CN113508336A - 用于压模产生和固化的方法和设备 - Google Patents

用于压模产生和固化的方法和设备 Download PDF

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Publication number
CN113508336A
CN113508336A CN202080018072.2A CN202080018072A CN113508336A CN 113508336 A CN113508336 A CN 113508336A CN 202080018072 A CN202080018072 A CN 202080018072A CN 113508336 A CN113508336 A CN 113508336A
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CN
China
Prior art keywords
substrate
stamper
layer
resist
imprint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080018072.2A
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English (en)
Chinese (zh)
Inventor
迈克尔·Y·扬
卢多维克·戈代
罗伯特·J·维瑟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN113508336A publication Critical patent/CN113508336A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0015—Production of aperture devices, microporous systems or stamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN202080018072.2A 2019-03-01 2020-02-28 用于压模产生和固化的方法和设备 Pending CN113508336A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/290,635 2019-03-01
US16/290,635 US20200278605A1 (en) 2019-03-01 2019-03-01 Method and apparatus for stamp generation and curing
PCT/US2020/020468 WO2020180718A1 (en) 2019-03-01 2020-02-28 Method and apparatus for stamp generation and curing

Publications (1)

Publication Number Publication Date
CN113508336A true CN113508336A (zh) 2021-10-15

Family

ID=72236252

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080018072.2A Pending CN113508336A (zh) 2019-03-01 2020-02-28 用于压模产生和固化的方法和设备

Country Status (6)

Country Link
US (2) US20200278605A1 (https=)
EP (1) EP3931638A4 (https=)
JP (1) JP2022522424A (https=)
KR (1) KR20210124495A (https=)
CN (1) CN113508336A (https=)
WO (1) WO2020180718A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202332568A (zh) * 2021-11-15 2023-08-16 荷蘭商摩富塔尼克斯控股公司 壓印方法
US20240168207A1 (en) * 2022-11-23 2024-05-23 Google Llc Fabrication of slanted grating master and working stamp using grayscale lithography and plasma etching
US12572067B2 (en) 2023-03-23 2026-03-10 International Business Machines Corporation Guiding structures for fabrication of angled features in a semiconductor device
US12558835B1 (en) 2023-03-23 2026-02-24 International Business Machines Corporation Fabrication of asymmetric mandrel structures in semiconductor device
US20240319584A1 (en) * 2023-03-23 2024-09-26 International Business Machines Corporation Fabrication of angled mandrel structures in semiconductor device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5259926A (en) * 1991-09-24 1993-11-09 Hitachi, Ltd. Method of manufacturing a thin-film pattern on a substrate
US5817242A (en) * 1995-08-04 1998-10-06 International Business Machines Corporation Stamp for a lithographic process
US20050158637A1 (en) * 2004-01-15 2005-07-21 Samsung Electronics Co., Ltd. Template, method of forming the template and method of forming a pattern on a semiconductor device using the template
KR20090028224A (ko) * 2007-09-14 2009-03-18 삼성전자주식회사 나노 임프린트 리소그래피 공정
CN107111226A (zh) * 2014-12-22 2017-08-29 皇家飞利浦有限公司 图案化印模制造方法、图案化印模和压印方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6387787B1 (en) * 2001-03-02 2002-05-14 Motorola, Inc. Lithographic template and method of formation and use
US6653030B2 (en) * 2002-01-23 2003-11-25 Hewlett-Packard Development Company, L.P. Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features
WO2004086471A1 (en) * 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
JP2010245130A (ja) * 2009-04-01 2010-10-28 Jsr Corp スタンパ及びこれを用いた光インプリントリソグラフィ方法
JP2010287625A (ja) * 2009-06-09 2010-12-24 Toshiba Corp テンプレート及びパターン形成方法
KR100988935B1 (ko) * 2009-10-28 2010-10-20 한국기계연구원 롤 임프린트 장치
EP3481562A4 (en) * 2016-07-08 2019-06-26 University of Massachusetts STRUCTURING OF NANOSTRUCTURES WITH IMPRINT LITHOGRAPHY
WO2018170474A1 (en) * 2017-03-17 2018-09-20 University Of Massachusetts Direct printing of 3-d microbatteries and electrodes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5259926A (en) * 1991-09-24 1993-11-09 Hitachi, Ltd. Method of manufacturing a thin-film pattern on a substrate
US5817242A (en) * 1995-08-04 1998-10-06 International Business Machines Corporation Stamp for a lithographic process
US20050158637A1 (en) * 2004-01-15 2005-07-21 Samsung Electronics Co., Ltd. Template, method of forming the template and method of forming a pattern on a semiconductor device using the template
KR20090028224A (ko) * 2007-09-14 2009-03-18 삼성전자주식회사 나노 임프린트 리소그래피 공정
CN107111226A (zh) * 2014-12-22 2017-08-29 皇家飞利浦有限公司 图案化印模制造方法、图案化印模和压印方法

Also Published As

Publication number Publication date
EP3931638A1 (en) 2022-01-05
JP2022522424A (ja) 2022-04-19
EP3931638A4 (en) 2022-12-28
WO2020180718A1 (en) 2020-09-10
KR20210124495A (ko) 2021-10-14
US20220057710A1 (en) 2022-02-24
US20200278605A1 (en) 2020-09-03

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Application publication date: 20211015