TWI848004B - 用於使用機器視覺作為對ｃｍｐ處理控制演算法的輸入的系統與電腦程式產品 - Google Patents

用於使用機器視覺作為對ｃｍｐ處理控制演算法的輸入的系統與電腦程式產品 Download PDF

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Publication number
TWI848004B
TWI848004B TW108133507A TW108133507A TWI848004B TW I848004 B TWI848004 B TW I848004B TW 108133507 A TW108133507 A TW 108133507A TW 108133507 A TW108133507 A TW 108133507A TW I848004 B TWI848004 B TW I848004B
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TW
Taiwan
Prior art keywords
substrate
measurement point
monitoring system
signal
image
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TW108133507A
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English (en)
Chinese (zh)
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TW202027908A (zh
Inventor
尼可拉斯 魏斯威爾
多明尼克Ｊ 班維紐
柏格斯勞Ａ 史威克
班傑明 傑瑞安
隽 錢
湯瑪士Ｈ 歐斯特海德
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美商應用材料股份有限公司
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/0464—Convolutional networks [CNN, ConvNet]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/084—Backpropagation, e.g. using gradient descent
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/096—Transfer learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/048—Activation functions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Biophysics (AREA)
  • Computational Linguistics (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
  • Molecular Biology (AREA)
  • Computing Systems (AREA)
  • Biomedical Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW108133507A 2018-09-24 2019-09-18 用於使用機器視覺作為對ｃｍｐ處理控制演算法的輸入的系統與電腦程式產品 TWI848004B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862735772P 2018-09-24 2018-09-24
US62/735,772 2018-09-24

Publications (2)

Publication Number Publication Date
TW202027908A TW202027908A (zh) 2020-08-01
TWI848004B true TWI848004B (zh) 2024-07-11

Family

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TW108133507A TWI848004B (zh) 2018-09-24 2019-09-18 用於使用機器視覺作為對ｃｍｐ處理控制演算法的輸入的系統與電腦程式產品

Country Status (6)

Country Link
US (3) US11577356B2 (enExample)
JP (1) JP7472111B2 (enExample)
KR (2) KR20250076661A (enExample)
CN (2) CN117001534A (enExample)
TW (1) TWI848004B (enExample)
WO (1) WO2020068345A1 (enExample)

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KR20230080216A (ko) 2021-11-29 2023-06-07 삼성전자주식회사 웨이퍼 연마 장치 및 상기 웨이퍼 연마 장치가 포함하는 리테이너 링의 결함 검출 방법
CN114211397B (zh) * 2021-12-14 2023-11-17 常州先进制造技术研究所 一种纸质结构件表面打磨控制方法
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JP7783755B2 (ja) * 2022-02-09 2025-12-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および監視方法
CN114918817B (zh) * 2022-05-27 2024-09-13 河南科技学院 一种Roll-to-Roll化学机械抛光装置及方法
JP7878989B2 (ja) * 2022-09-26 2026-06-23 株式会社Ｓｃｒｅｅｎホールディングス 学習装置、情報処理装置、基板処理装置、基板処理システム、学習方法および処理条件決定方法
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Publication number Publication date
US20200094370A1 (en) 2020-03-26
JP2022501207A (ja) 2022-01-06
WO2020068345A1 (en) 2020-04-02
US20250187135A1 (en) 2025-06-12
US12257665B2 (en) 2025-03-25
TW202513224A (zh) 2025-04-01
KR20250076661A (ko) 2025-05-29
CN117001534A (zh) 2023-11-07
US11577356B2 (en) 2023-02-14
JP7472111B2 (ja) 2024-04-22
CN112823080B (zh) 2023-07-14
US20230182258A1 (en) 2023-06-15
KR102808528B1 (ko) 2025-05-16
CN112823080A (zh) 2021-05-18
KR20210052559A (ko) 2021-05-10
TW202027908A (zh) 2020-08-01

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