin coating Methods 0.000 claims 1
- 239000004408 titanium dioxide Substances 0.000 claims 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 27
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 26
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/290,635 | 2019-03-01 | ||
| US16/290,635 US20200278605A1 (en) | 2019-03-01 | 2019-03-01 | Method and apparatus for stamp generation and curing |
| PCT/US2020/020468 WO2020180718A1 (en) | 2019-03-01 | 2020-02-28 | Method and apparatus for stamp generation and curing |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022522424A JP2022522424A (ja) | 2022-04-19 |
| JPWO2020180718A5 true JPWO2020180718A5 (https=) | 2023-03-08 |
| JP2022522424A5 JP2022522424A5 (https=) | 2023-03-08 |
Family
ID=72236252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021549626A Pending JP2022522424A (ja) | 2019-03-01 | 2020-02-28 | スタンプの生成及び硬化のための方法及び装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20200278605A1 (https=) |
| EP (1) | EP3931638A4 (https=) |
| JP (1) | JP2022522424A (https=) |
| KR (1) | KR20210124495A (https=) |
| CN (1) | CN113508336A (https=) |
| WO (1) | WO2020180718A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202332568A (zh) * | 2021-11-15 | 2023-08-16 | 荷蘭商摩富塔尼克斯控股公司 | 壓印方法 |
| US20240168207A1 (en) * | 2022-11-23 | 2024-05-23 | Google Llc | Fabrication of slanted grating master and working stamp using grayscale lithography and plasma etching |
| US12572067B2 (en) | 2023-03-23 | 2026-03-10 | International Business Machines Corporation | Guiding structures for fabrication of angled features in a semiconductor device |
| US12558835B1 (en) | 2023-03-23 | 2026-02-24 | International Business Machines Corporation | Fabrication of asymmetric mandrel structures in semiconductor device |
| US20240319584A1 (en) * | 2023-03-23 | 2024-09-26 | International Business Machines Corporation | Fabrication of angled mandrel structures in semiconductor device |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0580530A (ja) * | 1991-09-24 | 1993-04-02 | Hitachi Ltd | 薄膜パターン製造方法 |
| WO1997006012A1 (en) | 1995-08-04 | 1997-02-20 | International Business Machines Corporation | Stamp for a lithographic process |
| US6387787B1 (en) * | 2001-03-02 | 2002-05-14 | Motorola, Inc. | Lithographic template and method of formation and use |
| US6653030B2 (en) * | 2002-01-23 | 2003-11-25 | Hewlett-Packard Development Company, L.P. | Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features |
| WO2004086471A1 (en) * | 2003-03-27 | 2004-10-07 | Korea Institute Of Machinery & Materials | Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization |
| KR100566700B1 (ko) * | 2004-01-15 | 2006-04-03 | 삼성전자주식회사 | 반도체 공정에서 포토레지스트 패턴 형성 방법,포토레지스트 패턴 형성용 템플레이트 및 이의 제조 방법. |
| KR101413233B1 (ko) * | 2007-09-14 | 2014-06-30 | 삼성전자 주식회사 | 나노 임프린트 리소그래피 공정 |
| JP2010245130A (ja) * | 2009-04-01 | 2010-10-28 | Jsr Corp | スタンパ及びこれを用いた光インプリントリソグラフィ方法 |
| JP2010287625A (ja) * | 2009-06-09 | 2010-12-24 | Toshiba Corp | テンプレート及びパターン形成方法 |
| KR100988935B1 (ko) * | 2009-10-28 | 2010-10-20 | 한국기계연구원 | 롤 임프린트 장치 |
| BR112017013073A2 (pt) * | 2014-12-22 | 2018-01-02 | Koninklijke Philips Nv | estampa para litografia de estampagem, método de fabricação de uma estampa, uso de uma estampa, e método de impressão |
| EP3481562A4 (en) * | 2016-07-08 | 2019-06-26 | University of Massachusetts | STRUCTURING OF NANOSTRUCTURES WITH IMPRINT LITHOGRAPHY |
| WO2018170474A1 (en) * | 2017-03-17 | 2018-09-20 | University Of Massachusetts | Direct printing of 3-d microbatteries and electrodes |
-
2019
- 2019-03-01 US US16/290,635 patent/US20200278605A1/en not_active Abandoned
-
2020
- 2020-02-28 EP EP20766669.4A patent/EP3931638A4/en active Pending
- 2020-02-28 JP JP2021549626A patent/JP2022522424A/ja active Pending
- 2020-02-28 KR KR1020217030983A patent/KR20210124495A/ko not_active Ceased
- 2020-02-28 CN CN202080018072.2A patent/CN113508336A/zh active Pending
- 2020-02-28 WO PCT/US2020/020468 patent/WO2020180718A1/en not_active Ceased
-
2021
- 2021-09-29 US US17/489,551 patent/US20220057710A1/en not_active Abandoned
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