WO2022254776A1 - 樹脂封止装置及び樹脂封止方法 - Google Patents

樹脂封止装置及び樹脂封止方法 Download PDF

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Publication number
WO2022254776A1
WO2022254776A1 PCT/JP2022/002512 JP2022002512W WO2022254776A1 WO 2022254776 A1 WO2022254776 A1 WO 2022254776A1 JP 2022002512 W JP2022002512 W JP 2022002512W WO 2022254776 A1 WO2022254776 A1 WO 2022254776A1
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WO
WIPO (PCT)
Prior art keywords
resin
pressing member
mold
film
cavity
Prior art date
Application number
PCT/JP2022/002512
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English (en)
French (fr)
Japanese (ja)
Inventor
秀作 田上
誠 柳澤
Original Assignee
アピックヤマダ株式会社
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Publication of WO2022254776A1 publication Critical patent/WO2022254776A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Definitions

  • the present invention relates to a resin sealing device and a resin sealing method.
  • Examples of a resin encapsulation apparatus and a resin encapsulation method for encapsulating a workpiece having an electronic component mounted on a base material with encapsulation resin (hereinafter sometimes simply referred to as "resin") and processing it into a molded product include: A compression molding method is known.
  • a predetermined amount of resin is supplied to a sealing region (cavity) provided in a sealing mold configured with an upper mold and a lower mold, and a work is placed in the sealing region,
  • a sealing region cavity
  • a sealing mold having a cavity in the upper mold there is known a technique of supplying resin to the central position of the work collectively for molding.
  • a sealing mold having a cavity in the lower mold there is known a technique of covering the mold surface including the cavity with a film and supplying resin with a uniform thickness for molding (Patent Document 1: See JP-A-2019-145550).
  • the present invention has been made in view of the above circumstances, and by adopting a structure having a cavity in the upper mold, the above problems in the structure having a cavity in the lower mold are solved, and damage to the work during resin sealing is reduced. It is also an object of the present invention to provide a resin sealing apparatus and a resin sealing method capable of improving molding quality.
  • the present invention solves the above problems by means of solutions as described below as one embodiment.
  • a resin encapsulation apparatus uses a encapsulation mold having an upper mold and a lower mold to seal a workpiece having an electronic component mounted on a base material with a resin to process it into a molded product.
  • An apparatus comprising: a heating mechanism for heating the upper mold to a predetermined temperature; a suction mechanism for sucking and holding a film in a cavity arranged on the lower surface side of the upper mold; and the resin is placed on the upper surface.
  • the structure having a cavity in the conventional lower mold it is difficult to prevent the granular resin from leaking from the cavity, and it is difficult to spread the resin to the outermost peripheral position in the cavity. Furthermore, the bulkiness of granular resin caused by piling up with gaps between the particles causes the air in the gaps in the resin to foam (defoam) during molding.
  • the damage to the work, etc. on which the electronic component with wires is mounted is not inferior compared to the structure having the cavity in the lower mold, and the resin can be applied to the outermost peripheral position in the cavity. can be distributed evenly, so that the molding quality can be improved.
  • the pressing member is configured to be movable upward with respect to the guard when the peripheral wall portion of the guard is in contact with the upper die. According to this, it is possible to prevent the leakage (dropping) of the resin from occurring while the resin placed on the pressing member is being conveyed into the cavity. In addition, while the guard is in contact with the upper die, the pressing member is further moved upward to enter the cavity, and the resin is prevented from leaking out from the cavity, and the adhesion to the film is prevented. It can be carried out.
  • a vibration mechanism for vibrating the pressing member on which the resin is placed.
  • the pressing member in a state in which granular, pulverized, or powdery resin is placed on the pressing member, the pressing member is vibrated within the guard at the time of sticking, thereby vibrating the resin placed on the upper surface of the pressing member. can be applied to the film with a uniform thickness. Therefore, it is possible to prevent the occurrence of molding defects and stabilize the molding quality.
  • a preheating mechanism for heating the resin before being adhered to the lower surface of the film.
  • the upper surface of the pressing member is subjected to a surface treatment to prevent adhesion of the resin.
  • a surface treatment to prevent adhesion of the resin.
  • the resin sealing method uses a sealing mold having an upper mold and a lower mold to seal a work in which an electronic component is mounted on a base material with a resin to process it into a molded product.
  • the sealing method includes a heating step of heating the upper mold to a predetermined temperature, a first adsorption step of sucking and holding the film in the cavity of the upper mold, and a mounting step of placing the resin on the upper surface of the pressing member. and a moving sticking step of moving upward the pressing member with the resin placed on the top surface to press the resin onto the film to stick it.
  • the present invention by adopting the configuration in which the upper mold has the cavity, it is possible to solve the above-mentioned problems in the configuration in which the lower mold has the cavity. In addition, it is possible to realize a resin sealing apparatus and a resin sealing method capable of reducing damage to a workpiece during resin sealing and improving molding quality.
  • FIG. 1 is a plan view showing an example of a resin sealing device according to a first embodiment of the invention.
  • FIG. 2 is a cross-sectional view showing an example of a sealing mold for the resin sealing device of FIG. 3 is a cross-sectional view showing an example of a pressing member and a guard of the resin sealing device of FIG. 1.
  • FIG. FIG. 4 is an operation explanatory diagram of the resin sealing device according to the first embodiment of the present invention.
  • FIG. 5 is an operation explanatory diagram following FIG.
  • FIG. 6 is an operation explanatory diagram following FIG.
  • FIG. 7 is an operation explanatory diagram following FIG.
  • FIG. 8 is an operation explanatory diagram following FIG.
  • FIG. 9 is an operation explanatory diagram following FIG.
  • FIG. 10 is an operation explanatory diagram following FIG. FIG.
  • FIG. 11 is a cross-sectional view showing an example of a resin sealing device according to the second embodiment of the invention.
  • 12A and 12B are operation explanatory diagrams of the resin sealing device according to the third embodiment of the present invention.
  • FIG. 13 is an operation explanatory diagram following FIG.
  • FIG. 14 is an operation explanatory diagram following FIG.
  • FIG. 15 is an operation explanatory diagram following FIG.
  • FIG. 16 is an operation explanatory diagram following FIG.
  • FIG. 17 is an operation explanatory diagram following FIG.
  • FIG. 1 is a plan view (schematic diagram) showing an example of a resin sealing device 1 according to this embodiment.
  • 2 is a side sectional view (schematic diagram) showing an example of the sealing mold 202 of the resin sealing device 1
  • FIG. 3 shows an example of the pressing member 214 and the guard 216 of the resin sealing device 1.
  • It is a side cross-sectional view (schematic diagram) showing.
  • arrows in the drawings may be used to indicate the front/rear, left/right, and up/down directions of the resin sealing device 1 .
  • members having the same functions are denoted by the same reference numerals, and repeated description thereof may be omitted.
  • the resin sealing device 1 is a device that seals a work (molded product) W with resin using a sealing mold 202 having an upper mold 204 and a lower mold 206 .
  • a workpiece W is held by a lower mold 206, and a cavity 208 (including part of the mold surface 204a) provided in the upper mold 204 is a release film (hereinafter simply referred to as "film").
  • film a release film
  • a compression molding apparatus in which the workpiece W is sealed with the resin R by supplying the resin R while being covered with F, clamping the upper mold 204 and the lower mold 206, and sealing the workpiece W with the resin R will be described as an example.
  • the workpiece W to be molded has a structure in which a plurality of electronic components Wb are mounted in a matrix on a base material Wa.
  • the base material Wa include plate-shaped members (so-called strip workpieces) such as strip-shaped resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers.
  • electronic components Wb include semiconductor chips, MEMS chips, passive elements, radiator plates, conductive members, spacers, and the like.
  • a configuration using the above members formed in a circular shape, a square shape, or the like may be used (not shown).
  • Examples of methods for mounting the electronic component Wb on the base material Wa include mounting methods such as wire bonding mounting and flip chip mounting.
  • mounting methods such as wire bonding mounting and flip chip mounting.
  • an adhesive tape having heat peelability or an ultraviolet curable resin that is cured by ultraviolet irradiation is used.
  • examples of the resin R include granular (including columnar), pulverized, or powdered thermosetting resins (for example, filler-containing epoxy resin, etc.) is used.
  • the resin R is not limited to the above state, and may be in other states (shapes) such as liquid, plate, sheet, etc., and is a resin other than epoxy thermosetting resin. good too.
  • the film F examples include film materials excellent in heat resistance, peelability, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, Fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are preferably used.
  • a roll-shaped film is used as the film F.
  • a strip-shaped film may be used (not shown).
  • a dense film impermeable to air may be used, or a porous film allowing air to permeate may be used.
  • the resin sealing apparatus 1 includes a work processing unit 100A that mainly supplies the work W and stores the molded product Wp after resin sealing, supplies and stores (discards) the film F, and A press unit 100B that mainly seals the workpiece W with resin and processes it into a molded product Wp, and a dispensing unit 100C that mainly supplies the resin R are provided as main components.
  • a work processing unit 100A that mainly supplies the work W and stores the molded product Wp after resin sealing, supplies and stores (discards) the film F
  • a press unit 100B that mainly seals the workpiece W with resin and processes it into a molded product Wp
  • a dispensing unit 100C that mainly supplies the resin R are provided as main components.
  • two cavities 208 are provided in one upper mold 204, and two workpieces W (for example, strip-shaped workpieces) are arranged in one lower mold 206 and sealed together with resin.
  • a configuration in which two molded products Wp are obtained at the same time by stopping is
  • one upper mold 204 is provided with one cavity
  • one lower mold 206 is provided with one work W (for example, a circular or square work).
  • a configuration may be adopted in which resin sealing is performed to obtain one molded product Wp (not shown).
  • the work processing unit 100A, the press unit 100B, and the dispensing unit 100C are arranged side by side in that order from the right in the left-right direction.
  • An arbitrary number of guide rails (not shown) are provided linearly across each unit, and a first loader 210 for transporting the workpiece W and the molded product Wp, and a second loader 210 for transporting the resin R 212 is provided movably between predetermined units along arbitrary guide rails.
  • the resin sealing device 1 can change the overall configuration mode by changing the configuration of the unit.
  • the configuration shown in FIG. 1 is an example in which three press units 100B are installed. Also, a configuration in which other units are installed is possible (neither is shown).
  • the work processing unit 100A includes a supply magazine 102 that stores a plurality of works W, and a storage magazine 112 that stores a plurality of molded products Wp.
  • a supply magazine 102 that stores a plurality of works W
  • a storage magazine 112 that stores a plurality of molded products Wp.
  • the work processing unit 100A is provided with a supply rail 104 arranged behind the supply magazine 102 and on which the work W taken out from the supply magazine 102 is placed.
  • the work W is supplied from the supply magazine 102 to the supply rail 104 via the relay rail 106 using a known pusher or the like (not shown).
  • the work processing unit 100A includes a storage rail (not shown) disposed behind the storage magazine 112 and on which the molded product Wp taken out from the sealing mold 202 is placed.
  • the molded product Wp is stored in the storage magazine 112 from a storage rail (not shown) via a relay rail (not shown).
  • the work processing unit 100A includes a first loader 210 that transports the work W and the molded product Wp.
  • the first loader 210 has a first holding section 210A that has a holding mechanism on its lower surface to hold the work W on the supply rail 104 and conveys it to a predetermined holding position of the lower die 206 .
  • the first loader 210 has a holding mechanism on its lower surface to hold the resin-sealed molded product Wp on the lower mold 206 and hold it at a predetermined position outside the sealing mold 202 (for example, on a storage rail). ) is provided with a second holding portion 210B for transporting the wafer to the .
  • the work W holding mechanisms in the first holding portion 210A are arranged in two rows in the horizontal direction so as to be able to hold two works W on the supply rail 104 .
  • the holding mechanism for the molded product Wp in the second holding part 210B is arranged in two rows in the horizontal direction so that the two molded products Wp on the lower mold 206 can be held.
  • the first loader 210 can hold and transport both the work W and the molded product Wp side by side with their longitudinal directions parallel to each other.
  • a known holding mechanism for example, a structure having holding claws to clamp, a structure having a suction hole communicating with a suction device to suck, etc. is used (not shown).
  • the work processing unit 100A also includes a work heater 116 that heats the work W transported by the first loader 210 from the lower surface side (base material Wa side).
  • the work heater 116 uses a known heating mechanism (for example, an electric heating wire heater, an infrared heater, etc.). As a result, the workpiece W can be preheated before it is carried into the sealing mold 202 and heated. A configuration without the work heater 116 may be employed.
  • press unit Next, the press unit 100B included in the resin sealing device 1 will be described in detail.
  • the press unit 100B is a sealed mold having a pair of dies that can be opened and closed (for example, a plurality of die blocks made of alloy tool steel, a die plate, a die pillar, and other members assembled together). 202.
  • a pair of molds for example, a plurality of die blocks made of alloy tool steel, a die plate, a die pillar, and other members assembled together.
  • one mold on the upper side in the vertical direction is the upper mold 204 and the other mold on the lower side is the lower mold 206 .
  • the sealing mold 202 is closed and opened by the upper mold 204 and the lower mold 206 approaching and separating from each other. That is, the vertical direction (vertical direction) is the mold opening/closing direction.
  • the sealing mold 202 is opened and closed by a known mold opening/closing mechanism (not shown).
  • the mold opening/closing mechanism includes a pair of platens, a plurality of connecting mechanisms (tie bars and pillars) on which the pair of platens are installed, a drive source (for example, an electric motor) that moves (lifts and lowers) the platens, and a drive transmission mechanism. (for example, a toggle link), etc. (none of which is shown).
  • the sealing mold 202 is arranged between a pair of platens of the mold opening/closing mechanism.
  • the fixed upper die 204 is attached to a stationary platen (a platen fixed to a coupling mechanism)
  • the movable lower die 206 is attached to a movable platen (a platen that moves up and down along the coupling mechanism). Assembled.
  • the configuration is not limited to this, and the upper mold 204 may be a movable mold and the lower mold 206 may be a fixed mold, or both the upper mold 204 and the lower mold 206 may be movable.
  • the upper die 204 comprises an upper plate 222, a cavity piece 226, a clamper 228, etc., which are assembled together.
  • a cavity 208 is provided on the lower surface of the upper mold 204 (the surface on the lower mold 206 side).
  • the cavity piece 226 is fixedly attached to the lower surface of the upper plate 222 .
  • the clamper 228 is configured in an annular shape so as to surround the cavity piece 226 , and is attached to the lower surface of the upper plate 222 via a biasing member 232 so as to be separated (floating) and vertically movable.
  • the cavity piece 226 forms the inner part (bottom part) of the cavity 208
  • the clamper 228 forms the side part of the cavity 208 .
  • two cavities 208 are arranged side by side in the left-right direction in one upper mold 204 so that two workpieces W are simultaneously sealed with resin. .
  • a suction groove (not shown) is provided on the mold surface 206a of the lower mold 206 facing the clamper 228 and communicates with a suction device (not shown).
  • a suction device (not shown)
  • a suction mechanism is provided for suctioning and holding the film F supplied from a film supply mechanism 250 (described later) to the upper die 204 .
  • this suction mechanism includes a suction device (non-contact) via suction paths 230a and 230b provided through the clamper 228 and a suction path 230c provided through the upper plate 222 and the cavity piece 226. shown).
  • one end of each of the suction paths 230 a , 230 b , 230 c communicates with the mold surface 204 a of the upper mold 204 , and the other end is connected to a suction device arranged outside the upper mold 204 .
  • the film F can be sucked from the suction paths 230a, 230b, and 230c by driving the suction device, and the film F can be held on the mold surface 204a including the inner surface of the cavity 208 by suction.
  • the film F covering the inner surface of the cavity 208 and the mold surface 204a (a part) of the upper mold 204, the resin R portion on the upper surface of the molded article Wp can be easily peeled off. , the molded product Wp can be easily removed from the sealing mold 202 (upper mold 204).
  • a gap of a predetermined size provided between the inner peripheral surface of the clamper 228 and the outer peripheral surface of the cavity piece 226 constitutes part of the suction path 230a. Therefore, a sealing member 234 (for example, an O-ring) is arranged at a predetermined position of the gap to perform a sealing function when the film F is sucked.
  • a sealing member 234 for example, an O-ring
  • an upper mold heating mechanism is provided for heating the upper mold 204 to a predetermined temperature.
  • the upper die heating mechanism includes a heater (for example, a heating wire heater), a temperature sensor, a control section, a power supply, etc. (none of which are shown), and performs heating and control thereof.
  • the heater is built in the upper plate 222 and a mold base (not shown) that accommodates them, and mainly applies heat to the entire upper mold 204 and the resin R (described later). Thereby, the upper mold 204 is adjusted to a predetermined temperature (for example, 100° C. to 200° C.) and heated.
  • a film supply mechanism 250 is provided for conveying (supplying) the roll-shaped film F having no openings (holes) on the sheet surface to the inside of the sealing mold 202 .
  • the film supply mechanism 250 includes an unwinding section 252 and a winding section 254 and is configured to convey the film F from the unwinding section 252 to the winding section 254 .
  • the film F is supplied to the sealing mold 202 arranged between the unwinding section 252 and the winding section 254 . That is, as shown in FIG. 1, the unused film F sent out from the unwinding section 252 is supplied to the mold-opened sealing mold 202, and is used for resin sealing by the sealing mold 202.
  • the finished film F is wound by the winding section 254 .
  • a series of steps are controlled by a controller (not shown) provided in the resin sealing apparatus 1 .
  • the lower mold 206 of the sealing mold 202 will be described in detail.
  • the lower mold 206 includes a lower plate 224, a cavity plate 236, etc., which are assembled together.
  • the cavity plate 236 is fixedly attached to the upper surface of the lower plate 224 (the surface on the upper die 204 side).
  • a work holding mechanism is provided to hold the work W at a predetermined position on the lower surface of the cavity plate 236 .
  • this workpiece holding mechanism communicates with a suction device (not shown) via a suction path 240a arranged through the cavity plate 236 and the lower plate 224 .
  • a suction path 240a arranged through the cavity plate 236 and the lower plate 224 .
  • one end of the suction path 240 a communicates with the mold surface 206 a of the lower mold 206 , and the other end is connected to a suction device arranged outside the lower mold 206 .
  • the suction device is driven to suck the workpiece W from the suction path 240a, and the workpiece W can be attracted and held on the mold surface 206a (here, the upper surface of the cavity plate 236).
  • a configuration may be employed in which holding claws for holding the outer periphery of the work W are provided in parallel with the configuration including the suction path 240a (not shown).
  • one lower mold 206 has two workpiece holding mechanisms in the horizontal direction, corresponding to the structure of the upper mold 204 (the structure in which two cavities 208 are arranged side by side in the horizontal direction). They are arranged side by side, and two workpieces W are sealed with resin at a time.
  • it is not limited to this configuration.
  • a lower mold heating mechanism is provided to heat the lower mold 206 to a predetermined temperature.
  • the lower mold heating mechanism includes a heater (for example, a heating wire heater), a temperature sensor, a control section, a power supply, etc. (none of which are shown), and performs heating and control thereof.
  • the heater is built in the lower plate 224 and a mold base (not shown) that accommodates them, and mainly applies heat to the entire lower mold 206 and the workpiece W. Thereby, the lower mold 206 is adjusted to a predetermined temperature (for example, 100° C. to 200° C.) and heated.
  • the dispensing unit 100C includes a dispenser 312 that supplies resin R and a second loader 212 that conveys the supplied resin into the sealing mold 202.
  • two dispensers 312 are provided so that the resin R can be simultaneously supplied to two pressing members 214 (described later) provided corresponding to the two cavities 208 .
  • the dispensing unit 100C also includes a resin heater 314 that heats the resin R conveyed by the second loader 212, such as at a position adjacent to the dispenser 312.
  • the resin heater 314 uses a known heating mechanism (for example, an electric heating wire heater, an infrared heater, etc.).
  • a known heating mechanism for example, an electric heating wire heater, an infrared heater, etc.
  • the surface of the granular resin R placed on the pressing member 214 can be heated to be melted or softened. It is possible to prevent the occurrence of defective molding and malfunction of the device.
  • a configuration without the resin heater 314 may be employed.
  • the second loader 212 includes a pressing member 214 for placing the resin R dropped from the dispenser 312 on the upper surface 214a, and a peripheral wall portion surrounding the entire circumference of the outer peripheral portion to a position higher than the upper surface 214a of the pressing member 214.
  • a guard 216 having 216a is provided.
  • two cavities 208 are provided in one upper mold 204, two works W (for example, strip-shaped works) are placed in one lower mold 206, and resin sealing is performed collectively. Since it is configured to obtain two molded products Wp at the same time, two pressing members 214 corresponding to the positions of the cavities 208 and guards 216 surrounding the entire periphery of the pressing members 214 are provided.
  • the guard 216 is configured as a frame provided around each pressing member 214 .
  • the two pressing members 214 are surrounded by one guard 216, but as a modification, two guards 216 may be provided to surround the two pressing members 214 (not shown).
  • the second loader 212 includes a moving sticking mechanism 215 that moves a pressing member 214 upward to press the placed resin R against the film F in the cavity 208 , and a guard 216 that moves along with the pressing member 214 . and a guard moving mechanism 217 for moving upward.
  • the pressing member 214 is configured to be movable upward with respect to the guard 216.
  • the pressing member 214 can be moved upward by the moving sticking mechanism 215, and the guard 216 can be moved upward by the guard moving mechanism 217 at the same time.
  • the movement of the guard 216 is stopped while the peripheral wall portion 216 a of the guard 216 is in contact with the upper die 204 , and the pressing member 214 can be moved upward by the moving sticking mechanism 215 .
  • the resin R placed on the pressing member 214 is pressed against the film F, and the resin R is pressed against the lower surface of the film F (lower mold 206 side) can be attached.
  • the pressing member 214 preferably has a configuration in which the upper surface 214a is subjected to surface treatment to prevent adhesion of the resin R. The reason for this is that after the resin R is pressed and adhered to the film F, when the pressing member 214 is moved downward (lowered), the resin R adheres to the pressing member 214, causing the upper die to 204 can be prevented from being set.
  • FIG. 1 Next, the operation of performing resin sealing using the resin sealing apparatus 1 according to this embodiment (that is, the resin sealing method according to this embodiment) will be described with reference to FIGS. 4 to 10.
  • FIG. 1 two cavities 208 are provided in one upper mold 204, two workpieces W (for example, strip-shaped workpieces) are placed in one lower mold 206, and resin sealing is performed at once.
  • a configuration for obtaining two molded products Wp will be taken as an example.
  • a heating process (upper mold heating process) is performed in which the upper mold 204 is adjusted to a predetermined temperature (eg, 100° C. to 200° C.) and heated by the upper mold heating mechanism. Further, a heating process (lower mold heating process) is performed by adjusting and heating the lower mold 206 to a predetermined temperature (for example, 100° C. to 200° C.) by the lower mold heating mechanism.
  • a predetermined temperature eg, 100° C. to 200° C.
  • the second loader 212 transports the two pressing members 214 together with the guards 216 surrounding the pressing members 214 so that the two pressing members 214 are directly below the nozzles 312a of the two dispensers 312, respectively.
  • the guard 216 (peripheral wall portion 216a) surrounds the entire periphery of the pressing member 214 to a position higher than the upper surface 214a.
  • a placement step is performed in which a prescribed amount of resin R is dropped (supplied) onto the upper surface 214a of each of the pressing members 214 from the two nozzles 312a and placed thereon.
  • the guard 216 is a frame that surrounds the entire periphery of the pressing member 214 . Therefore, when dropping the resin R, it is possible to prevent the resin R from falling from the pressing member 214 .
  • the pressing member 214 and the guard 216 are vibrated to spread the resin R placed on the upper surface 214a of the pressing member 214 to the outermost peripheral position. It is preferred to carry out a step of leveling the thickness. Incidentally, the resin R may be supplied evenly from the beginning.
  • the resin heater 314 may heat (preheat) the resin R being transported by the second loader 212 .
  • the resin R can be preheated to a temperature (for example, 60° C.) at which the resin R is not completely melted or melted by pressing a heated part or by radiant heat, and the particles of the resin R can be welded and integrated.
  • the film F is conveyed (sent out) from the unwinding section 252 to the winding section 254 by the film supply mechanism 250, and placed at a predetermined position (a position between the upper mold 204 and the lower mold 206) in the sealing mold 202.
  • a step of supplying the film F (film supplying step) is carried out.
  • an adsorption process (first adsorption process) is performed in which the film F is adsorbed and held on the mold surface 204a including the inner surface of the cavity 208 by the adsorption mechanism.
  • the pressing member 214 and the guard 216 are conveyed into the sealing mold 202 (between the upper mold and the lower mold) by the second loader 212 .
  • the pressing member 214 is moved upward by the moving sticking mechanism 215 and the guard 216 is moved upward by the guard moving mechanism 217 .
  • the peripheral wall portion 216a of the guard 216 comes into contact with the upper die 204 (in this case, the mold surface 204a of the clamper 228), the movement of the guard 216 stops.
  • the resin R placed on the pressing member 214 can be pressed against the film F in the cavity 208 of the upper mold 204 heated to a predetermined temperature. Therefore, the heat of the upper die 204 can be transferred to the resin R through the film F, so that the resin R softens (melts) and an adhesive force is generated, and the effect of sticking to the lower surface of the film F is obtained. be done.
  • the sticking process is preferably carried out in a short period of time so that the moving sticking mechanism 215 is not heated by radiant heat or heat transfer through the resin R.
  • the step of attaching the resin R to the lower surface of the film F can be efficiently performed by performing the step of integrating the resin R in advance as described above. Specifically, since the resin R is integrated, the resin R can be adhered to the lower surface of the film F in a short time. Further, since the resin R is integrated, it is possible to prevent particles of the resin R from remaining on the pressing member 214 .
  • a step of conveying the workpiece W into the sealing mold 202 by the first loader 210 is performed.
  • the workpiece W being conveyed by the first loader 210 is preheated by the work heater 116, and then, as shown in FIG. It is held at a predetermined position on the lower mold 206 . In this embodiment, two workpieces W are held side by side.
  • the step of conveying the workpiece W into the sealing mold 202 by the first loader 210 may be performed before the step of attaching the resin R.
  • the subsequent steps are the same as in the conventional resin sealing method, and the steps of closing the sealing mold 202 and clamping the two workpieces W with the upper mold 204 and the lower mold 206 are performed.
  • the cavity pieces 226 are relatively lowered to heat and press the resin R against the two works W.
  • the resin R is thermally cured and resin sealing (compression molding) is completed.
  • a step of opening the sealing mold 202 and separating the two molded products Wp and the used film F is performed.
  • a step of conveying the two molded products Wp from the sealing mold 202 by the first loader 210 is performed.
  • the film feeding mechanism 250 conveys the film F from the unwinding section 252 to the winding section 254 to carry out a step of sending out the used film F (film discharging step).
  • the above is the main operation of resin encapsulation performed using the resin encapsulation apparatus 1 .
  • the order of the steps described above is only an example, and it is possible to change the order of the steps before and after or perform them in parallel as long as there is no problem.
  • a resin encapsulation device equipped with a plurality of press units (three as an example) is used, so by performing the above operations in parallel, it is possible to efficiently form a molded product. becomes.
  • the film F is previously adsorbed and held on the mold surface 204a including the inner surface of the cavity 208 by the adsorption mechanism described above, and then the pressing member is moved by the moving attachment mechanism 215. 214 is moved upward to press the resin R against the film F so that the resin R is adhered to the lower surface of the film F.
  • the present invention is not limited to this configuration, and the following configuration may be employed as a modified example.
  • the film F is placed on the inner surface of the cavity 208 at a predetermined position between the upper mold 204 and the lower mold 206 (specifically, the position between the upper surface 214a of the pressing member 214 and the inner surface of the cavity 208).
  • a vibration mechanism (not shown) for vibrating the pressing member 214 is provided in the second loader 212, and in the above-described moving sticking process, that is, the pressing member 214 (upper surface 214a) is placed thereon.
  • a vibrating step of vibrating the pressing member 214 may be performed. According to this, the resin R is applied to the film F with a more uniform thickness by vibrating the pressure member 214 within the guard 216 during application while the resin R is placed on the pressure member 214 . can be worn. Therefore, it is more effective from the viewpoint of preventing occurrence of defective molding and stabilizing quality.
  • the damage to the workpiece on which the electronic component with wires is mounted is not inferior to that of the method in which the cavity is provided in the lower mold, and the outermost position in the cavity 208 is not inferior. Since the resin can be evenly distributed, molding quality can be further improved.
  • the resin R placed on the pressing member 214 can be transferred into the sealing mold 202 while being surrounded by the guard 216, leakage of resin from the pressing member 214 (upper surface 214a) during transfer can be prevented. (overflow) can be prevented from occurring. Furthermore, since the pressing member 214 can be further moved upward to enter the cavity 208 while the guard 216 is in contact with the upper die 204, leakage (spilling) of the resin R from the cavity 208 does not occur. can be made Therefore, it is possible to prevent deterioration of molding quality due to leakage (spillage) of resin R, and to stabilize molding quality (maintain high quality).
  • FIG. 11 is a side cross-sectional view (schematic diagram) corresponding to FIG. 3 of the above-described first embodiment.
  • the release film F a roll-shaped film having a plurality of holes (suction holes) Fa formed on the sheet surface is used.
  • the upper mold 204 is configured to be able to suck and hold the heat spreader H with the film F interposed in the cavity 208 by the suction mechanism described above.
  • a needle-shaped perforating member is used to form holes Fa, and as shown in FIG.
  • the film F can be adsorbed and held on the mold surface 204a including the inner surface of the .
  • a suction force is applied by the suction path 230c through the suction holes Fa of the film F, and the heat spreader H is moved in a state in which the film F is interposed in the cavity 208. It can be adsorbed and held.
  • the operation of performing resin sealing using the resin sealing apparatus 1 according to this embodiment (that is, the resin sealing method according to this embodiment) will be described.
  • the basic steps are the same as those of the first embodiment described above, but in this embodiment, after the first adsorption step described above, the heat spreader is applied while the film F is interposed in the cavity 208 of the upper mold 204 .
  • An adsorption step (second adsorption step) of sucking and holding H is further provided. After that, while the heat spreader H is sufficiently heated, the resin R is adhered to the lower surface of the heat spreader H as described above, and the resin sealing process can be performed.
  • two workpieces W are collectively sealed with resin for one sealing mold 202, and two molded products Wp are obtained at the same time. For example.
  • the carrier 400 with the film F held on its lower surface side is prepared and transported to a position directly below the nozzle 312a of the dispenser 312 by a transport mechanism (not shown).
  • the carrier 400 is formed as a frame having a holding mechanism (not shown) that holds the film F on its lower surface and two rows of resin injection holes (through holes) 400a.
  • a sheet-fed release film is used in place of the roll-shaped release film in the first embodiment.
  • the resin R is dropped (supplied) from the nozzles 312 a of the two dispensers 312 into the two resin charging holes 400 a of the carrier 400 .
  • the carrier 400 holding the film F and the resin R is transported by the transport mechanism and placed on the heater table 310 to heat the resin R through the film F. I do. As a result, the resin R is melted or softened. Therefore, the entire resin R is welded and clumped together to adhere to the film F. As shown in FIG. 14, the carrier 400 holding the film F and the resin R is transported by the transport mechanism and placed on the heater table 310 to heat the resin R through the film F. I do. As a result, the resin R is melted or softened. Therefore, the entire resin R is welded and clumped together to adhere to the film F. As shown in FIG.
  • the pressing member 214 is inserted into each of the two resin injection holes 400a so that the plate surface 214a (the lower surface in this state) is brought into close contact with the molten or softened resin R.
  • the carrier 400 and the pressing member 214 are turned upside down by a turnover mechanism (not shown). At this time, the resin R is in close contact with the film F.
  • the same steps as the adsorption step (first adsorption step) and the moving sticking step in the first embodiment are performed. That is, the pressing member 214 having the upper surface 214a (corresponding to the lower surface before reversal) with the resin R (the film F in close contact with the upper surface of the resin R) is moved upward by the moving sticking mechanism 215. (specifically, into the cavity 208 of the upper mold 204). At this time, a step of adsorbing and holding the film F to the mold surface 204a including the inner surface of the cavity 208 is performed by the adsorption mechanism.
  • the pressing member 214 is further moved upward by the moving sticking mechanism 215 to press the resin R placed on the upper surface 214a to the lower surface of the film F for sticking. In this manner, the film F is adsorbed in the cavity 208 and the resin R is adhered to the film F. As shown in FIG.
  • the subsequent steps are the same as those of the first embodiment described above. , the step of opening the sealing mold 202 and taking out the molded product Wp is performed.
  • the present invention by adopting the configuration in which the upper mold has the cavity, it is possible to solve the above-mentioned problems in the configuration in which the lower mold has the cavity. In addition, it is possible to realize a resin sealing apparatus and a resin sealing method capable of reducing damage to a workpiece during resin sealing and improving molding quality.
  • thermosetting resins in the form of granules, pulverized, and powder have been exemplified as sealing resins, they are not limited to these, and liquid, plate-like, sheet-like resins, etc. are used. configuration can also be applied.
  • the sheet-shaped resin R which is originally flat and integrated, may be adhered to the lower surface of the film F, and preparation for resin sealing can be easily performed.
  • the heat of the upper mold 204 is transmitted to the resin R through the film F, and the resin R is softened (melted) to generate an adhesive force, thereby bonding the resin R to the lower surface of the film F.
  • the porous film F is used, and the film F is sucked from the suction paths 230b and 230c by driving the suction device, whereby the resin R is sucked and adhered to the lower surface of the film F. configuration may be employed.
  • two workpieces W are placed in the lower mold and resin-sealed together to obtain two molded products Wp at the same time. It is not limited to this, and one (or a plurality of three or more) cavities are provided in the upper mold, and one (or a plurality of three or more) workpieces are placed in the lower mold and sealed with resin. to obtain one (or a plurality of three or more) molded products.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
PCT/JP2022/002512 2021-06-02 2022-01-25 樹脂封止装置及び樹脂封止方法 WO2022254776A1 (ja)

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Cited By (1)

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TWI831670B (zh) * 2023-04-12 2024-02-01 頎邦科技股份有限公司 散熱片的取放治具

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Publication number Priority date Publication date Assignee Title
JPS63126236A (ja) * 1986-11-14 1988-05-30 Murata Mfg Co Ltd 電子部品の樹脂外装方法
JPH0823005A (ja) * 1993-09-14 1996-01-23 Toshiba Corp 樹脂封止型半導体装置の製造方法、樹脂封止型半導体装置及び封止用樹脂シート
JP2004146556A (ja) * 2002-10-24 2004-05-20 Towa Corp 樹脂封止方法、樹脂封止装置、及び樹脂シート
JP2010092983A (ja) * 2008-10-06 2010-04-22 Renesas Technology Corp 半導体装置およびその製造方法ならびに半導体製造装置
US20180315717A1 (en) * 2015-05-31 2018-11-01 Skyworks Solutions, Inc. Shielded module having compression overmold

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63126236A (ja) * 1986-11-14 1988-05-30 Murata Mfg Co Ltd 電子部品の樹脂外装方法
JPH0823005A (ja) * 1993-09-14 1996-01-23 Toshiba Corp 樹脂封止型半導体装置の製造方法、樹脂封止型半導体装置及び封止用樹脂シート
JP2004146556A (ja) * 2002-10-24 2004-05-20 Towa Corp 樹脂封止方法、樹脂封止装置、及び樹脂シート
JP2010092983A (ja) * 2008-10-06 2010-04-22 Renesas Technology Corp 半導体装置およびその製造方法ならびに半導体製造装置
US20180315717A1 (en) * 2015-05-31 2018-11-01 Skyworks Solutions, Inc. Shielded module having compression overmold

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831670B (zh) * 2023-04-12 2024-02-01 頎邦科技股份有限公司 散熱片的取放治具

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