CN117001534A - 以机器视觉作为对cmp工艺控制算法的输入 - Google Patents

以机器视觉作为对cmp工艺控制算法的输入 Download PDF

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Publication number
CN117001534A
CN117001534A CN202310816202.2A CN202310816202A CN117001534A CN 117001534 A CN117001534 A CN 117001534A CN 202310816202 A CN202310816202 A CN 202310816202A CN 117001534 A CN117001534 A CN 117001534A
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CN
China
Prior art keywords
substrate
measurement point
monitoring system
image
polishing
Prior art date
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Pending
Application number
CN202310816202.2A
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English (en)
Chinese (zh)
Inventor
B·切里安
J·钱
N·威斯韦尔
D·J·本韦格努
B·A·斯韦德克
T·H·奥斯特海德
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Applied Materials Inc
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Applied Materials Inc
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Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN117001534A publication Critical patent/CN117001534A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/0464—Convolutional networks [CNN, ConvNet]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/096—Transfer learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/048—Activation functions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/084—Backpropagation, e.g. using gradient descent

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Biophysics (AREA)
  • Computational Linguistics (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
  • Molecular Biology (AREA)
  • Computing Systems (AREA)
  • Biomedical Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN202310816202.2A 2018-09-24 2019-08-28 以机器视觉作为对cmp工艺控制算法的输入 Pending CN117001534A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862735772P 2018-09-24 2018-09-24
US62/735,772 2018-09-24
PCT/US2019/048636 WO2020068345A1 (en) 2018-09-24 2019-08-28 Machine vision as input to a cmp process control algorithm
CN201980066820.1A CN112823080B (zh) 2018-09-24 2019-08-28 以机器视觉作为对cmp工艺控制算法的输入

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201980066820.1A Division CN112823080B (zh) 2018-09-24 2019-08-28 以机器视觉作为对cmp工艺控制算法的输入

Publications (1)

Publication Number Publication Date
CN117001534A true CN117001534A (zh) 2023-11-07

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Family Applications (2)

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CN202310816202.2A Pending CN117001534A (zh) 2018-09-24 2019-08-28 以机器视觉作为对cmp工艺控制算法的输入
CN201980066820.1A Active CN112823080B (zh) 2018-09-24 2019-08-28 以机器视觉作为对cmp工艺控制算法的输入

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Country Status (6)

Country Link
US (3) US11577356B2 (enExample)
JP (1) JP7472111B2 (enExample)
KR (2) KR20250076661A (enExample)
CN (2) CN117001534A (enExample)
TW (1) TWI848004B (enExample)
WO (1) WO2020068345A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7472111B2 (ja) 2018-09-24 2024-04-22 アプライド マテリアルズ インコーポレイテッド Ｃｍｐプロセス制御アルゴリズムへの入力としてのマシンビジョン
JP7570004B2 (ja) * 2019-02-19 2024-10-21 パナソニックＩｐマネジメント株式会社 研磨加工システム、学習装置、学習装置の学習方法
US11602821B2 (en) * 2020-01-17 2023-03-14 Taiwan Semiconductor Manufacturing Company Ltd. Wafer polishing head, system thereof, and method using the same
CN111523645B (zh) * 2020-04-16 2023-04-18 北京航天自动控制研究所 一种提升小尺度目标检测识别性能的卷积神经网络设计方法
CN115135450B (zh) * 2020-05-14 2024-07-09 应用材料公司 训练神经网络用于抛光期间的原位监测的技术和抛光系统
WO2022005916A1 (en) 2020-06-29 2022-01-06 Applied Materials, Inc. Film thickness estimation from machine learning based processing of substrate images
CN112102268A (zh) * 2020-09-01 2020-12-18 北京航空航天大学 一种基于机器学习打磨超薄掩膜版的智能化激光抛光模块
JP7507639B2 (ja) * 2020-09-02 2024-06-28 東京エレクトロン株式会社 基板処理システム及び状態監視方法
KR102805914B1 (ko) * 2020-12-18 2025-05-14 어플라이드 머티어리얼스, 인코포레이티드 적응형 슬러리 분배 시스템
US12504364B2 (en) * 2021-03-03 2025-12-23 Applied Materials, Inc. In-situ monitoring to label training spectra for machine learning system for spectrographic monitoring
JP7547275B2 (ja) * 2021-03-31 2024-09-09 株式会社荏原製作所 ワークピースの膜厚を推定するモデルを作成する方法、そのようなモデルを用いてワークピースの研磨中に膜厚を推定する方法、およびコンピュータにこれらの方法を実行させるためのプログラム
KR102545754B1 (ko) * 2021-05-27 2023-06-20 세메스 주식회사 기판 처리 장치 및 기판 상태 검출 방법
KR20230080216A (ko) 2021-11-29 2023-06-07 삼성전자주식회사 웨이퍼 연마 장치 및 상기 웨이퍼 연마 장치가 포함하는 리테이너 링의 결함 검출 방법
CN114211397B (zh) * 2021-12-14 2023-11-17 常州先进制造技术研究所 一种纸质结构件表面打磨控制方法
TWI800195B (zh) * 2021-12-30 2023-04-21 大量科技股份有限公司 用於拋光墊表面之量測訊號的智慧分析系統、方法及其電腦程式產品
JP7783755B2 (ja) * 2022-02-09 2025-12-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および監視方法
CN114918817B (zh) * 2022-05-27 2024-09-13 河南科技学院 一种Roll-to-Roll化学机械抛光装置及方法
JP7878989B2 (ja) * 2022-09-26 2026-06-23 株式会社Ｓｃｒｅｅｎホールディングス 学習装置、情報処理装置、基板処理装置、基板処理システム、学習方法および処理条件決定方法
CN116214369A (zh) * 2022-12-19 2023-06-06 浙江工业大学 一种基于图像的高硬脆材料研磨状态在线监测装置及方法
US20240316724A1 (en) * 2023-03-21 2024-09-26 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-pattern in-pad surface for polish rate control
US12576475B2 (en) * 2023-04-25 2026-03-17 Applied Materials, Inc. Determining the orientation of a substrate in-situ
US20250262709A1 (en) * 2024-02-15 2025-08-21 Applied Materials, Inc. Method and apparatus for substrate notch sensing on cmp head for local planarization
WO2026049750A1 (en) * 2024-08-30 2026-03-05 Applied Materials, Inc. In-situ monitoring system with substrate held by carrier in chemical mechanical polishing

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000233369A (ja) * 1999-02-15 2000-08-29 Noritake Co Ltd 研削状態監視装置およびドレッシング状態監視装置
JP2010067918A (ja) * 2008-09-12 2010-03-25 Tokyo Seimitsu Co Ltd 研磨終了予測・検出方法とその装置
KR20140140598A (ko) * 2005-08-22 2014-12-09 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
US20180079048A1 (en) * 2016-09-16 2018-03-22 Applied Materials, Inc. Overpolishing based on electromagnetic inductive monitoring of trench depth
US20180150052A1 (en) * 2016-11-30 2018-05-31 Applied Materials, Inc. Spectrographic monitoring using a neural network
CN108292613A (zh) * 2015-11-16 2018-07-17 应用材料公司 用于cmp监控的彩色成像

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0349846A (ja) * 1989-07-13 1991-03-04 Omron Corp 研削加工適応制御装置
US6614529B1 (en) 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5985032A (en) 1995-05-17 1999-11-16 Matsushita Electric Industrial Co., Ltd. Semiconductor manufacturing apparatus
US6075883A (en) 1996-11-12 2000-06-13 Robotic Vision Systems, Inc. Method and system for imaging an object or pattern
JPH10166262A (ja) 1996-12-10 1998-06-23 Nikon Corp 研磨装置
JPH10294297A (ja) * 1997-04-18 1998-11-04 Nikon Corp 研磨装置
US6390019B1 (en) 1998-06-11 2002-05-21 Applied Materials, Inc. Chamber having improved process monitoring window
JP4874465B2 (ja) * 2000-03-28 2012-02-15 株式会社東芝 渦電流損失測定センサ
JP2001287159A (ja) * 2000-04-05 2001-10-16 Nikon Corp 表面状態測定方法及び測定装置及び研磨装置及び半導体デバイス製造方法
US7374477B2 (en) * 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
US6924641B1 (en) * 2000-05-19 2005-08-02 Applied Materials, Inc. Method and apparatus for monitoring a metal layer during chemical mechanical polishing
US6673637B2 (en) * 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
US6917433B2 (en) * 2000-09-20 2005-07-12 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to an etch process
US6966816B2 (en) * 2001-05-02 2005-11-22 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
US6722946B2 (en) * 2002-01-17 2004-04-20 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
WO2003066284A1 (en) 2002-02-06 2003-08-14 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing with an eddy current monitoring system
KR100979071B1 (ko) * 2002-02-22 2010-08-31 에이저 시스템즈 인크 이중 배향 다결정성 재료의 화학 기계적 연마
US6937915B1 (en) 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
JP4020739B2 (ja) 2002-09-27 2007-12-12 株式会社荏原製作所 ポリッシング装置
US6807503B2 (en) 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
WO2004090502A2 (en) 2003-04-01 2004-10-21 Filmetrics, Inc. Whole-substrate spectral imaging system for cmp
US7001243B1 (en) * 2003-06-27 2006-02-21 Lam Research Corporation Neural network control of chemical mechanical planarization
TWI316754B (en) * 2004-03-17 2009-11-01 Taiwan Semiconductor Mfg Image sensor fabrication method and structure
US7076320B1 (en) 2004-05-04 2006-07-11 Advanced Micro Devices, Inc. Scatterometry monitor in cluster process tool environment for advanced process control (APC)
US20060025048A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article detection system and method
JP5534672B2 (ja) 2005-08-22 2014-07-02 アプライド マテリアルズ インコーポレイテッド 化学機械的研磨のスペクトルに基づく監視のための装置および方法
US7409260B2 (en) * 2005-08-22 2008-08-05 Applied Materials, Inc. Substrate thickness measuring during polishing
US7306507B2 (en) 2005-08-22 2007-12-11 Applied Materials, Inc. Polishing pad assembly with glass or crystalline window
US20070077671A1 (en) * 2005-10-03 2007-04-05 Applied Materials In-situ substrate imaging
JP2007266235A (ja) * 2006-03-28 2007-10-11 Ebara Corp 研磨装置
KR20080013059A (ko) * 2006-08-07 2008-02-13 삼성전자주식회사 씨엠피공정설비의 웨이퍼 검사장치 및 그 방법
JP2008137103A (ja) * 2006-11-30 2008-06-19 Ebara Corp 基板保持装置、基板研磨装置、及び基板研磨方法
WO2009051815A1 (en) 2007-10-19 2009-04-23 Bipar Sciences, Inc. Methods and compositions for the treatment of cancer using benzopyrone-type parp inhibitors
JP2009129970A (ja) * 2007-11-20 2009-06-11 Ebara Corp 研磨装置及び研磨方法
US9233450B2 (en) * 2011-08-23 2016-01-12 Applied Materials, Inc. Optical detection of metal layer clearance
US9011202B2 (en) * 2012-04-25 2015-04-21 Applied Materials, Inc. Fitting of optical model with diffraction effects to measured spectrum
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
US9095952B2 (en) * 2013-01-23 2015-08-04 Applied Materials, Inc. Reflectivity measurements during polishing using a camera
US10012494B2 (en) 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
US9375824B2 (en) * 2013-11-27 2016-06-28 Applied Materials, Inc. Adjustment of polishing rates during substrate polishing with predictive filters
US10478937B2 (en) * 2015-03-05 2019-11-19 Applied Materials, Inc. Acoustic emission monitoring and endpoint for chemical mechanical polishing
US11580398B2 (en) * 2016-10-14 2023-02-14 KLA-Tenor Corp. Diagnostic systems and methods for deep learning models configured for semiconductor applications
CN108051364A (zh) * 2017-12-13 2018-05-18 中国科学院长春应用化学研究所 一种epr核能电缆剩余寿命评估方法与预测epr核能电缆剩余使用寿命方法
JP7472111B2 (ja) 2018-09-24 2024-04-22 アプライド マテリアルズ インコーポレイテッド Ｃｍｐプロセス制御アルゴリズムへの入力としてのマシンビジョン

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000233369A (ja) * 1999-02-15 2000-08-29 Noritake Co Ltd 研削状態監視装置およびドレッシング状態監視装置
KR20140140598A (ko) * 2005-08-22 2014-12-09 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
JP2010067918A (ja) * 2008-09-12 2010-03-25 Tokyo Seimitsu Co Ltd 研磨終了予測・検出方法とその装置
CN108292613A (zh) * 2015-11-16 2018-07-17 应用材料公司 用于cmp监控的彩色成像
US20180079048A1 (en) * 2016-09-16 2018-03-22 Applied Materials, Inc. Overpolishing based on electromagnetic inductive monitoring of trench depth
US20180150052A1 (en) * 2016-11-30 2018-05-31 Applied Materials, Inc. Spectrographic monitoring using a neural network

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Publication number Publication date
US20200094370A1 (en) 2020-03-26
JP2022501207A (ja) 2022-01-06
WO2020068345A1 (en) 2020-04-02
US20250187135A1 (en) 2025-06-12
US12257665B2 (en) 2025-03-25
TW202513224A (zh) 2025-04-01
KR20250076661A (ko) 2025-05-29
US11577356B2 (en) 2023-02-14
TWI848004B (zh) 2024-07-11
JP7472111B2 (ja) 2024-04-22
CN112823080B (zh) 2023-07-14
US20230182258A1 (en) 2023-06-15
KR102808528B1 (ko) 2025-05-16
CN112823080A (zh) 2021-05-18
KR20210052559A (ko) 2021-05-10
TW202027908A (zh) 2020-08-01

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