KR20230141857A - 레이저 가공장치 - Google Patents

레이저 가공장치 Download PDF

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Publication number
KR20230141857A
KR20230141857A KR1020237030305A KR20237030305A KR20230141857A KR 20230141857 A KR20230141857 A KR 20230141857A KR 1020237030305 A KR1020237030305 A KR 1020237030305A KR 20237030305 A KR20237030305 A KR 20237030305A KR 20230141857 A KR20230141857 A KR 20230141857A
Authority
KR
South Korea
Prior art keywords
lens
laser light
laser
visible light
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020237030305A
Other languages
English (en)
Korean (ko)
Inventor
나오야 야마자키
Original Assignee
파나소닉 아이피 매니지먼트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파나소닉 아이피 매니지먼트 가부시키가이샤 filed Critical 파나소닉 아이피 매니지먼트 가부시키가이샤
Publication of KR20230141857A publication Critical patent/KR20230141857A/ko
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring device

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
KR1020237030305A 2021-03-05 2022-01-12 레이저 가공장치 Ceased KR20230141857A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-035842 2021-03-05
JP2021035842A JP2022135789A (ja) 2021-03-05 2021-03-05 レーザ加工装置
PCT/JP2022/000742 WO2022185721A1 (ja) 2021-03-05 2022-01-12 レーザ加工装置

Publications (1)

Publication Number Publication Date
KR20230141857A true KR20230141857A (ko) 2023-10-10

Family

ID=83153947

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237030305A Ceased KR20230141857A (ko) 2021-03-05 2022-01-12 레이저 가공장치

Country Status (6)

Country Link
US (1) US20240149376A1 (enExample)
EP (1) EP4302917A4 (enExample)
JP (1) JP2022135789A (enExample)
KR (1) KR20230141857A (enExample)
TW (1) TWI830120B (enExample)
WO (1) WO2022185721A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220111320A (ko) * 2020-03-31 2022-08-09 파나소닉 아이피 매니지먼트 가부시키가이샤 초점 거리 조정 장치 및 레이저 가공 장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4306702A1 (en) * 2022-07-15 2024-01-17 Tonello S.r.l. Machine for the treatment of products
DE102024102233A1 (de) * 2024-01-26 2025-07-31 Compact Laser Solutions Gmbh Vorrichtung und verfahren zur (laser - ) materialbearbeitung und / oder - veränderung

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007061843A (ja) 2005-08-30 2007-03-15 Sunx Ltd レーザ加工装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5021277B2 (ja) * 2006-11-10 2012-09-05 株式会社キーエンス レーザ加工装置
JP5154145B2 (ja) * 2007-05-31 2013-02-27 パナソニック デバイスＳｕｎｘ株式会社 レーザ加工装置
TWI496643B (zh) * 2012-11-30 2015-08-21 Ind Tech Res Inst 三維加工裝置
JP6631202B2 (ja) * 2015-11-30 2020-01-15 ブラザー工業株式会社 レーザ加工装置及びレーザ加工装置の制御方法
JP6464213B2 (ja) * 2017-02-09 2019-02-06 ファナック株式会社 レーザ加工ヘッドおよび撮影装置を備えるレーザ加工システム
JP6626036B2 (ja) * 2017-04-18 2019-12-25 ファナック株式会社 測定機能を有するレーザ加工システム
WO2019093148A1 (ja) * 2017-11-07 2019-05-16 村田機械株式会社 レーザ加工機及び焦点調整方法
JP2020044553A (ja) * 2018-09-20 2020-03-26 ブラザー工業株式会社 レーザマーカ
JP7115973B2 (ja) * 2018-12-28 2022-08-09 株式会社キーエンス レーザ加工装置
CN110421253A (zh) * 2019-07-22 2019-11-08 廊坊西波尔钻石技术有限公司 激光扫描系统及具有其的激光雕刻系统
JP7270216B2 (ja) * 2019-08-23 2023-05-10 パナソニックＩｐマネジメント株式会社 レーザ加工装置、レーザ加工方法、および補正データ生成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007061843A (ja) 2005-08-30 2007-03-15 Sunx Ltd レーザ加工装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220111320A (ko) * 2020-03-31 2022-08-09 파나소닉 아이피 매니지먼트 가부시키가이샤 초점 거리 조정 장치 및 레이저 가공 장치

Also Published As

Publication number Publication date
TWI830120B (zh) 2024-01-21
US20240149376A1 (en) 2024-05-09
WO2022185721A1 (ja) 2022-09-09
EP4302917A1 (en) 2024-01-10
EP4302917A4 (en) 2024-09-25
TW202235192A (zh) 2022-09-16
JP2022135789A (ja) 2022-09-15

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PA0105 International application

Patent event date: 20230905

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20250218

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20250423

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D