JP2022153366A - 半導体素子およびこれを含む半導体素子パッケージ - Google Patents
半導体素子およびこれを含む半導体素子パッケージ Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 230
- 229910052751 metal Inorganic materials 0.000 claims description 63
- 239000002184 metal Substances 0.000 claims description 63
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- 239000000463 material Substances 0.000 description 35
- 229910052719 titanium Inorganic materials 0.000 description 28
- 239000010931 gold Substances 0.000 description 25
- 238000000926 separation method Methods 0.000 description 24
- 238000010438 heat treatment Methods 0.000 description 19
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- GNRSAWUEBMWBQH-UHFFFAOYSA-N nickel(II) oxide Inorganic materials [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
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- 230000001225 therapeutic effect Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
結される第2電極;前記第2電極上に配置される反射層;および前記反射層上に配置され、複数の層を含むキャッピング層を含み、前記キャッピング層は前記反射層上に配置される第1層を含み、前記第1層はTiを含む。
分の拡大図である。図2bは、図2aの変形例である。図3a~図3dは、本発明の第1実施例に係る半導体素子のうちキャッピング層の多様な変形例である。
準として、第2電極125の終端は第2導電型半導体層112の終端より内側に位置することができる。
中間層143aは第1層141と接触することができる。また、中間層143はTiを含む少なくとも一つの第2中間層143bをさらに含むこともできる。もちろん、第2中間層143bは省略されてもよい。中間層143が多数の第1中間層143aと第2中間層143bを含む場合、第1中間層143aと第2中間層143bは交互に配置され得る。
Au、Ti/Ni/Ti/Ni/Ti/Ni/Ti、Ti/Ni/Ti/Ni/Ti/Ni/Ti/Auのうち選択されたいずれか一つで構成され得る。
151および第2絶縁層152が配置されて、第1導電層131を第2導電型半導体層112および活性層113と電気的に絶縁させることができる。
反射層の観察
図7aおよび図7bは、半導体素子のうちキャッピング層の構造を変更して反射層を観察したものである。
表1は、第2電極/接合層/反射層/キャッピング層(第1層)を構成して反射率を測定したものである。比較例1、2は第1層にNiが使われたし、実施例1は第1層にTiが使われた。また、比較例1は熱処理前の反射率を表し、比較例2および実施例1は熱処理後の反射率を表す。
生を最小化させることが好ましい。
:1.5~1:2.5であり得る。これは前述した通り、熱処理前(図8a)の第1-3層122cの厚さが第1-1層122aおよび第1-2層122bの厚さの和の1.5~2.5倍を有するためであり得る。すなわち、第1-3層122cの厚さが第1-1層122aと第1-2層122bの厚さの合計より相対的に大きく、このため、第1-3層122cが含んでいだAlが第2領域122eに多く残っているためである。
接触比抵抗、表面特性およびオーミック特性の比較
第1-1層/第1-2層/第1金属層(第1-3層)/第2層/第3層の構造で第1電極を形成した。ここで、第1金属層および第2層の厚さを異ならせて比較例1、実施例1、実施例2および実施例3を構成した。この時、第1金属層はAlを含むことができ、第2層はNiを含むことができる。このような第1電極には熱処理が行われ得る。
観察した結果である。図10は、TLM測定法を通じて図9a~図9dの第1電極の電圧と電流値を図示したグラフである。図10のグラフにおいて、傾きが大きいほど抵抗が低く、これはオーミック特性が良いことを意味し得る。以下では表2を共に参照して、比較例1、実施例1、実施例2および実施例3を比較する。
表3は、第1電極を多様に変形し、TLM測定法を通じてRc、Rs、ρcを比較したものである。第1電極は第1-1層/第1-2層/第1金属層(第1-3層)/第2層/第3層の構造を有することができる。第1電極には熱処理が行われてもよい。第1金属層はAlを含むことができ、第2層はNiを含むことができる。また、第1-1層はCrを含むことができ、第1-2層はTiを含むことができ、第3層はAuを含むことができる。
光検出器として、光電池(シリコン、セレン)、光出力導電素子(硫化カドミウム、セレン化カドミウム)、フォトダイオード(例えば、visible blind spectral regionでもtrue blind spectral regionでピーク波長を有するPD)、フォトトランジスタ、光電子増倍管、光電管(真空、ガス封入)、IR(Infra-Red)検出器などがあるが、実施例はこれに限定されない。
Claims (20)
- 第1導電型半導体層、第2導電型半導体層および前記第1導電型半導体層と第2導電型半導体層の間に配置される活性層を含む発光構造物;
前記第1導電型半導体層と電気的に連結される第1電極;
前記第2導電型半導体層と電気的に連結される第2電極;
前記第2電極上に配置される反射層;および
前記反射層上に配置され、複数の層を含むキャッピング層を含み、
前記キャッピング層は前記反射層上に配置される第1層を含み、
前記第1層はTiを含む、半導体素子。 - 前記キャッピング層は、
前記第1層上に配置され、複数の層を含む中間層をさらに含み、
前記中間層は前記第1層上に直接配置され、Niを含む第1中間層を含み、
前記第1層と第1中間層の厚さ比は1:1~3:1である、請求項1に記載の半導体素子。 - 前記キャッピング層は、前記第1層上に配置される第2層をさらに含み、前記第2層はAuを含む、請求項1に記載の半導体素子。
- 前記第1層は前記キャッピング層の一側に配置され、前記第2層は前記キャッピング層の他側に配置される、請求項3に記載の半導体素子。
- 前記中間層はNiを含む少なくとも一つの第1中間層を含む、請求項2に記載の半導体素子。
- 前記少なくとも一つの第1中間層のうち一つは前記第1層上に配置される、請求項5に記載の半導体素子。
- 前記第1層と前記第1中間層の厚さ比は1:1~3:1である、請求項5に記載の半導体素子。
- 前記中間層はTiを含む少なくとも一つの第2中間層をさらに含む、請求項5に記載の半導体素子。
- 前記第2電極と反射層の間には接合層がさらに配置される、請求項1に記載の半導体素子。
- 前記発光構造物は、前記第2導電型半導体層と活性層を貫通して前記第1導電型半導体層の一部の領域まで配置される複数のリセスをさらに含み、
前記第1電極は前記複数のリセスの内部に配置される、請求項1に記載の半導体素子。 - 第1導電型半導体層、第2導電型半導体層および前記第1導電型半導体層と第2導電型半導体層の間に配置される活性層を含む発光構造物;
前記第1導電型半導体層と電気的に連結される第1電極;および
前記第2導電型半導体層と電気的に連結される第2電極;を含み、
前記第1電極は第1層、第2層および第3層を含み、
前記第1層は第1金属を含む第1金属層を含み
前記第1金属の拡散係数は前記第3層が含む第3金属の拡散係数より大きい、半導体素子。 - 前記第2層の厚さは前記第1金属層の厚さの0.4倍~0.53倍である、請求項11に記載の半導体素子。
- 前記第2層は前記第1金属層と第3層の間に配置される、請求項11に記載の半導体素子。
- 前記第1層は、第1-1層;および前記第1-1層と第1金属層間に配置される第1-2層をさらに含み、
前記第1金属層の厚さは前記第1-1層および第1-2層の厚さの和の1.5~2.5倍である、請求項11に記載の半導体素子。 - 前記第1-1層はCrを含み、前記第1-2層はTiを含む、請求項14に記載の半導体素子。
- 前記第2電極上に配置される反射層;および前記反射層上に配置され、複数の層を含むキャッピング層をさらに含む、請求項11に記載の半導体素子。
- 前記発光構造物は、前記第2導電型半導体層と活性層を貫通して前記第1導電型半導体層の一部の領域まで配置される複数のリセスをさらに含み、
前記第1電極は前記複数のリセスの内部に配置される、請求項11に記載の半導体素子。 - 前記第1層は第1領域および第2領域を含み、
前記第2領域が含む第1金属の比率は前記第1領域が含む第1金属の比率より大きく、
前記第1領域と第2領域の厚さ比は3:7~6.3:3.5である、請求項11に記載の半導体素子。 - 前記第1金属はAlであり、
前記第1領域のAlの比率と前記第2領域のAlの比率の比は1:1.5~1:2.5である、請求項17に記載の半導体素子。 - 胴体;および
前記胴体に配置される半導体素子を含み、
前記半導体素子は、
第1導電型半導体層、第2導電型半導体層および前記第1導電型半導体層と第2導電型半導体層の間に配置される活性層を含む発光構造物;
前記第1導電型半導体層と電気的に連結される第1電極;
前記第2導電型半導体層と電気的に連結される第2電極;
前記第2電極上に配置される反射層;および
前記反射層上に配置され、複数の層を含むキャッピング層を含み、
前記キャッピング層は前記反射層上に配置される第1層を含み、
前記第1層はTiを含む、半導体素子パッケージ。
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