JP2022135789A - レーザ加工装置 - Google Patents

レーザ加工装置 Download PDF

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Publication number
JP2022135789A
JP2022135789A JP2021035842A JP2021035842A JP2022135789A JP 2022135789 A JP2022135789 A JP 2022135789A JP 2021035842 A JP2021035842 A JP 2021035842A JP 2021035842 A JP2021035842 A JP 2021035842A JP 2022135789 A JP2022135789 A JP 2022135789A
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JP
Japan
Prior art keywords
lens
laser
visible light
light
coordinate values
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021035842A
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English (en)
Japanese (ja)
Other versions
JP2022135789A5 (enExample
Inventor
直哉 山崎
Naoya Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2021035842A priority Critical patent/JP2022135789A/ja
Priority to PCT/JP2022/000742 priority patent/WO2022185721A1/ja
Priority to US18/279,866 priority patent/US20240149376A1/en
Priority to EP22762780.9A priority patent/EP4302917A4/en
Priority to KR1020237030305A priority patent/KR20230141857A/ko
Priority to TW111101547A priority patent/TWI830120B/zh
Publication of JP2022135789A publication Critical patent/JP2022135789A/ja
Publication of JP2022135789A5 publication Critical patent/JP2022135789A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2021035842A 2021-03-05 2021-03-05 レーザ加工装置 Pending JP2022135789A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2021035842A JP2022135789A (ja) 2021-03-05 2021-03-05 レーザ加工装置
PCT/JP2022/000742 WO2022185721A1 (ja) 2021-03-05 2022-01-12 レーザ加工装置
US18/279,866 US20240149376A1 (en) 2021-03-05 2022-01-12 Laser processing device
EP22762780.9A EP4302917A4 (en) 2021-03-05 2022-01-12 LASER TREATMENT DEVICE
KR1020237030305A KR20230141857A (ko) 2021-03-05 2022-01-12 레이저 가공장치
TW111101547A TWI830120B (zh) 2021-03-05 2022-01-13 雷射加工裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021035842A JP2022135789A (ja) 2021-03-05 2021-03-05 レーザ加工装置

Publications (2)

Publication Number Publication Date
JP2022135789A true JP2022135789A (ja) 2022-09-15
JP2022135789A5 JP2022135789A5 (enExample) 2023-12-15

Family

ID=83153947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021035842A Pending JP2022135789A (ja) 2021-03-05 2021-03-05 レーザ加工装置

Country Status (6)

Country Link
US (1) US20240149376A1 (enExample)
EP (1) EP4302917A4 (enExample)
JP (1) JP2022135789A (enExample)
KR (1) KR20230141857A (enExample)
TW (1) TWI830120B (enExample)
WO (1) WO2022185721A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7426656B2 (ja) * 2020-03-31 2024-02-02 パナソニックＩｐマネジメント株式会社 焦点距離調整装置及びレーザ加工装置
EP4306702A1 (en) * 2022-07-15 2024-01-17 Tonello S.r.l. Machine for the treatment of products
DE102024102233A1 (de) * 2024-01-26 2025-07-31 Compact Laser Solutions Gmbh Vorrichtung und verfahren zur (laser - ) materialbearbeitung und / oder - veränderung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008119719A (ja) * 2006-11-10 2008-05-29 Keyence Corp レーザ加工装置
JP2008296256A (ja) * 2007-05-31 2008-12-11 Sunx Ltd レーザ加工装置
JP2018126778A (ja) * 2017-02-09 2018-08-16 ファナック株式会社 レーザ加工ヘッドおよび撮影装置を備えるレーザ加工システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632248B2 (ja) 2005-08-30 2011-02-16 パナソニック電工Ｓｕｎｘ株式会社 レーザ加工装置
TWI496643B (zh) * 2012-11-30 2015-08-21 Ind Tech Res Inst 三維加工裝置
JP6631202B2 (ja) * 2015-11-30 2020-01-15 ブラザー工業株式会社 レーザ加工装置及びレーザ加工装置の制御方法
JP6626036B2 (ja) * 2017-04-18 2019-12-25 ファナック株式会社 測定機能を有するレーザ加工システム
WO2019093148A1 (ja) * 2017-11-07 2019-05-16 村田機械株式会社 レーザ加工機及び焦点調整方法
JP2020044553A (ja) * 2018-09-20 2020-03-26 ブラザー工業株式会社 レーザマーカ
JP7115973B2 (ja) * 2018-12-28 2022-08-09 株式会社キーエンス レーザ加工装置
CN110421253A (zh) * 2019-07-22 2019-11-08 廊坊西波尔钻石技术有限公司 激光扫描系统及具有其的激光雕刻系统
JP7270216B2 (ja) * 2019-08-23 2023-05-10 パナソニックＩｐマネジメント株式会社 レーザ加工装置、レーザ加工方法、および補正データ生成方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008119719A (ja) * 2006-11-10 2008-05-29 Keyence Corp レーザ加工装置
JP2008296256A (ja) * 2007-05-31 2008-12-11 Sunx Ltd レーザ加工装置
JP2018126778A (ja) * 2017-02-09 2018-08-16 ファナック株式会社 レーザ加工ヘッドおよび撮影装置を備えるレーザ加工システム

Also Published As

Publication number Publication date
TWI830120B (zh) 2024-01-21
KR20230141857A (ko) 2023-10-10
US20240149376A1 (en) 2024-05-09
WO2022185721A1 (ja) 2022-09-09
EP4302917A1 (en) 2024-01-10
EP4302917A4 (en) 2024-09-25
TW202235192A (zh) 2022-09-16

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