JP2022185184A - 樹脂封止装置及び樹脂封止方法 - Google Patents

樹脂封止装置及び樹脂封止方法 Download PDF

Info

Publication number
JP2022185184A
JP2022185184A JP2021092689A JP2021092689A JP2022185184A JP 2022185184 A JP2022185184 A JP 2022185184A JP 2021092689 A JP2021092689 A JP 2021092689A JP 2021092689 A JP2021092689 A JP 2021092689A JP 2022185184 A JP2022185184 A JP 2022185184A
Authority
JP
Japan
Prior art keywords
resin
pressing member
mold
film
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021092689A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022185184A5 (zh
Inventor
秀作 田上
Shusaku Tagami
誠 柳澤
Makoto Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apic Yamada Corp
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Priority to JP2021092689A priority Critical patent/JP2022185184A/ja
Priority to PCT/JP2022/002512 priority patent/WO2022254776A1/ja
Priority to TW111107344A priority patent/TW202249128A/zh
Publication of JP2022185184A publication Critical patent/JP2022185184A/ja
Publication of JP2022185184A5 publication Critical patent/JP2022185184A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2021092689A 2021-06-02 2021-06-02 樹脂封止装置及び樹脂封止方法 Pending JP2022185184A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021092689A JP2022185184A (ja) 2021-06-02 2021-06-02 樹脂封止装置及び樹脂封止方法
PCT/JP2022/002512 WO2022254776A1 (ja) 2021-06-02 2022-01-25 樹脂封止装置及び樹脂封止方法
TW111107344A TW202249128A (zh) 2021-06-02 2022-03-01 樹脂密封裝置以及樹脂密封方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021092689A JP2022185184A (ja) 2021-06-02 2021-06-02 樹脂封止装置及び樹脂封止方法

Publications (2)

Publication Number Publication Date
JP2022185184A true JP2022185184A (ja) 2022-12-14
JP2022185184A5 JP2022185184A5 (zh) 2023-06-14

Family

ID=84324077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021092689A Pending JP2022185184A (ja) 2021-06-02 2021-06-02 樹脂封止装置及び樹脂封止方法

Country Status (3)

Country Link
JP (1) JP2022185184A (zh)
TW (1) TW202249128A (zh)
WO (1) WO2022254776A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831670B (zh) * 2023-04-12 2024-02-01 頎邦科技股份有限公司 散熱片的取放治具

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740572B2 (ja) * 1986-11-14 1995-05-01 株式会社村田製作所 電子部品の樹脂外装方法
JP3378374B2 (ja) * 1993-09-14 2003-02-17 株式会社東芝 樹脂封止型半導体装置の製造方法、樹脂封止型半導体装置及び封止用樹脂シート
JP2004146556A (ja) * 2002-10-24 2004-05-20 Towa Corp 樹脂封止方法、樹脂封止装置、及び樹脂シート
JP2010092983A (ja) * 2008-10-06 2010-04-22 Renesas Technology Corp 半導体装置およびその製造方法ならびに半導体製造装置
WO2016196189A1 (en) * 2015-05-31 2016-12-08 Skyworks Solutions, Inc. Shielded module having compression overmold

Also Published As

Publication number Publication date
WO2022254776A1 (ja) 2022-12-08
TW202249128A (zh) 2022-12-16

Similar Documents

Publication Publication Date Title
WO2023013150A1 (ja) 圧縮成形装置及び圧縮成形方法
TWI689396B (zh) 成形模具、成形裝置及成形品的製造方法
KR20160013202A (ko) 수지 몰드 장치 및 수지 몰드 방법
JP6180206B2 (ja) 樹脂封止方法および圧縮成形装置
JP2014231185A (ja) 樹脂モールド装置および樹脂モールド方法
WO2022254776A1 (ja) 樹脂封止装置及び樹脂封止方法
JP2023062616A (ja) 樹脂封止装置及び樹脂封止方法
TWI766729B (zh) 工件搬出裝置、樹脂塑封裝置
WO2023053629A1 (ja) 樹脂封止装置及び樹脂封止方法
WO2023062885A1 (ja) 圧縮成形装置
JP2022061238A (ja) 樹脂封止装置及び樹脂封止方法
JP2023123172A (ja) 樹脂封止装置及び樹脂封止方法
WO2023105841A1 (ja) 樹脂封止装置及び封止金型
WO2023105840A1 (ja) 樹脂封止装置及び封止金型
JP2023177511A (ja) 圧縮成形装置及び圧縮成形方法
JP2023177516A (ja) 圧縮成形装置及び圧縮成形方法
WO2023149016A1 (ja) 樹脂封止装置及び樹脂封止方法
TWI783882B (zh) 壓縮成形裝置以及壓縮成形方法
WO2023139825A1 (ja) 樹脂封止装置
JP2023128694A (ja) 圧縮成形装置及び圧縮成形方法
JP7335647B2 (ja) ワーク搬送装置及び樹脂モールド装置
JP2023170999A (ja) 圧縮成形装置及び圧縮成形方法
WO2023084824A1 (ja) 樹脂封止装置及び樹脂封止方法
JP2023169779A (ja) 圧縮成形装置及び圧縮成形方法
JP2023106688A (ja) 圧縮成形装置及び圧縮成形方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230605

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230605