JP7472111B2 - Ｃｍｐプロセス制御アルゴリズムへの入力としてのマシンビジョン - Google Patents

Ｃｍｐプロセス制御アルゴリズムへの入力としてのマシンビジョン Download PDF

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Publication number
JP7472111B2
JP7472111B2 JP2021515551A JP2021515551A JP7472111B2 JP 7472111 B2 JP7472111 B2 JP 7472111B2 JP 2021515551 A JP2021515551 A JP 2021515551A JP 2021515551 A JP2021515551 A JP 2021515551A JP 7472111 B2 JP7472111 B2 JP 7472111B2
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substrate
measurement location
monitoring system
polishing
measurement
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Japanese (ja)
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JP2022501207A (ja
JP2022501207A5 (enExample
Inventor
ベンジャミン シェリアン，
チュン チェン，
ニコラス ウィズウェル，
ドミニク ジェー． ベンヴェニュ，
ボグスロー エー． スウェデク，
トーマス エイチ． オスターヘルド，
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Applied Materials Inc
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Applied Materials Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/0464—Convolutional networks [CNN, ConvNet]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/096—Transfer learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/048—Activation functions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/084—Backpropagation, e.g. using gradient descent

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Biophysics (AREA)
  • Computational Linguistics (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Artificial Intelligence (AREA)
  • Molecular Biology (AREA)
  • Computing Systems (AREA)
  • Biomedical Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2021515551A 2018-09-24 2019-08-28 Ｃｍｐプロセス制御アルゴリズムへの入力としてのマシンビジョン Active JP7472111B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862735772P 2018-09-24 2018-09-24
US62/735,772 2018-09-24
PCT/US2019/048636 WO2020068345A1 (en) 2018-09-24 2019-08-28 Machine vision as input to a cmp process control algorithm

Publications (3)

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JP2022501207A JP2022501207A (ja) 2022-01-06
JP2022501207A5 JP2022501207A5 (enExample) 2022-09-07
JP7472111B2 true JP7472111B2 (ja) 2024-04-22

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US (3) US11577356B2 (enExample)
JP (1) JP7472111B2 (enExample)
KR (2) KR20250076661A (enExample)
CN (2) CN117001534A (enExample)
TW (1) TWI848004B (enExample)
WO (1) WO2020068345A1 (enExample)

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US12504364B2 (en) * 2021-03-03 2025-12-23 Applied Materials, Inc. In-situ monitoring to label training spectra for machine learning system for spectrographic monitoring
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KR20230080216A (ko) 2021-11-29 2023-06-07 삼성전자주식회사 웨이퍼 연마 장치 및 상기 웨이퍼 연마 장치가 포함하는 리테이너 링의 결함 검출 방법
CN114211397B (zh) * 2021-12-14 2023-11-17 常州先进制造技术研究所 一种纸质结构件表面打磨控制方法
TWI800195B (zh) * 2021-12-30 2023-04-21 大量科技股份有限公司 用於拋光墊表面之量測訊號的智慧分析系統、方法及其電腦程式產品
JP7783755B2 (ja) * 2022-02-09 2025-12-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および監視方法
CN114918817B (zh) * 2022-05-27 2024-09-13 河南科技学院 一种Roll-to-Roll化学机械抛光装置及方法
JP7878989B2 (ja) * 2022-09-26 2026-06-23 株式会社Ｓｃｒｅｅｎホールディングス 学習装置、情報処理装置、基板処理装置、基板処理システム、学習方法および処理条件決定方法
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US20200094370A1 (en) 2020-03-26
JP2022501207A (ja) 2022-01-06
WO2020068345A1 (en) 2020-04-02
US20250187135A1 (en) 2025-06-12
US12257665B2 (en) 2025-03-25
TW202513224A (zh) 2025-04-01
KR20250076661A (ko) 2025-05-29
CN117001534A (zh) 2023-11-07
US11577356B2 (en) 2023-02-14
TWI848004B (zh) 2024-07-11
CN112823080B (zh) 2023-07-14
US20230182258A1 (en) 2023-06-15
KR102808528B1 (ko) 2025-05-16
CN112823080A (zh) 2021-05-18
KR20210052559A (ko) 2021-05-10
TW202027908A (zh) 2020-08-01

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