JP2022501207A5 - - Google Patents
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- Publication number
- JP2022501207A5 JP2022501207A5 JP2021515551A JP2021515551A JP2022501207A5 JP 2022501207 A5 JP2022501207 A5 JP 2022501207A5 JP 2021515551 A JP2021515551 A JP 2021515551A JP 2021515551 A JP2021515551 A JP 2021515551A JP 2022501207 A5 JP2022501207 A5 JP 2022501207A5
- Authority
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- Japan
- Prior art keywords
- spectrum
- insite
- monitoring system
- measurement
- controller
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862735772P | 2018-09-24 | 2018-09-24 | |
| US62/735,772 | 2018-09-24 | ||
| PCT/US2019/048636 WO2020068345A1 (en) | 2018-09-24 | 2019-08-28 | Machine vision as input to a cmp process control algorithm |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022501207A JP2022501207A (ja) | 2022-01-06 |
| JP2022501207A5 true JP2022501207A5 (enExample) | 2022-09-07 |
| JP7472111B2 JP7472111B2 (ja) | 2024-04-22 |
Family
ID=69883039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021515551A Active JP7472111B2 (ja) | 2018-09-24 | 2019-08-28 | Cmpプロセス制御アルゴリズムへの入力としてのマシンビジョン |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11577356B2 (enExample) |
| JP (1) | JP7472111B2 (enExample) |
| KR (2) | KR20250076661A (enExample) |
| CN (2) | CN117001534A (enExample) |
| TW (1) | TWI848004B (enExample) |
| WO (1) | WO2020068345A1 (enExample) |
Families Citing this family (23)
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|---|---|---|---|---|
| JP7472111B2 (ja) | 2018-09-24 | 2024-04-22 | アプライド マテリアルズ インコーポレイテッド | Cmpプロセス制御アルゴリズムへの入力としてのマシンビジョン |
| JP7570004B2 (ja) * | 2019-02-19 | 2024-10-21 | パナソニックIpマネジメント株式会社 | 研磨加工システム、学習装置、学習装置の学習方法 |
| US11602821B2 (en) * | 2020-01-17 | 2023-03-14 | Taiwan Semiconductor Manufacturing Company Ltd. | Wafer polishing head, system thereof, and method using the same |
| CN111523645B (zh) * | 2020-04-16 | 2023-04-18 | 北京航天自动控制研究所 | 一种提升小尺度目标检测识别性能的卷积神经网络设计方法 |
| CN115135450B (zh) * | 2020-05-14 | 2024-07-09 | 应用材料公司 | 训练神经网络用于抛光期间的原位监测的技术和抛光系统 |
| WO2022005916A1 (en) | 2020-06-29 | 2022-01-06 | Applied Materials, Inc. | Film thickness estimation from machine learning based processing of substrate images |
| CN112102268A (zh) * | 2020-09-01 | 2020-12-18 | 北京航空航天大学 | 一种基于机器学习打磨超薄掩膜版的智能化激光抛光模块 |
| JP7507639B2 (ja) * | 2020-09-02 | 2024-06-28 | 東京エレクトロン株式会社 | 基板処理システム及び状態監視方法 |
| KR102805914B1 (ko) * | 2020-12-18 | 2025-05-14 | 어플라이드 머티어리얼스, 인코포레이티드 | 적응형 슬러리 분배 시스템 |
| US12504364B2 (en) * | 2021-03-03 | 2025-12-23 | Applied Materials, Inc. | In-situ monitoring to label training spectra for machine learning system for spectrographic monitoring |
| JP7547275B2 (ja) * | 2021-03-31 | 2024-09-09 | 株式会社荏原製作所 | ワークピースの膜厚を推定するモデルを作成する方法、そのようなモデルを用いてワークピースの研磨中に膜厚を推定する方法、およびコンピュータにこれらの方法を実行させるためのプログラム |
| KR102545754B1 (ko) * | 2021-05-27 | 2023-06-20 | 세메스 주식회사 | 기판 처리 장치 및 기판 상태 검출 방법 |
| KR20230080216A (ko) | 2021-11-29 | 2023-06-07 | 삼성전자주식회사 | 웨이퍼 연마 장치 및 상기 웨이퍼 연마 장치가 포함하는 리테이너 링의 결함 검출 방법 |
| CN114211397B (zh) * | 2021-12-14 | 2023-11-17 | 常州先进制造技术研究所 | 一种纸质结构件表面打磨控制方法 |
| TWI800195B (zh) * | 2021-12-30 | 2023-04-21 | 大量科技股份有限公司 | 用於拋光墊表面之量測訊號的智慧分析系統、方法及其電腦程式產品 |
| JP7783755B2 (ja) * | 2022-02-09 | 2025-12-10 | 株式会社Screenホールディングス | 基板処理装置および監視方法 |
| CN114918817B (zh) * | 2022-05-27 | 2024-09-13 | 河南科技学院 | 一种Roll-to-Roll化学机械抛光装置及方法 |
| JP7878989B2 (ja) * | 2022-09-26 | 2026-06-23 | 株式会社Screenホールディングス | 学習装置、情報処理装置、基板処理装置、基板処理システム、学習方法および処理条件決定方法 |
| CN116214369A (zh) * | 2022-12-19 | 2023-06-06 | 浙江工业大学 | 一种基于图像的高硬脆材料研磨状态在线监测装置及方法 |
| US20240316724A1 (en) * | 2023-03-21 | 2024-09-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-pattern in-pad surface for polish rate control |
| US12576475B2 (en) * | 2023-04-25 | 2026-03-17 | Applied Materials, Inc. | Determining the orientation of a substrate in-situ |
| US20250262709A1 (en) * | 2024-02-15 | 2025-08-21 | Applied Materials, Inc. | Method and apparatus for substrate notch sensing on cmp head for local planarization |
| WO2026049750A1 (en) * | 2024-08-30 | 2026-03-05 | Applied Materials, Inc. | In-situ monitoring system with substrate held by carrier in chemical mechanical polishing |
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| JPH10166262A (ja) | 1996-12-10 | 1998-06-23 | Nikon Corp | 研磨装置 |
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| JP2009129970A (ja) * | 2007-11-20 | 2009-06-11 | Ebara Corp | 研磨装置及び研磨方法 |
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| US10478937B2 (en) * | 2015-03-05 | 2019-11-19 | Applied Materials, Inc. | Acoustic emission monitoring and endpoint for chemical mechanical polishing |
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| TW201822953A (zh) * | 2016-09-16 | 2018-07-01 | 美商應用材料股份有限公司 | 基於溝槽深度的電磁感應監控進行的過拋光 |
| US11580398B2 (en) * | 2016-10-14 | 2023-02-14 | KLA-Tenor Corp. | Diagnostic systems and methods for deep learning models configured for semiconductor applications |
| TWI755448B (zh) * | 2016-11-30 | 2022-02-21 | 美商應用材料股份有限公司 | 使用神經網路的光譜監測 |
| CN108051364A (zh) * | 2017-12-13 | 2018-05-18 | 中国科学院长春应用化学研究所 | 一种epr核能电缆剩余寿命评估方法与预测epr核能电缆剩余使用寿命方法 |
| JP7472111B2 (ja) | 2018-09-24 | 2024-04-22 | アプライド マテリアルズ インコーポレイテッド | Cmpプロセス制御アルゴリズムへの入力としてのマシンビジョン |
-
2019
- 2019-08-28 JP JP2021515551A patent/JP7472111B2/ja active Active
- 2019-08-28 CN CN202310816202.2A patent/CN117001534A/zh active Pending
- 2019-08-28 US US16/554,427 patent/US11577356B2/en active Active
- 2019-08-28 KR KR1020257015520A patent/KR20250076661A/ko active Pending
- 2019-08-28 WO PCT/US2019/048636 patent/WO2020068345A1/en not_active Ceased
- 2019-08-28 KR KR1020217011806A patent/KR102808528B1/ko active Active
- 2019-08-28 CN CN201980066820.1A patent/CN112823080B/zh active Active
- 2019-09-18 TW TW108133507A patent/TWI848004B/zh active
-
2023
- 2023-02-02 US US18/163,835 patent/US12257665B2/en active Active
-
2025
- 2025-02-10 US US19/049,741 patent/US20250187135A1/en active Pending
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