TWI830120B - 雷射加工裝置 - Google Patents

雷射加工裝置 Download PDF

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Publication number
TWI830120B
TWI830120B TW111101547A TW111101547A TWI830120B TW I830120 B TWI830120 B TW I830120B TW 111101547 A TW111101547 A TW 111101547A TW 111101547 A TW111101547 A TW 111101547A TW I830120 B TWI830120 B TW I830120B
Authority
TW
Taiwan
Prior art keywords
lens
laser light
laser
visible light
light
Prior art date
Application number
TW111101547A
Other languages
English (en)
Chinese (zh)
Other versions
TW202235192A (zh
Inventor
山崎直哉
Original Assignee
日商松下知識產權經營股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商松下知識產權經營股份有限公司 filed Critical 日商松下知識產權經營股份有限公司
Publication of TW202235192A publication Critical patent/TW202235192A/zh
Application granted granted Critical
Publication of TWI830120B publication Critical patent/TWI830120B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW111101547A 2021-03-05 2022-01-13 雷射加工裝置 TWI830120B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-035842 2021-03-05
JP2021035842A JP2022135789A (ja) 2021-03-05 2021-03-05 レーザ加工装置

Publications (2)

Publication Number Publication Date
TW202235192A TW202235192A (zh) 2022-09-16
TWI830120B true TWI830120B (zh) 2024-01-21

Family

ID=83153947

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111101547A TWI830120B (zh) 2021-03-05 2022-01-13 雷射加工裝置

Country Status (6)

Country Link
US (1) US20240149376A1 (enExample)
EP (1) EP4302917A4 (enExample)
JP (1) JP2022135789A (enExample)
KR (1) KR20230141857A (enExample)
TW (1) TWI830120B (enExample)
WO (1) WO2022185721A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7426656B2 (ja) * 2020-03-31 2024-02-02 パナソニックＩｐマネジメント株式会社 焦点距離調整装置及びレーザ加工装置
EP4306702A1 (en) * 2022-07-15 2024-01-17 Tonello S.r.l. Machine for the treatment of products
DE102024102233A1 (de) * 2024-01-26 2025-07-31 Compact Laser Solutions Gmbh Vorrichtung und verfahren zur (laser - ) materialbearbeitung und / oder - veränderung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008119719A (ja) * 2006-11-10 2008-05-29 Keyence Corp レーザ加工装置
TW201420243A (zh) * 2012-11-30 2014-06-01 Ind Tech Res Inst 三維加工裝置
WO2019093148A1 (ja) * 2017-11-07 2019-05-16 村田機械株式会社 レーザ加工機及び焦点調整方法
CN110421253A (zh) * 2019-07-22 2019-11-08 廊坊西波尔钻石技术有限公司 激光扫描系统及具有其的激光雕刻系统
JP2020044553A (ja) * 2018-09-20 2020-03-26 ブラザー工業株式会社 レーザマーカ
JP2020104156A (ja) * 2018-12-28 2020-07-09 株式会社キーエンス レーザ加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4632248B2 (ja) 2005-08-30 2011-02-16 パナソニック電工Ｓｕｎｘ株式会社 レーザ加工装置
JP5154145B2 (ja) * 2007-05-31 2013-02-27 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置
JP6631202B2 (ja) * 2015-11-30 2020-01-15 ブラザー工業株式会社 レーザ加工装置及びレーザ加工装置の制御方法
JP6464213B2 (ja) * 2017-02-09 2019-02-06 ファナック株式会社 レーザ加工ヘッドおよび撮影装置を備えるレーザ加工システム
JP6626036B2 (ja) * 2017-04-18 2019-12-25 ファナック株式会社 測定機能を有するレーザ加工システム
JP7270216B2 (ja) * 2019-08-23 2023-05-10 パナソニックＩｐマネジメント株式会社 レーザ加工装置、レーザ加工方法、および補正データ生成方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008119719A (ja) * 2006-11-10 2008-05-29 Keyence Corp レーザ加工装置
TW201420243A (zh) * 2012-11-30 2014-06-01 Ind Tech Res Inst 三維加工裝置
WO2019093148A1 (ja) * 2017-11-07 2019-05-16 村田機械株式会社 レーザ加工機及び焦点調整方法
JP2020044553A (ja) * 2018-09-20 2020-03-26 ブラザー工業株式会社 レーザマーカ
JP2020104156A (ja) * 2018-12-28 2020-07-09 株式会社キーエンス レーザ加工装置
CN110421253A (zh) * 2019-07-22 2019-11-08 廊坊西波尔钻石技术有限公司 激光扫描系统及具有其的激光雕刻系统

Also Published As

Publication number Publication date
KR20230141857A (ko) 2023-10-10
US20240149376A1 (en) 2024-05-09
WO2022185721A1 (ja) 2022-09-09
EP4302917A1 (en) 2024-01-10
EP4302917A4 (en) 2024-09-25
TW202235192A (zh) 2022-09-16
JP2022135789A (ja) 2022-09-15

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