JP2021523565A5 - - Google Patents
Info
- Publication number
- JP2021523565A5 JP2021523565A5 JP2020562580A JP2020562580A JP2021523565A5 JP 2021523565 A5 JP2021523565 A5 JP 2021523565A5 JP 2020562580 A JP2020562580 A JP 2020562580A JP 2020562580 A JP2020562580 A JP 2020562580A JP 2021523565 A5 JP2021523565 A5 JP 2021523565A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- process chamber
- processing program
- fingerprint
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862668175P | 2018-05-07 | 2018-05-07 | |
| US62/668,175 | 2018-05-07 | ||
| PCT/US2019/026155 WO2019217015A1 (en) | 2018-05-07 | 2019-04-05 | Substrate deformation detection and correction |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021523565A JP2021523565A (ja) | 2021-09-02 |
| JP2021523565A5 true JP2021523565A5 (enExample) | 2022-04-13 |
| JP7364597B2 JP7364597B2 (ja) | 2023-10-18 |
Family
ID=68385479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020562580A Active JP7364597B2 (ja) | 2018-05-07 | 2019-04-05 | 基板の変形の検出と修正 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US10804125B2 (enExample) |
| JP (1) | JP7364597B2 (enExample) |
| KR (1) | KR102753315B1 (enExample) |
| CN (1) | CN112106179B (enExample) |
| SG (1) | SG11202010093QA (enExample) |
| TW (1) | TWI710038B (enExample) |
| WO (1) | WO2019217015A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112970090B (zh) * | 2018-10-30 | 2024-06-21 | 朗姆研究公司 | 用于等离子体处理工具的衬底状态检测 |
| US11437262B2 (en) * | 2018-12-12 | 2022-09-06 | Applied Materials, Inc | Wafer de-chucking detection and arcing prevention |
| US12386342B2 (en) * | 2022-05-11 | 2025-08-12 | Applied Materials, Inc. | Holistic analysis of multidimensional sensor data for substrate processing equipment |
| KR20240020964A (ko) * | 2022-08-09 | 2024-02-16 | 주식회사 테스 | 기판처리방법 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03228347A (ja) * | 1990-02-02 | 1991-10-09 | Hitachi Ltd | 半導体素子内部応力制御方式 |
| JPH09129528A (ja) * | 1995-11-02 | 1997-05-16 | Hitachi Ltd | 半導体装置の製造方法及びその装置 |
| US6455437B1 (en) * | 1999-04-07 | 2002-09-24 | Applied Materials Inc. | Method and apparatus for monitoring the process state of a semiconductor device fabrication process |
| US6996472B2 (en) * | 2000-10-10 | 2006-02-07 | The United States Of America As Represented By The Department Of Health And Human Services | Drift compensation method for fingerprint spectra |
| JP4060558B2 (ja) * | 2001-09-12 | 2008-03-12 | 株式会社日立製作所 | 欠陥検査方法及びその装置 |
| US7265382B2 (en) * | 2002-11-12 | 2007-09-04 | Applied Materials, Inc. | Method and apparatus employing integrated metrology for improved dielectric etch efficiency |
| JP5283961B2 (ja) * | 2008-04-24 | 2013-09-04 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| WO2009137940A1 (en) * | 2008-05-16 | 2009-11-19 | Mattson Technology Canada, Inc. | Workpiece breakage prevention method and apparatus |
| JP4575984B2 (ja) | 2009-02-12 | 2010-11-04 | 三井造船株式会社 | 原子層成長装置および薄膜形成方法 |
| US8817449B2 (en) | 2010-03-26 | 2014-08-26 | Ulvac, Inc. | Substrate holding device |
| JP2013046047A (ja) * | 2011-08-26 | 2013-03-04 | Toshiba Corp | 加熱装置および半導体装置の製造方法 |
| US10726231B2 (en) * | 2012-11-28 | 2020-07-28 | Invensense, Inc. | Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing |
| US10497747B2 (en) * | 2012-11-28 | 2019-12-03 | Invensense, Inc. | Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing |
| US10266802B2 (en) * | 2013-01-16 | 2019-04-23 | Orteron (T.O) Ltd. | Method for controlling biological processes in microorganisms |
| CA2896674C (en) * | 2013-02-08 | 2021-07-06 | Cornell University | Biomolecular processing platform and uses thereof |
| US9245768B2 (en) * | 2013-12-17 | 2016-01-26 | Applied Materials, Inc. | Method of improving substrate uniformity during rapid thermal processing |
| WO2015195272A1 (en) * | 2014-06-20 | 2015-12-23 | Applied Materials, Inc. | Methods for reducing semiconductor substrate strain variation |
| US20160329206A1 (en) * | 2015-05-08 | 2016-11-10 | Lam Research Corporation | Methods of modulating residual stress in thin films |
| US20160355947A1 (en) * | 2015-06-05 | 2016-12-08 | Sensor Electronic Technology, Inc. | Susceptor Heating For Epitaxial Growth Process |
| KR20170016681A (ko) * | 2015-08-04 | 2017-02-14 | 에스케이하이닉스 주식회사 | 레지스트레이션 제어된 포토마스크의 결함 검출 방법 |
| GB201615114D0 (en) * | 2016-09-06 | 2016-10-19 | Spts Technologies Ltd | A Method and system of monitoring and controlling deformation of a wafer substrate |
| JP6690488B2 (ja) | 2016-09-29 | 2020-04-28 | 株式会社リコー | 情報処理システム、閲覧制御方法、情報処理装置及びプログラム |
| JP7085824B2 (ja) | 2017-11-28 | 2022-06-17 | 東京エレクトロン株式会社 | 成膜方法 |
-
2019
- 2019-04-05 CN CN201980030330.6A patent/CN112106179B/zh active Active
- 2019-04-05 WO PCT/US2019/026155 patent/WO2019217015A1/en not_active Ceased
- 2019-04-05 SG SG11202010093QA patent/SG11202010093QA/en unknown
- 2019-04-05 US US16/377,010 patent/US10804125B2/en active Active
- 2019-04-05 KR KR1020207035052A patent/KR102753315B1/ko active Active
- 2019-04-05 JP JP2020562580A patent/JP7364597B2/ja active Active
- 2019-04-15 TW TW108113044A patent/TWI710038B/zh active
-
2020
- 2020-07-29 US US16/942,469 patent/US11417553B2/en active Active
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